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11.
公开(公告)号:US09207708B2
公开(公告)日:2015-12-08
申请号:US14106666
申请日:2013-12-13
Applicant: FLIR Systems, Inc.
Inventor: Brian Simolon , Eric A. Kurth , Jim Goodland , Mark Nussmeier , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
CPC classification number: G06F1/14 , G01R23/00 , G06F1/04 , H04N5/2257 , H04N5/33 , H04N5/365 , H04N5/3765
Abstract: Various techniques are provided to detect abnormal clock rates in devices such as imaging sensor devices (e.g., infrared and/or visible light imaging devices). In one example, a device may include a clock rate detection circuit that may be readily integrated as part of the device to provide effective detection of an abnormal clock rate. The device may include a ramp generator, a counter, and/or other components which may already be implemented as part of the device. The ramp generator may generate a ramp signal independent of a clock signal provided to the device, while the counter may increment or decrement a count value in response to the clock signal. The device may include a comparator adapted to select the current count value of the counter when the ramp signal reaches a reference signal. A processor of the device may be adapted to determine whether the clock signal is operating in an acceptable frequency range, based on the selected count value.
Abstract translation: 提供各种技术来检测诸如成像传感器设备(例如,红外和/或可见光成像设备)的设备中的异常时钟速率。 在一个示例中,设备可以包括时钟速率检测电路,其可以容易地集成为设备的一部分,以提供异常时钟速率的有效检测。 该装置可以包括斜坡发生器,计数器和/或可以被实现为装置的一部分的其它部件。 斜坡发生器可以产生与提供给设备的时钟信号无关的斜坡信号,而计数器可以响应于时钟信号递增或递减计数值。 该装置可以包括比较器,适于在斜坡信号达到参考信号时选择计数器的当前计数值。 设备的处理器可以适于基于所选择的计数值来确定时钟信号是否在可接受的频率范围内操作。
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公开(公告)号:US20140092256A1
公开(公告)日:2014-04-03
申请号:US14092794
申请日:2013-11-27
Applicant: FLIR Systems, Inc.
Inventor: Brian Simolon , Eric A. Kurth , Steve Barskey , Mark Nussmeier , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
IPC: H04N5/33 , H01L27/146 , H04N5/359
CPC classification number: H04N5/33 , H01L27/1469 , H04N5/359 , H04N5/365
Abstract: Various techniques are provided for implementing, operating, and manufacturing infrared imaging devices using integrated circuits. In one example, a system includes a focal plane array (FPA) integrated circuit comprising an array of infrared sensors adapted to image a scene, a plurality of active circuit components, a first metal layer disposed above and connected to the circuit components, a second metal layer disposed above the first metal layer and connected to the first metal layer, and a third metal layer disposed above the second metal layer and below the infrared sensors. The third metal layer is connected to the second metal layer and the infrared sensors. The first, second, and third metal layers are the only metal layers of the FPA between the infrared sensors and the circuit components. The first, second, and third metal layers are adapted to route signals between the circuit components and the infrared sensors.
Abstract translation: 提供了使用集成电路实现,操作和制造红外成像装置的各种技术。 在一个示例中,系统包括焦平面阵列(FPA)集成电路,其包括适于对场景进行成像的红外传感器阵列,多个有源电路部件,设置在电路部件上方并连接到电路部件的第一金属层,第二 金属层,设置在第一金属层上方并连接到第一金属层,以及第三金属层,设置在第二金属层的上方和红外传感器的下方。 第三金属层连接到第二金属层和红外传感器。 第一,第二和第三金属层是红外传感器和电路部件之间的FPA的唯一金属层。 第一,第二和第三金属层适于在电路部件和红外传感器之间路由信号。
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