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公开(公告)号：US11450639B2
公开(公告)日：2022-09-20
申请号：US17163746
申请日：2021-02-01
Applicant: EPISTAR CORPORATION
Inventor： Shih-An Liao , Shau-Yi Chen , Ming-Chi Hsu , Chun-Hung Liu , Min-Hsun Hsieh
Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section view, and a distance from the first position to the first out contour is greater than that from the second position to the first outer contour.
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公开(公告)号：US11054088B2
公开(公告)日：2021-07-06
申请号：US16258281
申请日：2019-01-25
Applicant: EPISTAR CORPORATION
Inventor： Chiu-Lin Yao , Min-Hsun Hsieh , Been-Yu Liaw , Wei-Chiang Hu , Po-Hung Lai , Chun-Hung Liu , Shih-An Liao , Yu-His Sung , Ming-Chi Hsu
IPC: F21K9/00 , F21K9/235 , H01L25/075 , F21K9/232 , H01L33/54 , H01L33/62 , F21Y115/10 , F21Y107/10 , F21Y107/30
Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.
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Patent Agency Ranking
公开(公告)号：US10910335B2
公开(公告)日：2021-02-02
申请号：US16836441
申请日：2020-03-31
Applicant: EPISTAR CORPORATION
Inventor： Shih-An Liao , Shau-Yi Chen , Ming-Chi Hsu , Chun-Hung Liu , Min-Hsun Hsieh
Abstract: A light-emitting module includes a common carrier; a plurality of semiconductor devices formed on the common carrier, and each of the plurality of semiconductor devices including three semiconductor dies; a carrier including a connecting surface; a third bonding pad and a fourth bonding pad formed on the connecting surface; and a connecting layer. One of the three semiconductor dies includes a stacking structure; a first bonding pad; and a second bonding pad with a shortest distance less than 150 microns between the first bonding pad. The connecting layer includes a first conductive part including a first conductive material having a first shape; and a blocking part covering the first conductive part and including a second conductive material having a second shape with a diameter in a cross-sectional view. The first shape has a height greater than the diameter.
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公开(公告)号：US12119321B2
公开(公告)日：2024-10-15
申请号：US17947536
申请日：2022-09-19
Applicant: EPISTAR CORPORATION
Inventor： Shih-An Liao , Shau-Yi Chen , Ming-Chi Hsu , Chun-Hung Liu , Min-Hsun Hsieh
CPC classification number: H01L24/16 , H01L24/06 , H01L24/13 , H01L24/29 , H01L24/73 , H01L24/83 , H01L33/62 , H01L24/20 , H01L24/32 , H01L24/48 , H01L33/30 , H01L33/647 , H01L2224/04105 , H01L2224/0612 , H01L2224/13309 , H01L2224/13311 , H01L2224/13313 , H01L2224/13339 , H01L2224/13499 , H01L2224/16058 , H01L2224/16105 , H01L2224/16227 , H01L2224/165 , H01L2224/2929 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29499 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/83121 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2224/83862 , H01L2224/8388 , H01L2224/83886 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/12041 , H01L2924/15156 , H01L2224/29344 , H01L2924/00014 , H01L2224/29347 , H01L2924/00014 , H01L2224/29324 , H01L2924/00014 , H01L2224/29355 , H01L2924/00014 , H01L2224/29339 , H01L2924/00014 , H01L2224/29313 , H01L2924/00014 , H01L2224/29309 , H01L2924/00014 , H01L2224/29311 , H01L2924/01083 , H01L2924/01047 , H01L2224/29311 , H01L2924/01047 , H01L2924/01029 , H01L2224/2939 , H01L2924/00014 , H01L2224/294 , H01L2924/00014 , H01L2224/83203 , H01L2924/00012
Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section view, and a distance from the first position to the first out contour is greater than that from the second position to the first outer contour.
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公开(公告)号：USD865226S1
公开(公告)日：2019-10-29
申请号：US29611867
申请日：2017-07-26
Applicant: EPISTAR CORPORATION
Designer： Chun-Hung Liu , Chien-Liang Liu , Ming-Chi Hsu
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公开(公告)号：US10205070B2
公开(公告)日：2019-02-12
申请号：US15394951
申请日：2016-12-30
Applicant: EPISTAR CORPORATION
Inventor： Chien-Liang Liu , Ming-Chi Hsu , Shih-An Liao , Chun-Hung Liu , Zhi-Ting Ye , Cheng-Teng Ye , Po-Chang Chen , Sheng-Che Chiou
IPC: H01L33/20 , H01L33/38 , H01L33/50 , H01L33/60 , H01L25/07 , H01L25/075 , F21V8/00 , H01L33/00 , H01L33/48 , H01L33/62 , H01L21/56
Abstract: A light-emitting device includes a light-emitting structure with a side surface, and a reflective layer covering the side surface, and a light-transmitting body. The light-transmitting body encloses the light-emitting structure and has a first side surface, a second side surface, a third side surface and a fourth side surface. The reflective layer covers the first side surface and the third side surface without covering the second side surface and the fourth side surface. The light-emitting structure has a first light-emitting angle and a second light-emitting angle different from the first light-emitting angle.
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公开(公告)号：US10170440B2
公开(公告)日：2019-01-01
申请号：US15459310
申请日：2017-03-15
Applicant: EPISTAR CORPORATION
Inventor： Shih-An Liao , Shau-Yi Chen , Ming-Chi Hsu , Chun-Hung Liu , Min-Hsun Hsieh
Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad, and a second bonding pad on a top surface of the stacking structure, wherein a shortest distance between the first bonding pad and the second bonding pad is less than 150 μm; a carrier comprising a connecting surface; a third bonding pad and a fourth bonding pad on the connecting surface of the carrier; and a conductive connecting layer comprising a current conductive area between the first bonding pad and the third bonding pad and between the second bonding pad and the fourth bonding pad.
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