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    17.
    发明专利
    未知

    公开(公告)号：SE9900349D0

    公开(公告)日：1999-02-02

    申请号：SE9900349

    申请日：1999-02-02

    Applicant: ERICSSON TELEFON AB L M

    Inventor： LIGANDER PER ,  BERGSTEDT LEIF ROLAND ,  GEVORGIAN SPARTAK

    IPC: H05K1/02 ,  H05K1/16 ,  H05K

    Abstract: Method and arrangements for reducing crosstalk between conductors on a conductor carrier, and methods for manufacturing conductor carriers including these arrangements are presented. Crosstalk between the conductors is prevented by providing a dielectric material in the space between each conductor and an earth plane so that the electric field can be tied down within this space and thus prevent leakage of field lines to the co-lateral conductors. The capacitance is increased by an arrangement in the space immediately beneath the conductor so as to reduce the distance between conductors and the earth plane and/or through the medium of a dielectric material that has a higher dielectric index epsir than the dielectric material.

    18.
    发明专利
    未知

    公开(公告)号：DE69923205D1

    公开(公告)日：2005-02-17

    申请号：DE69923205

    申请日：1999-10-05

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  LIGANDER PER ,  BOUSTEDT KATARINA

    IPC: H05K1/18 ,  H05K3/38 ,  H05K3/46 ,  H05K1/03 ,  H05K1/16

    Abstract: Methods of manufacturing a printed board assembly. In one embodiment, a substrate is coated with an electrically conducting material; electrical components are mounted on some areas of the substrate; non-conducting material is disposed in areas between the electrical components; the substrate, electrical components and non-conducting material are sandwiched between two sheets of resin coated conducting foil, wherein the resin on the foils faces the substrate and buries the electrical components; circuit patterns are etched in the exposed surfaces of the resin coated conducting foils; and, electrical connections are established between at least one of the resin coated conducting foils and the electronic components.

    19.
    发明专利
    未知

    公开(公告)号：DE60012899D1

    公开(公告)日：2004-09-16

    申请号：DE60012899

    申请日：2000-01-14

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  LIGANDER PER ,  GEVORGIAN SPARTAK

    IPC: H05K1/02 ,  H05K1/16 ,  H05K3/32 ,  H01P3/08

    Abstract: Method and arrangements for reducing crosstalk between conductors on a conductor carrier, and methods for manufacturing conductor carriers including these arrangements are presented. Crosstalk between the conductors is prevented by providing a dielectric material in the space between each conductor and an earth plane so that the electric field can be tied down within this space and thus prevent leakage of field lines to the co-lateral conductors. The capacitance is increased by an arrangement in the space immediately beneath the conductor so as to reduce the distance between conductors and the earth plane and/or through the medium of a dielectric material that has a higher dielectric index epsir than the dielectric material.

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