-
公开(公告)号：US20250157979A1
公开(公告)日：2025-05-15
申请号：US18939887
申请日：2024-11-07
Inventor： Sang Jin KWON , Jong Jin LEE
Abstract: A reflow flip chip bonding tool apparatus is provided. The bonding tool apparatus includes a heater configured to heat air and a bonding tool body disposed on an upper surface of the chip, wherein a movement path is formed between a lower surface of the bonding tool body and the upper surface of the chip, the air heated by the heater heats the chip through non-contact convection heat transfer while flowing through the movement path, and a solder disposed between the lower surface of the chip and an electrode pad of the substrate is melted.
-
公开(公告)号：US20250120631A1
公开(公告)日：2025-04-17
申请号：US18821503
申请日：2024-08-30
Inventor： Mun Seob LEE , Sang Yun KIM , Chi Hoon KIM , Jong Jin LEE
IPC: A61B5/16 , A61B5/00 , G06T11/00 , G06V10/764 , G06V10/774 , G06V10/82 , G06V20/40 , G06V40/16 , G06V40/20 , G10L15/08 , G10L15/16 , G10L25/18 , G10L25/57 , G10L25/63 , G10L25/66 , G16H50/20
Abstract: Provided is an apparatus for diagnosing a disease, which includes an acquisition module configured to acquire multi-modal data including at least two types of data among text data, speech data, and image data related to each depression patient, a preprocessing module configured to visualize data that is not the image data among the multi-modal data and output image datasets including the image data among the multi-modal data and the visualized data, and a classification module configured to classify whether each depression patient has depression based on the image datasets.
-
公开(公告)号：US20220094138A1
公开(公告)日：2022-03-24
申请号：US17479496
申请日：2021-09-20
Inventor： Eun Kyu KANG , Jong Jin LEE , Dae Seon KIM , Eun Kyoung JEON , Sang Jin KWON , Won Bae KWON , Kwon Seob LIM , Soo Yong JUNG
IPC: H01S5/024 , G02B27/28 , H01S5/02257 , H01S5/02253 , H01S5/02255 , H04J14/02 , H04B10/40
Abstract: A structure and a manufacturing method of an optical transmission module, in which output light of each of a first optical transmission unit and a second optical transmission unit is combined into one and transmitted through an optical fiber. In order to manufacture the optical transmission module, the first optical transmission unit and the second optical transmission unit are separately manufactured using a wafer-level packaging process and then are stacked. As a result, emission of generated heat is divided into a first heat sink installed in the first optical transmission unit and a second heat sink installed in the second optical transmission unit so that better heat dissipation efficiency is achieved than a conventional optical transmission module. In addition, a mounting area may also be reduced to ½ of the conventional module.
-
公开(公告)号：US20210125975A1
公开(公告)日：2021-04-29
申请号：US17081536
申请日：2020-10-27
Inventor： Eun Kyu KANG , Jong Jin LEE , Sang Jin KWON , Won Bae KWON , Dae Seon KIM , Soo Yong JUNG
Abstract: Provided is a cooled optical transmission module device including a silicon wafer having a plurality of platform mounting grooves, each of which serves as a space for mounting in which an optical transmission platform therein, a thermoelectric cooler bonded to the platform mounting groove to transfer heat to outside, the optical transmission platform provided on the thermoelectric cooler and configured to output an optical signal by generating and reflecting the optical signal, a dielectric sub-mount bonded to the platform mounting groove of the silicon wafer and electrically connected to the mounted optical transmission platform, and a cover configured to cover the platform mounting groove of the silicon wafer and seal the platform mounting groove while providing an electric path.
-
公开(公告)号：US20180302636A1
公开(公告)日：2018-10-18
申请号：US15882352
申请日：2018-01-29
Inventor： Hong Yeon YU , Dae Seon KIM , Kwon-Seob LIM , Eun Kyoung JEON , Jong Jin LEE
Abstract: A method of mixing video bitstreams and an apparatus performing the method are disclosed. The method includes generating a mixed scalable video coding (SVC) bitstream by mixing a plurality of SVC bitstreams for each layer based on a screen configuration of a user device, extracting a single SVC bitstream corresponding to a single layer from the mixed SVC bitstream based on a reception environment of the user device, and transmitting the single SVC bitstream to the user device.
-
Patent Agency Ranking
公开(公告)号：US20170126317A1
公开(公告)日：2017-05-04
申请号：US15209399
申请日：2016-07-13
Inventor： Soo Yong JUNG , Jong Jin LEE , Hyun Seo KANG , Sei Hyoung LEE , Hee Seung KIM
CPC classification number: H04B10/2503 , H04B10/40 , H04B10/43 , H04B10/503
Abstract: Provided herein is a single module bi-directional optical transmitting and receiving system including a transmitter transmitting an optical signal by converting a down-signal, and obtaining an up-signal by converting y the optical signal that is received, and a receiver transmitting the optical signal by converting the up-signal, and obtaining the down-signal by converting the optical signal that is received, wherein the transmitter and the receiver include a single optical transmitting module including a monitor receiving module, transmit the optical signal through the single optical transmitting module, and receive the optical signal through the monitor receiving module.
-
公开(公告)号：US20240129035A1
公开(公告)日：2024-04-18
申请号：US18379008
申请日：2023-10-11
Inventor： Soo Yong JUNG , Jong Jin LEE
IPC: H04B10/40
CPC classification number: H04B10/40 , G02B6/3807
Abstract: Provided is a detachable light source supply apparatus in which a light source element, which has a high probability of failure among components of an optical transceiver, is separately disposed on the outside, to supply a light source to the optical transceiver. This detachable light source supply apparatus includes a detachable coupling part to the optical transceiver, and an optical input/output unit. The detachable coupling part and the optical input/output unit may be implemented with MPO type connectors. Depending on various wavelength standards, an external light source element may be a multi-channel light source element that emits light sources having different wavelengths. For the multi-channel light source element, a plurality of light emitter of a single wavelength may be used, and in other embodiments, a multi-channel light emitter that emits light sources having a plurality of different wavelengths may be used.
-
18.发明公开公开(公告)号：US20240094463A1
公开(公告)日：2024-03-21
申请号：US18465791
申请日：2023-09-12
Inventor： Dae Seon KIM , Jong Jin LEE
CPC classification number: G02B6/12019 , G02B6/122 , G02B7/004 , H01S3/0315
Abstract: The present disclosure is to provide a shape of a surface mount type optical module to be mounted on a surface of a system board or package submount, and is to provide a compact and lightweight optical module attachment/detachment apparatus that performs the mounting (attachment) and separation of the optical module in a confined space by automatically performing optical module loading/unloading, optical module alignment, and laser soldering to facilitate attachment and detachment of the optical module. The attachment/detachment apparatus includes a body frame; a fixing part for fixing the body frame to the board; a gripper for gripping the optical module; an aligning part for aligning the position of the optical module with respect to the board; and a laser part which irradiates a laser for non-contact bonding between the optical module and the board.
-
公开(公告)号：US20250158349A1
公开(公告)日：2025-05-15
申请号：US18827421
申请日：2024-09-06
Inventor： Eun Kyu KANG , Haechung KANG , Jong Jin LEE , Won-Bae KWON , Soo Yong JUNG , Sangjin KWON , Myunghwan KIM
IPC: H01S5/02253 , H01S5/02251 , H01S5/02315 , H01S5/40
Abstract: Provided is a lens curing device for a multi-channel optical module, which cures a lens after arranging the lens on multiple axes between a laser diode and an optical waveguide of the optical module for each channel, the lens curing device including a vacuum collet that picks up the lens, a driver that moves the vacuum collet that picks up the lens and disposes the moved vacuum collet at an arrangement position of a submount, and an optical fiber that is embedded in at least a portion of the vacuum collet while connected to an ultraviolet (UV) light source in a preset wavelength band and transmits light radiated from the UV light source to a UV epoxy applied to a lower end of the lens.
-
公开(公告)号：US20250093599A1
公开(公告)日：2025-03-20
申请号：US18883663
申请日：2024-09-12
Inventor： Won-Bae KWON , Eun Kyu KANG , Jong Jin LEE , Soo Yong JUNG , Haechung KANG , Sangjin KWON , Myunghwan KIM
IPC: G02B6/42
Abstract: An optical module assembly is provided. The optical module assembly includes an electric sub-assembly including a printed circuit board (PCB) and an electronic device mounted on the PCB and an optical module including an interposer including a transparent material, an optical sub-assembly accommodating optical components, and a cover covering an upper portion of the optical sub-assembly, wherein one end portion of the PCB is inserted into the optical sub-assembly through an inserting hole formed in a sidewall of the optical sub-assembly, and the optical components and a substrate electrode formed on a surface of the one end portion of the PCB are electrically connected to each other by the interposer.
-
-
-
-
-
-
-
-
-
Search Results
23
records
(took 0.031 seconds)
