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    AN ELECTRONIC ARRANGEMENT COMPRISING A COMPONENT CARRIER, A CARRIER FOR AN ELECTRONIC COMPONENT, AND A METHOD OF PRODUCING AN ELECTRONIC ARRANGEMENT
    7.
    发明申请
    AN ELECTRONIC ARRANGEMENT COMPRISING A COMPONENT CARRIER, A CARRIER FOR AN ELECTRONIC COMPONENT, AND A METHOD OF PRODUCING AN ELECTRONIC ARRANGEMENT 审中-公开
    一种包括组分载体的电子装置，一种用于电子组件的载体以及一种生产电子装置的方法

    公开(公告)号：WO0014788A3

    公开(公告)日：2000-07-20

    申请号：PCT/SE9901568

    申请日：1999-09-09

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  LIGANDER PER ,  BOUSTEDT KATARINA

    IPC: H01L23/13 ,  H01L21/52

    CPC classification number: H01L23/13 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    Abstract: Electronic arrangement (100) comprising a component carrier (110) with a first (111) and a second (112) main surface, in which component carrier a first aperture (120, 130) is arranged, the main direction of which extends from the first main surface towards the second main surface, and an electronic component (150, 160) which is arranged and retained in the aperture. The material of the component carrier (110) has essentially at least the same thermal expansion coefficient as the electronic component (150, 160), and the component carrier (110) can be used to retain the component in the aperture (120, 130). The extent of the aperture (120, 130) is the same as the extent of the component (150, 160) in a direction running between the main surfaces (111, 112) of the component carrier at right angles to the main surfaces. The component is positioned in the carrier (110) in such a manner that the extents of the component and the aperture in said direction coincide. The invention also relates to the component carrier and a method of producing the arrangement.

    Abstract translation: 电子装置（100），包括具有第一（111）和第二（112）主表面的部件载体（110），在该部件载体中布置第一孔（120,130），其主要方向从 朝向第二主表面的第一主表面以及布置并保持在孔中的电子部件（150,160）。 元件载体（110）的材料基本上具有与电子元件（150,160）至少相同的热膨胀系数，并且元件载体（110）可以用于将元件保持在孔（120,130）中， 。 孔（120,130）的范围与部件载体的主表面（111,112）之间在与主表面成直角的方向上延伸的部件（150,160）的范围相同。 部件以这样的方式定位在载体（110）中，使得部件和孔在所述方向上的范围重合。 本发明还涉及部件载体和生产该部件的方法。

    METHOD AND DEVICE FOR BURIED CHIPS
    9.
    发明申请
    METHOD AND DEVICE FOR BURIED CHIPS 审中-公开
    埋藏式芯片的方法和装置

    公开(公告)号：WO0017924A3

    公开(公告)日：2000-08-17

    申请号：PCT/SE9901643

    申请日：1999-09-21

    Applicant: ERICSSON TELEFON AB L M

    Inventor： BERGSTEDT LEIF ,  BOUSTEDT KATARINA ,  LIGANDER PER

    IPC: H01L23/13 ,  H01L23/24 ,  H05K3/32 ,  H01L21/60 ,  H01L23/12 ,  H01L23/52

    CPC classification number: H05K3/32 ,  H01L23/13 ,  H01L23/24 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011

    Abstract: A method for arranging one or more electronic components (100) on a carrier (200). The electronic components have a number of contact points (110) arranged on a first surface (120). The carrier has a second main surface (210) and a third main surface (220). In the carrier there are also arranged one or more first apertures (230) with a depth extending from the second main surface towards the third main surface. The method comprises the stages: arranging of connecting means (130) on the contact points, where the connecting means have a first end (140) connected to one of the contact points and a second end (150) at a distance from the contact point, arranging of the electronic components in the apertures in the carrier so that the connecting means are pointed away from the third main surface of the carrier, application of a dielectric layer (300) on the second main surface of the carrier, where the dielectric layer also covers the electronic component, exposure of the second end of the connecting means in the dielectric layer, and connection of the second end of the connecting means to circuit paths (310) arranged on the free surface of the dielectric layer.

    Abstract translation: 一种用于将一个或多个电子组件（100）布置在载体（200）上的方法。 电子部件具有布置在第一表面（120）上的多个接触点（110）。 载体具有第二主表面（210）和第三主表面（220）。 在载体中，还布置有一个或多个第一孔（230），其深度从第二主表面向第三主表面延伸。 该方法包括以下步骤：在接触点上布置连接装置（130），其中连接装置具有连接到接触点之一的第一端（140）和距离接触点一定距离的第二端（150） ，将电子元件布置在载体的孔中，使得连接装置远离载体的第三主表面，在载体的第二主表面上施加介电层（300），其中介电层 还覆盖电子元件，连接装置的第二端暴露在电介质层中，以及连接装置的第二端连接到布置在电介质层的自由表面上的电路路径（310）。

    Waveguide E-plane filter
    10.
    发明专利
    Waveguide E-plane filter 未知

    公开(公告)号：AU2015385189A1

    公开(公告)日：2017-08-10

    申请号：AU2015385189

    申请日：2015-03-01

    Applicant: ERICSSON TELEFON AB L M

    Inventor： LIGANDER PER ,  PERSSON OVE ,  BOLANDER LARS ,  DELENIV ANATOLI

    IPC: H01P1/207

    Abstract: It is provided a waveguide E-plane band-pass filter comprising a tubular, electrically conductive waveguide body. An electrically conductive foil is arranged in the waveguide body and extending along a longitudinal direction of the waveguide body, the foil comprising a plurality of resonator openings. Furthermore, the waveguide body comprises at least one ridge protruding from an inner wall of the waveguide body and extending longitudinally along the longitudinal direction of the waveguide body. The foil is in mechanical contact with said at least one ridge and arranged to divide an inner volume of the waveguide body into two portions. It is also provided a diplexer, a radio transceiver, and a method for filtering a signal using such a filter.

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