公开(公告)号：JP2000058687A

公开(公告)日：2000-02-25

申请号：JP23640098

申请日：1998-08-07

Applicant: DAISHINKU CORP

Inventor： NAKAJIMA MIKIO ,  IIZUKA MINORU

IPC: H01L23/02 ,  H01L23/08 ,  H03H9/02

Abstract: PROBLEM TO BE SOLVED: To reduce exhaust gas at soldering, improve workability and avoid high temperature heating to a region except a bonding region of a package for an electronic component, by making solder a clad. SOLUTION: In a hermetically sealing lid 2, a peripheral bonding part (silver solder layer) 21 which corresponds to a peripheral metal layer 11 is formed on the lower surface of parent metal 20 of covar or the like. The joint 21 is formed by using a technique of rolling and made a so called clad. The clad joint 21 is, e.g. about 20 μm thick and the width corresponds to the width of the metal layer 11. As a result, a seal path having a width of 0.3 mm is formed, and an effective seal path having almost the same width is obtained by bonding. A high frequency heating method is used as a local heating method. A lid 2 is mounted on a ceramic package 1, and a collectively unified member is accommodated in a circular coil. The coil is arranged in the vicinity of only the position corresponding to the metal layer 11 and the joint 21 and made not to approach other parts of the ceramic package 1.

公开(公告)号：JPH09162323A

公开(公告)日：1997-06-20

申请号：JP34485095

申请日：1995-12-05

Applicant: DAISHINKU CORP

Inventor： NAKAJIMA MIKIO ,  IIZUKA MINORU

IPC: H01L21/60 ,  H01L23/12 ,  H03H9/02 ,  H03H9/19

Abstract: PROBLEM TO BE SOLVED: To prevent a decrease joining strength of a metal member such as support, etc., and in variations in the joining strength by a method wherein a connection electrode is formed in a condition that its part is embedded in a ceramic package. SOLUTION: A ceramic substrate 1 serving as a ceramic package is composed of rectangular alumina, and an alumina coat 2 is provided near its outer periphery. Inwardly of the alumina coat 2, connection electrodes 3, 4 are provided. A part of the connection electrodes 3, 4 is embedded in the ceramic package and the connection electrodes 3, 4 are 20μm or more in a thickness. Further, pressing is used as a method for embedding a part of the connection electrodes 3, 4. Thereby, a joining face of the ceramic package to a metallized face is increased and joining strength between the ceramic package and a metallized face is enhanced, so that joining strength of a metal member being a substance to be joined is stable.

公开(公告)号：JPH09153762A

公开(公告)日：1997-06-10

申请号：JP33817595

申请日：1995-11-30

Applicant: DAISHINKU CORP

Inventor： NAKAJIMA MIKIO ,  IIZUKA MINORU

IPC: H03H9/02 ,  H03H9/19

Abstract: PROBLEM TO BE SOLVED: To improve the bonding strength of a support by welding the support for the surface mounting type piezoelectric vibrator to a reinforcement plate. SOLUTION: Metallic plates 9, 10 are silver-brazed to an upper face of connection electrodes 3, 4 of a ceramic insulation board 1. Supports 5, 6 are welded onto the metallic plates 9, 10. The thickness of the metallic plates 9, 10 is desirably the thickness of the supports 5, 6 or over. Thus, the connection electrodes 3, 4 and the ceramic board 1 are not damaged at welding.

公开(公告)号：JP2001196485A

公开(公告)日：2001-07-19

申请号：JP2000003675

申请日：2000-01-12

Applicant: DAISHINKU CORP

Inventor： OKAMOTO YUKIHIRO ,  NAKAJIMA MIKIO

IPC: H01L23/02 ,  C23C4/06

Abstract: PROBLEM TO BE SOLVED: To provide a package for an electronic component and a piezoelectric vibrating device capable of keeping a practical level of reliability in hermetical sealing and improving electric characteristics even if the package is reduced in size. SOLUTION: A ceramic package 1 depressed in cross section includes a ceramic base body 10, a peripheral first metal layer 12 formed on a bank 10a around a depressed portion. A metal cover 2 for hermetical sealing has a peripheral metal film layer 21 corresponding to the peripheral first metal film layer 12 on the bottom surface of a metal base body 20 such as Kovar. The second metal film layer 21 is made of, for example, silver solder and has a thickness pf about 20 μm. The silver solder layer is formed by a spraying method. Bonding the metal cover 2 and the respective metal film layers are conducted by the same method as a seam welding.