公开(公告)号：US20180236630A1

公开(公告)日：2018-08-23

申请号：US15900140

申请日：2018-02-20

Applicant: Ebara Corporation

Inventor： Hozumi YASUDA ,  Itsuki KOBATA ,  Nobuyuki TAKAHASHI ,  Suguru SAKUGAWA ,  Nobuyuki TAKADA

IPC: B24B37/013 ,  B24B37/10 ,  B24B53/017

CPC classification number: B24B37/013 ,  B24B21/12 ,  B24B27/0084 ,  B24B37/105 ,  B24B37/107 ,  B24B53/017

Abstract: A polisher for locally polishing a substrate is provided. The polisher includes a polishing member having a processing surface that comes into contact with the substrate and is smaller than the substrate, a pressing mechanism for pressing the polishing member against the substrate, a first drive mechanism for imparting motion to the polishing member in a first motion direction parallel to a surface of the substrate, a second drive mechanism for imparting motion to the polishing member in a second motion direction perpendicular to the first motion direction and having a component parallel to the surface of the substrate, and a controller for controlling the action of the polisher.

公开(公告)号：US20170144267A1

公开(公告)日：2017-05-25

申请号：US15402703

申请日：2017-01-10

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Hozumi YASUDA ,  Keisuke NAMIKI ,  Osamu NABEYA ,  Shingo TOGASHI ,  Satoru YAMAKI ,  Shintaro ISONO

IPC: B24B37/30

CPC classification number: B24B37/30

Abstract: An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion, The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.

公开(公告)号：US20160368115A1

公开(公告)日：2016-12-22

申请号：US15163571

申请日：2016-05-24

Applicant: EBARA CORPORATION

Inventor： Hozumi YASUDA ,  Makoto FUKUSHIMA ,  Osamu Nabeya

IPC: B24B37/32 ,  B24B37/20

CPC classification number: B24B37/32 ,  B24B37/20

Abstract: A polishing apparatus which can allow easy replacement of a retainer ring and can allow the retainer ring to be secured to a drive ring without causing deformation of the retainer ring is disclosed. The polishing head includes a head body having a substrate contact surface, a drive ring coupled to the head body, and a retainer ring surrounding the substrate contact surface and coupled to the drive ring. A first screw thread is formed on the drive ring, a second screw thread, which engages with the first screw thread, is formed on the retainer ring. The second screw thread extends in a circumferential direction of the retainer ring.

Abstract translation: 公开了一种抛光装置，其可以容易地更换保持环，并且可以允许保持环固定到驱动环上而不引起保持环的变形。 抛光头包括具有基板接触表面的头本体，联接到头本体的驱动环和围绕基板接触表面并联接到驱动环的保持环。 第一螺纹形成在驱动环上，与保持环形成在第一螺纹上的第二螺纹。 第二螺纹在保持环的圆周方向上延伸。

公开(公告)号：US20150311097A1

公开(公告)日：2015-10-29

申请号：US14672003

申请日：2015-03-27

Applicant: EBARA CORPORATION

Inventor： Hiroshi YOSHIDA ,  Makoto FUKUSHIMA ,  Hozumi YASUDA

IPC: H01L21/67 ,  B24B37/10 ,  H01L21/306 ,  B24B37/34

CPC classification number: B24B37/10 ,  B24B37/345 ,  H01L21/02024 ,  H01L21/67219 ,  H01L21/67742

Abstract: A polishing apparatus capable of performing multi-stage polishing of a substrate, such as wafer, is disclosed. The polishing apparatus includes: a plurality of polishing tables each for supporting a polishing pad; a plurality of polishing heads each configured to press a substrate against the polishing pad; and a transporting device configured to transport the substrate to at least two of the plurality of polishing heads. The plurality of polishing heads have different structures.

Abstract translation: 公开了能够进行诸如晶片的基板的多阶段抛光的抛光装置。 抛光装置包括：多个用于支撑抛光垫的抛光台; 多个抛光头，每个抛光头都构造成将基板压靠在抛光垫上; 以及传送装置，其构造成将所述基板传送到所述多个抛光头中的至少两个。 多个抛光头具有不同的结构。

公开(公告)号：US20150202733A1

公开(公告)日：2015-07-23

申请号：US14599976

申请日：2015-01-19

Applicant: EBARA CORPORATION

Inventor： Hozumi YASUDA ,  Makoto FUKUSHIMA ,  Osamu NABEYA ,  Masahiko KISHIMOTO

IPC: B24B37/32 ,  H01L21/304 ,  B24B37/10

CPC classification number: B24B37/32 ,  B24B37/107

Abstract: A substrate holding apparatus and a polishing apparatus which can reduce vibrations of a top ring in its entirety by damping vibrations transmitted from a retaining ring to a top ring body is disclosed. The substrate holding apparatus includes a top ring body having a substrate holding surface configured to hold and press a substrate against a polishing surface, a retaining ring configured to surround the substrate and to contact the polishing surface, and a drive ring comprising a ring member configured to hold the retaining ring on a lower surface thereof, a central member disposed at a central part of the top ring body and supported by the top ring body, and a connecting portion configured to connect the ring member and the central member. The drive ring includes a first material and a second material having a modulus of longitudinal elasticity smaller than the first material.

Abstract translation: 公开了一种基板保持装置和抛光装置，其可以通过阻止从保持环传递到顶环体的振动来整体减小顶环的振动。 基板保持装置包括：顶环主体，具有基板保持面，被配置为将基板保持并压靠在研磨面上;保持环，被配置为围绕基板并接触抛光面;以及驱动环，其包括环状构件 将保持环保持在其下表面上，中心构件设置在顶环体的中心部分并由顶环体支撑，以及连接部分，其构造成连接环构件和中心构件。 驱动环包括第一材料和具有小于第一材料的纵向弹性模量的第二材料。

公开(公告)号：US20150093971A1

公开(公告)日：2015-04-02

申请号：US14563383

申请日：2014-12-08

Applicant: EBARA CORPORATION

Inventor： Makoto FUKUSHIMA ,  Katsuhide WATANABE ,  Hozumi YASUDA ,  Satoru YAMAKI

IPC: B24B37/10 ,  H01L21/683 ,  H01L21/67

CPC classification number: B24B37/005 ,  B24B37/015 ,  B24B37/10 ,  B24B37/30 ,  H01L21/67017 ,  H01L21/67092 ,  H01L21/6838

Abstract: A polishing is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to forma substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.

Abstract translation: 抛光用于将诸如半导体晶片的基板抛光到平面镜面。 抛光装置包括具有抛光表面的抛光台，配置成保持基板并将基板压靠在抛光表面上的基板保持装置和控制器。 基板保持装置包括：弹性膜，其构成为形成与基板接触的基板保持面，设置在弹性膜上方的载体，形成在弹性膜与载体之间的至少一个压力室，以及红外光检测器 被配置为测量来自弹性膜的热能。 控制器使用红外光检测器的测量值来计算弹性膜的温度的估计值。

公开(公告)号：US20230060135A1

公开(公告)日：2023-03-02

申请号：US17759932

申请日：2021-01-13

Applicant: EBARA CORPORATION

Inventor： Nobuyuki TAKADA ,  Hozumi YASUDA

IPC: H01L21/687 ,  B24B37/005 ,  B24B37/10 ,  B24B41/06 ,  H01L21/67 ,  B24B49/02 ,  H01L21/304 ,  H01L21/68 ,  H01L21/683

Abstract: A substrate processing apparatus includes a table, a pad holder, an elevating mechanism, and at least three centering mechanisms. The table is for supporting a substrate. The pad holder is for holding a polishing pad for polishing the substrate supported by the table. The elevating mechanism is for elevating the pad holder with respect to the substrate. The at least three centering mechanisms are for pushing the substrate supported by the table in a center direction of the table to position the substrate. The at least three centering mechanisms each include a rotation shaft arranged in a peripheral area of the table and a centering member mounted to the rotation shaft.

公开(公告)号：US20210193494A1

公开(公告)日：2021-06-24

申请号：US17126447

申请日：2020-12-18

Applicant: Ebara Corporation

Inventor： Nobuyuki TAKADA ,  Hozumi YASUDA

IPC: H01L21/68 ,  H01L21/66 ,  H01L21/306 ,  B24B37/20

Abstract: To improve uniformity in polishing of a polished surface of a substrate regardless of a tolerance of a diameter of the substrate. A substrate processing apparatus includes a table 100, a pad holder 226, a swing mechanism, a supporting member 300A, 300B, a measuring instrument 400, and a driving mechanism 320. The table 100 supports a substrate WF. The pad holder 226 holds a polishing pad 222. The polishing pad 222 polishes the substrate WF supported to the table 100. The swing mechanism swings the pad holder 226. The supporting member 300A, 300B supports the polishing pad 222 swung to outside the table 100 by the swing mechanism. The measuring instrument 400 is configured to measure a diameter of the substrate WF. The driving mechanism 320 adjusts a position of the supporting member 300A, 300B with respect to the substrate WF supported to the table 100 according to the diameter of the substrate WF measured by the measuring instrument 400.

公开(公告)号：US20170259395A1

公开(公告)日：2017-09-14

申请号：US15453442

申请日：2017-03-08

Applicant: Ebara Corporation

Inventor： Itsuki KOBATA ,  Katsuhide WATANABE ,  Hozumi YASUDA ,  Yuji YAGI ,  Nobuyuki TAKAHASHI ,  Koichi TAKEDA

IPC: B24B37/013 ,  B24B37/20 ,  B24B37/04

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B37/20

Abstract: One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises: a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

公开(公告)号：US20160176009A1

公开(公告)日：2016-06-23

申请号：US15055442

申请日：2016-02-26

Applicant: EBARA CORPORATION

Inventor： Hiroshi YOSHIDA ,  Makoto FUKUSHIMA ,  Hozumi YASUDA

IPC: B24B37/10 ,  H01L21/677 ,  H01L21/67 ,  B24B37/34

Abstract: A polishing apparatus capable of performing multi-stage polishing of a substrate, such as wafer, is disclosed. The polishing apparatus includes: a plurality of polishing tables each for supporting a polishing pad; a plurality of polishing heads each configured to press a substrate against the polishing pad; and a transporting device configured to transport the substrate to at least two of the plurality of polishing heads. The plurality of polishing heads have different structures.

Abstract translation: 公开了能够进行诸如晶片的基板的多阶段抛光的抛光装置。 抛光装置包括：多个用于支撑抛光垫的抛光台; 多个抛光头，每个抛光头都构造成将基板压靠在抛光垫上; 以及传送装置，其构造成将所述基板传送到所述多个抛光头中的至少两个。 多个抛光头具有不同的结构。