OPTICAL TRANSCEIVER FOR HIGH-PRECISION BONDING OF FLEXIBLE PRINTED CIRCUIT BOARD AND CERAMIC FEED-THROUGH STRUCTURE AND PACKAGE STRUCTURE

    公开(公告)号:US20240106540A1

    公开(公告)日:2024-03-28

    申请号:US18328845

    申请日:2023-06-05

    CPC classification number: H04B10/40 H05K1/118 H05K2201/10121

    Abstract: An optical transceiver is provided. A transceiver optical sub-assembly included in the optical transceiver includes a package body, accommodating optical devices and including a front surface coupled to an optical signal terminal, and a feed-through structure closing a rear surface of the package body and an open portion provided at both side surfaces adjacent to the rear surface. A disposition portion where one end of a flexible printed circuit board (FPCB) is disposed is provided at a front surface of the feed-through structure. Feed-through electrodes bonded to FPCB electrodes provided at the one end of the FPCB are provided on a surface of the disposition portion. For precise alignment of the FPCB electrodes and the feed-through electrodes, a protrusion portion is provided at the one end of the FPCB, and an insertion groove into which the protrusion portion is inserted is formed in a front surface of the feed-through structure.

    OPTICAL MODULE
    4.
    发明申请

    公开(公告)号:US20170242208A1

    公开(公告)日:2017-08-24

    申请号:US15210476

    申请日:2016-07-14

    Abstract: There is provided an optical module. The optical module includes a light source, a wave guide to which beam output from the light source is input, a lens system configured to optically combining the light source and the wave guide, a first lens mount positioned between the light source and the lens system in an optical axis of the light source, a first adhesive configured to fix the lens system to the first lens mount, a second lens mount positioned between the wave guide and the lens system in the optical axis of the light source, and a second adhesive configured to fix the lens system to the second lens mount. Therefore, it is possible to precisely align light, to manufacture the optical module with small expenses, and to simplify processes and equipment.

    OPTICAL MODULE
    5.
    发明申请
    OPTICAL MODULE 有权
    光学模块

    公开(公告)号:US20160209609A1

    公开(公告)日:2016-07-21

    申请号:US14835134

    申请日:2015-08-25

    Inventor: Jong Jin LEE

    Abstract: An optical module includes: a circuit board having a surface in which an electronic element is mounted; an optical waveguide array in which a plurality of optical waveguides are formed; an optical element in which an optical signal that is transmitted and received from and to the optical waveguide is input and that is mounted at a side surface of the circuit board; and a connection member that connects the optical element and the electronic element, wherein a connection portion of a side surface of the circuit board in which the connection member is received has a curved shape.

    Abstract translation: 光学模块包括:具有安装有电子元件的表面的电路板; 形成多个光波导的光波导阵列; 其中输入从光波导传送和接收的光信号并安装在电路板的侧表面的光学元件; 以及连接所述光学元件和所述电子元件的连接部件,其中,所述电路基板的侧面的与所述连接部件接合的连接部具有弯曲形状。

    OPTICAL TRANSMITTER MODULE
    9.
    发明申请
    OPTICAL TRANSMITTER MODULE 有权
    光传输模块

    公开(公告)号:US20150155944A1

    公开(公告)日:2015-06-04

    申请号:US14554257

    申请日:2014-11-26

    Inventor: Jong Jin LEE

    Abstract: Provided is an optical transmitter module. The optical transmitter module includes a package including a lower substrate and a side substrate in which a through hole is formed, and a feed-through block coupled to the side substrate in which the through hole is formed. The feed-through block includes a feed-through substrate, at least one lead pin penetrating the feed-though substrate and coupled to the feed-though substrate, a base substrate formed to extend from the feed-through substrate in a direction in which the at least one lead pin is coupled, and a dielectric substrate formed between the at least one lead pin and the base substrate protruding from the feed-through substrate. Therefore, it is possible to improve the quality of a signal transmitted by the optical transmitter module.

    Abstract translation: 提供了一种光发射机模块。 光发射机模块包括:包括下基板和其中形成有通孔的侧基板的封装以及与形成通孔的侧基板连接的馈通块。 馈通块包括馈通衬底,至少一个引导引脚穿过馈通衬底并且耦合到馈通衬底,基底衬底形成为沿着馈通衬底沿着方向延伸 至少一个引脚被耦合,并且形成在从所述馈通基板突出的所述至少一个引脚和所述基底基板之间的电介质基板。 因此,可以提高由光发送模块发送的信号的质量。

    FEED THROUGH
    10.
    发明申请
    FEED THROUGH 审中-公开
    通过进入

    公开(公告)号:US20140138148A1

    公开(公告)日:2014-05-22

    申请号:US13842537

    申请日:2013-03-15

    Inventor: Jong Jin LEE

    CPC classification number: H02G3/22

    Abstract: Provided is a feed through. The feed through comprises: an optical device; a housing surrounding the optical device and having a first hole; a solder coupled into the first hole and having a plurality of second holes, each smaller than the first hole; and lead frames leading from the inside of the housing to the outside through the second holes and having a more reduced line width at the inside of the second holes than the outside thereof.

    Abstract translation: 提供了一个饲料。 馈电包括:光学装置; 围绕所述光学装置并具有第一孔的壳体; 焊料,其耦合到所述第一孔中并具有多个第二孔,每个第二孔小于所述第一孔; 以及通过第二孔从壳体的内部引导到外部的引线框架,并且在第二孔的内部具有比其外侧更多的线宽。

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