OUTPUT SIGNAL PROCESSING APPARATUS FOR EDDY CURRENT SENSOR

    公开(公告)号:US20220063056A1

    公开(公告)日:2022-03-03

    申请号:US17410099

    申请日:2021-08-24

    Abstract: An eddy current sensor has an exciting coil and a detection coil. A holding circuit holds reference data indicating a characteristic of an output signal output from the detection coil at a reference state and outputs the reference data at a state other than the reference state. A pseudo signal generating circuit generates and outputs a balance coil pseudo signal corresponding to the output signal output from the detection coil at the reference state from the reference data output from the holding circuit. A bridge circuit, at the state other than the reference state, receives the output signal output from the detection coil and the balance coil pseudo signal and outputs a bridge output signal corresponding to a difference between the output signal and the balance coil pseudo signal as a bridge output signal.

    SUBSTRATE PROCESSING APPARATUS, AND METHOD FOR SPECIFYING AREA TO BE PARTIALLY POLISHED BY SUBSTRATE PROCESSING APPARATUS

    公开(公告)号:US20200223027A1

    公开(公告)日:2020-07-16

    申请号:US16715403

    申请日:2019-12-16

    Abstract: To quickly grasp a film thickness distribution of a film to be processed on a substrate after CMP and realize high-speed substrate processing, an embodiment of the present invention provides a method for specifying an area to be partially polished by a partial polishing device in a substrate processing apparatus. The substrate processing apparatus includes a substrate polishing device that polishes an entire surface of a film to be processed formed on at least one surface of the substrate. The substrate polishing device includes a film thickness sensor. The substrate processing apparatus further includes the partial polishing device that further partially polishes the film to be processed of the substrate polished by the substrate polishing device. The method includes specifying an area to be partially polished by the partial polishing device based on film thickness distribution data of the film to be processed obtained from the film thickness sensor of the substrate polishing device.

    POLISHING APPARATUS AND METHOD
    3.
    发明申请
    POLISHING APPARATUS AND METHOD 审中-公开
    抛光装置和方法

    公开(公告)号:US20150093971A1

    公开(公告)日:2015-04-02

    申请号:US14563383

    申请日:2014-12-08

    Abstract: A polishing is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a substrate holding apparatus configured to hold the substrate and to press the substrate against the polishing surface, and a controller. The substrate holding apparatus includes an elastic membrane configured to forma substrate holding surface which is brought into contact with the substrate, a carrier provided above the elastic membrane, at least one pressure chamber formed between the elastic membrane and the carrier, and an infrared light detector configured to measure thermal energy from the elastic membrane. The controller calculates an estimate value of a temperature of the elastic membrane using a measured value of the infrared light detector.

    Abstract translation: 抛光用于将诸如半导体晶片的基板抛光到平面镜面。 抛光装置包括具有抛光表面的抛光台,配置成保持基板并将基板压靠在抛光表面上的基板保持装置和控制器。 基板保持装置包括:弹性膜,其构成为形成与基板接触的基板保持面,设置在弹性膜上方的载体,形成在弹性膜与载体之间的至少一个压力室,以及红外光检测器 被配置为测量来自弹性膜的热能。 控制器使用红外光检测器的测量值来计算弹性膜的温度的估计值。

    POLISHING MACHINE AND A POLISHING METHOD FOR A SUBSTRATE

    公开(公告)号:US20170259395A1

    公开(公告)日:2017-09-14

    申请号:US15453442

    申请日:2017-03-08

    CPC classification number: B24B37/013 B24B37/042 B24B37/20

    Abstract: One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises: a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.

    POLISHING APPARATUS
    10.
    发明申请
    POLISHING APPARATUS 审中-公开

    公开(公告)号:US20170252889A1

    公开(公告)日:2017-09-07

    申请号:US15599919

    申请日:2017-05-19

    CPC classification number: B24B37/005 B24B37/107 B24B49/16 B24B49/18

    Abstract: A polishing apparatus includes a table rotating motor configured to rotate a polishing table about its own axis, a top ring rotating motor configured to rotate a top ring about its own axis, a dresser configured to dress a polishing pad, and a pad-height measuring device configured to measure a height of the polishing pad. The polishing apparatus also includes a diagnostic device configured to calculate an amount of wear of the polishing pad from the height of the polishing pad and to determine the end of a life of the polishing pad based on the amount of the wear of the polishing pad, the torque or current of the table rotating motor, and the torque or current of the top ring rotating motor.

Patent Agency Ranking