公开(公告)号：US11519564B2

公开(公告)日：2022-12-06

申请号：US17367820

申请日：2021-07-06

Applicant: EPISTAR CORPORATION

Inventor： Chiu-Lin Yao ,  Min-Hsun Hsieh ,  Been-Yu Liaw ,  Wei-Chiang Hu ,  Po-Hung Lai ,  Chun-Hung Liu ,  Shih-An Liao ,  Yu-His Sung ,  Ming-Chi Hsu

IPC: F21K9/00 ,  F21K9/235 ,  H01L25/075 ,  F21K9/232 ,  H01L33/54 ,  H01L33/62 ,  F21Y115/10 ,  F21Y107/10 ,  F21Y107/30

Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.

公开(公告)号：US11011681B2

公开(公告)日：2021-05-18

申请号：US14541680

申请日：2014-11-14

Applicant: EPISTAR CORPORATION

Inventor： Chien-Liang Liu ,  Ming-Chi Hsu ,  Shih-An Liao ,  Jen-Chieh Yu ,  Min-Hsun Hsieh ,  Jia-Tay Kuo ,  Yu-His Sung ,  Po-Chang Chen

IPC: H01L33/62 ,  H01L33/60 ,  H01L33/48 ,  H01L33/54 ,  H01L33/58 ,  H01L23/00 ,  H01L33/00

Abstract: The present application discloses a light-emitting device comprises a semiconductor light-emitting element, a transparent element covering the semiconductor light-emitting element, an insulating layer which connects to the transparent element, an intermediate layer which connects to the insulating layer; and a conductive adhesive material connecting to the intermediate layer.

公开(公告)号：US10222002B2

公开(公告)日：2019-03-05

申请号：US15605535

申请日：2017-05-25

Applicant: EPISTAR CORPORATION

Inventor： Chiu-Lin Yao ,  Min-Hsun Hsieh ,  Been-Yu Liaw ,  Wei-Chiang Hu ,  Po-Hung Lai ,  Chun-Hung Liu ,  Shih-An Liao ,  Yu-His Sung ,  Ming-Chi Hsu

IPC: F21K9/235 ,  H01L25/075 ,  F21K9/232 ,  H01L33/54 ,  H01L33/62 ,  F21Y115/10 ,  F21Y107/10 ,  F21Y107/30

Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.

公开(公告)号：US09664340B2

公开(公告)日：2017-05-30

申请号：US14301060

申请日：2014-06-10

Applicant: EPISTAR CORPORATION

Inventor： Chiu-Lin Yao ,  Min-Hsun Hsieh ,  Been-Yu Liaw ,  Wei-Chiang Hu ,  Po-Hung Lai ,  Chun-Hung Liu ,  Shih-An Liao ,  Yu-His Sung ,  Ming-Chi Hsu

IPC: F21K99/00 ,  H01L25/075 ,  F21K9/232 ,  H01L33/54 ,  H01L33/62 ,  F21Y115/10 ,  F21Y107/10 ,  F21Y107/30

CPC classification number: F21K9/235 ,  F21K9/232 ,  F21Y2107/10 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: This disclosure discloses a light-emitting device. The light-emitting device comprises: a first electrode part; a second electrode part; a third electrode part, spaced apart from the first electrode part and the second electrode part; and a light-emitting unit partially covering the first electrode part and the second electrode part and fully covering the second electrode part, the light-emitting unit having a conductive structure contacting the second electrode part.

公开(公告)号：US12272774B2

公开(公告)日：2025-04-08

申请号：US17322459

申请日：2021-05-17

Applicant: EPISTAR CORPORATION

Inventor： Chien-Liang Liu ,  Ming-Chi Hsu ,  Shih-An Liao ,  Jen-Chieh Yu ,  Min-Hsun Hsieh ,  Jia-Tay Kuo ,  Yu-Hsi Sung ,  Po-Chang Chen

IPC: H01L33/54 ,  H01L25/075 ,  H01L33/00 ,  H01L33/10 ,  H01L33/24 ,  H01L33/32 ,  H01L33/36 ,  H01L33/38 ,  H01L33/44 ,  H01L33/46 ,  H01L33/50 ,  H01L33/52

Abstract: The present application discloses a light-emitting device comprises a semiconductor light-emitting element, a transparent element covering the semiconductor light-emitting element, an insulating layer which connects to the transparent element, an intermediate layer which connects to the insulating layer; and a conductive adhesive material connecting to the intermediate layer.

公开(公告)号：US12154885B2

公开(公告)日：2024-11-26

申请号：US18450373

申请日：2023-08-15

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun Hsieh ,  Shih-An Liao ,  Ying-Yang Su ,  Hsin-Mao Liu ,  Tzu-Hsiang Wang ,  Chi-Chih Pu

IPC: H01L23/00 ,  B23K26/22 ,  B23K101/40 ,  H01L23/498 ,  H01L25/075 ,  H01L25/16

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

公开(公告)号：US11530804B2

公开(公告)日：2022-12-20

申请号：US17153050

申请日：2021-01-20

Applicant: EPISTAR CORPORATION

Inventor： Min-Hsun Hsieh ,  Ying-Yang Su ,  Shih-An Liao ,  Hsin-Mao Liu ,  Tzu-Hsiang Wang ,  Chi-Chih Pu

IPC: F21V23/00 ,  H01L25/075 ,  H01L33/62 ,  H01L25/16 ,  F21Y115/10

Abstract: A light-emitting device includes a first light-emitting module, a second light-emitting module, a conductive layer and an insulation layer. The first light-emitting module includes a first substrate having a first cavity, a first sidewall, and a light-emitting component disposed on the first substrate. The second module includes a second substrate having a second cavity corresponding to the first cavity and a second sidewall corresponding to the first sidewall. The conductive layer is directly connected to the first cavity and the second cavity and electrically connect the first light-emitting module and the second light-emitting module. The insulation layer is directly connected to the first sidewall and the second sidewall.

公开(公告)号：US10586902B2

公开(公告)日：2020-03-10

申请号：US16234066

申请日：2018-12-27

Applicant: EPISTAR CORPORATION

Inventor： Chien-Liang Liu ,  Ming-Chi Hsu ,  Shih-An Liao ,  Chun-Hung Liu ,  Zhi-Ting Ye ,  Cheng-Teng Ye ,  Po-Chang Chen ,  Sheng-Che Chiou

IPC: H01L33/10 ,  H01L33/20 ,  H01L33/38 ,  H01L33/50 ,  H01L33/60 ,  H01L25/07 ,  H01L25/075 ,  H01L33/00 ,  H01L33/48 ,  H01L33/62 ,  H01L21/56 ,  F21V8/00

Abstract: A light-emitting device includes a light-emitting structure with a side surface, and a reflective layer covering the side surface. The light-emitting structure has a first light-emitting angle and a second light-emitting angle. The difference between the first light-emitting angle and the second light-emitting angle is larger than 15°.

公开(公告)号：US10230033B2

公开(公告)日：2019-03-12

申请号：US15827549

申请日：2017-11-30

Applicant: EPISTAR CORPORATION

Inventor： Lung-Kuan Lai ,  Ching-Tai Cheng ,  Yih-Hua Renn ,  Min-Hsun Hsieh ,  Chun-Hung Liu ,  Shih-An Liao ,  Ming-Chi Hsu ,  Yu Chen Liao

IPC: H01L33/00 ,  H01L33/60 ,  F21V8/00 ,  H01L25/075 ,  H01L33/38 ,  H01L33/46 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62

Abstract: A light-emitting device includes a light body having an internal electrode layer, and a conductive layer. The conductive layer has a first portion formed on the internal electrode layer and overlapping the light body in a first direction, and a second portion overlapping the light body in a second direction. The first direction is perpendicular to the second direction.

公开(公告)号：US12119321B2

公开(公告)日：2024-10-15

申请号：US17947536

申请日：2022-09-19

Applicant: EPISTAR CORPORATION

Inventor： Shih-An Liao ,  Shau-Yi Chen ,  Ming-Chi Hsu ,  Chun-Hung Liu ,  Min-Hsun Hsieh

IPC: H01L23/48 ,  H01L23/00 ,  H01L33/62 ,  H01L33/30 ,  H01L33/64

CPC classification number: H01L24/16 ,  H01L24/06 ,  H01L24/13 ,  H01L24/29 ,  H01L24/73 ,  H01L24/83 ,  H01L33/62 ,  H01L24/20 ,  H01L24/32 ,  H01L24/48 ,  H01L33/30 ,  H01L33/647 ,  H01L2224/04105 ,  H01L2224/0612 ,  H01L2224/13309 ,  H01L2224/13311 ,  H01L2224/13313 ,  H01L2224/13339 ,  H01L2224/13499 ,  H01L2224/16058 ,  H01L2224/16105 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/12041 ,  H01L2924/15156 ,  H01L2224/29344 ,  H01L2924/00014 ,  H01L2224/29347 ,  H01L2924/00014 ,  H01L2224/29324 ,  H01L2924/00014 ,  H01L2224/29355 ,  H01L2924/00014 ,  H01L2224/29339 ,  H01L2924/00014 ,  H01L2224/29313 ,  H01L2924/00014 ,  H01L2224/29309 ,  H01L2924/00014 ,  H01L2224/29311 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2224/29311 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/2939 ,  H01L2924/00014 ,  H01L2224/294 ,  H01L2924/00014 ,  H01L2224/83203 ,  H01L2924/00012

Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section view, and a distance from the first position to the first out contour is greater than that from the second position to the first outer contour.