-
公开(公告)号：US10051210B2
公开(公告)日：2018-08-14
申请号：US14748873
申请日：2015-06-24
Applicant: FLIR Systems, Inc.
Inventor： Mark Nussmeier , Eric A. Kurth , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
IPC: H04N5/33 , H04N5/268 , H04N5/347 , H04N5/232 , H04N5/225 , H04N5/374 , H04N5/372 , G01J5/20 , G01J5/22 , G01J5/00
CPC classification number: H04N5/33 , G01J5/20 , G01J5/22 , G01J2005/0077 , G01J2005/202 , H04N5/2253 , H04N5/2257 , H04N5/23258 , H04N5/23293 , H04N5/268 , H04N5/347 , H04N5/372 , H04N5/374
Abstract: Various techniques are provided for binning (e.g., clustering or grouping) two or more infrared sensors of a focal plane array (FPA) to permit configuration of the FPA to various dimensions and/or pixel sizes. For example, according to one or more embodiments, switchable interconnects may be implemented within the FPA, wherein the switchable interconnects comprise a plurality of switches adapted to selectively connect or disconnect infrared sensors of the FPA to/from column lines, row lines, and between each other. The switchable interconnects may also comprise another set of switches adapted to selectively connect adjacent column lines together. By selectively opening and closing appropriate switches of the switchable interconnects, two or more neighboring infrared sensors may be binned together to form a binned detector. Advantageously, the binned detector, along with the array and associated circuitry, may provide increased sensitivity, reduced power consumption, and/or increased frame rate.
-
公开(公告)号：US10033944B2
公开(公告)日：2018-07-24
申请号：US15269905
申请日：2016-09-19
Applicant: FLIR Systems, Inc.
Inventor： Nicholas Högasten , Dwight Dumpert , Theodore R. Hoelter , Jeffrey S. Scott , Katrin Strandemar , Mark Nussmeier , Eric A. Kurth , Pierre Boulanger , Barbara Sharp
CPC classification number: H04N5/33 , G06K9/40 , H04N5/2257 , H04N5/262 , H04N5/265 , H04N5/3651
Abstract: Techniques using small form factor infrared imaging modules are disclosed. An imaging system may include visible spectrum imaging modules, infrared imaging modules, and other modules to interface with a user and/or a monitoring system. Visible spectrum imaging modules and infrared imaging modules may be positioned in proximity to a scene that will be monitored while visible spectrum-only images of the scene are either not available or less desirable than infrared images of the scene. Imaging modules may be configured to capture images of the scene at different times. Image analytics and processing may be used to generate combined images with infrared imaging features and increased detail and contrast. Triple fusion processing, including selectable aspects of non-uniformity correction processing, true color processing, and high contrast processing, may be performed on the captured images. Control signals based on the combined images may be presented to a user and/or a monitoring system.
-
公开(公告)号：US09900478B2
公开(公告)日：2018-02-20
申请号：US14281883
申请日：2014-05-19
Applicant: FLIR Systems, Inc.
Inventor： Michael Fox , Mark Nussmeier , Eric A. Kurth , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp , Jeffrey D. Frank , Andrew C. Teich , Dwight Dumpert , Gerald W. Blakeley
CPC classification number: H04N5/2252 , H04M1/0254 , H04M1/0264 , H04N5/23254 , H04N5/33 , H04N5/365 , H04N5/3651
Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.
-
公开(公告)号：US09819880B2
公开(公告)日：2017-11-14
申请号：US14136557
申请日：2013-12-20
Applicant: FLIR Systems, Inc.
Inventor： Nicholas Högasten , Mark Nussmeier , Eric A. Kurth , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
CPC classification number: H04N5/33 , H04N5/2257 , H04N5/23229 , H04N5/3651
Abstract: Various techniques are provided for systems and methods to process images to reduce consumption of an available output dynamic range by the sky in images. For example, according to one or more embodiments of the disclosure, a region or area in images that may correspond to the sky may be identified based on the location of the horizon in the images. A distribution of irradiance levels in the identified sky region may be analyzed to determine a dynamic range attributable to the sky region. A transfer function that compresses the dynamic range attributable to the sky region may be generated and applied so that the sky in the images may be suppressed, thereby advantageously preserving more dynamic range for terrestrial objects and other objects of interest in the images.
-
公开(公告)号：US09208542B2
公开(公告)日：2015-12-08
申请号：US14029683
申请日：2013-09-17
Applicant: FLIR Systems, Inc.
Inventor： Nicholas Högasten , Malin Ingerhed , Mark Nussmeier , Eric A. Kurth , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
CPC classification number: G06T5/002 , G06T2207/10016 , G06T2207/10048 , G06T2207/20182 , H04N5/33 , H04N5/3651 , H04N5/3658
Abstract: Methods and systems are provided to reduce noise in thermal images. In one example, a method includes receiving an image frame comprising a plurality of pixels arranged in a plurality of rows and columns. The pixels comprise thermal image data associated with a scene and noise introduced by an infrared imaging device. The image frame may be processed to determine a plurality of column correction terms, each associated with a corresponding one of the columns and determined based on relative relationships between the pixels of the corresponding column and the pixels of a neighborhood of columns. In another example, the image frame may be processed to determine a plurality of non-uniformity correction terms, each associated with a corresponding one of the pixels and determined based on relative relationships between the corresponding one of the pixels and associated neighborhood pixels within a selected distance.
Abstract translation: 提供了方法和系统来减少热图像中的噪音。 在一个示例中，一种方法包括接收包括以多个行和列排列的多个像素的图像帧。 像素包括与场景相关联的热图像数据和由红外成像装置引入的噪声。 可以处理图像帧以确定多个列校正项，每个列修正项与列中的相应列之一相关联，并且基于相应列的像素和列的邻域的像素之间的相对关系来确定。 在另一示例中，图像帧可以被处理以确定多个不均匀性校正项，每一个都与相应的一个像素相关联，并且基于所选择的像素中的相应一个像素和相关邻域像素之间的相对关系确定 距离。
-
Patent Agency Ranking
公开(公告)号：US20150319378A1
公开(公告)日：2015-11-05
申请号：US14747865
申请日：2015-06-23
Applicant: FLIR Systems, Inc.
Inventor： Theodore R. Hoelter , Joseph Kostrzewa , Pierre Boulanger , Barbara Sharp , Eric A. Kurth , Nicholas Högasten , Katrin Strandemar
CPC classification number: H04N5/33 , H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H04N5/3532 , H04N17/002 , H04N2101/00
Abstract: A shutter assembly may be provided for an infrared imaging module to selectively block external infrared radiation from reaching infrared sensors of the infrared imaging module. For example, the shutter assembly may comprise a paddle situated external to an optical element (e.g., lens) and adapted to be selectively moved by an actuator to substantially block external infrared radiation from entering the optical element. The shutter assembly may be stacked relative to a housing of the infrared imaging module without excessively increasing the overall profile of the infrared imaging module. A substantially reflective low emissivity interior surface may be provided on the paddle to reflect infrared radiation originating from an infrared sensor assembly of the infrared imaging module back to the infrared sensor assembly.
Abstract translation: 可以为红外成像模块提供快门组件，以选择性地阻挡外部红外辐射到达红外成像模块的红外传感器。 例如，快门组件可以包括位于光学元件（例如，透镜）外部的桨，并且适于被致动器选择性地移动以基本上阻挡外部红外辐射进入光学元件。 快门组件可以相对于红外成像模块的壳体堆叠，而不会过度增加红外成像模块的整体轮廓。 可以在桨上提供基本上反射的低发射率内表面，以将来自红外成像模块的红外传感器组件的红外辐射反射回红外传感器组件。
-
公开(公告)号：US20140184807A1
公开(公告)日：2014-07-03
申请号：US14106696
申请日：2013-12-13
Applicant: FLIR Systems, Inc.
Inventor： Brian Simolon , Eric A. Kurth , Mark Nussmeier , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
IPC: H04N5/33 , H01L27/146 , H04N5/378
CPC classification number: H04N5/33 , H01L27/14634 , H01L27/1469 , H04N5/2257 , H04N5/378
Abstract: Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.
Abstract translation: 提供了用于实现红外传感器的分段焦平面阵列（FPA）的各种技术。 在一个示例中，系统包括分段的FPA。 分段FPA包括具有红外传感器阵列（例如辐射热计）的顶模。 顶部管芯还可以包括读出集成电路（ROIC）的一部分。 分段FPA还包括具有至少一部分ROIC的底模。 顶部和底部管芯通过管芯间连接电耦合。 有利地，与常规FPA架构相比，分段FPA可以以更高的产量和更小的占用面积来制造。 此外，可以使用针对每个管芯的不同的半导体工艺来制造分段的FPA。
-
公开(公告)号：US20130258111A1
公开(公告)日：2013-10-03
申请号：US13901428
申请日：2013-05-23
Applicant: FLIR Systems, Inc.
Inventor： Jeffrey D. Frank , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Mao Zhenmei , Li Xiang
IPC: H04N5/33
CPC classification number: H04N5/33 , H04M1/0254 , H04M1/0264 , H04N5/23254 , H04N5/365 , H04N5/3651
Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the infrared image data to the user device. Infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device. The infrared image data may be transmitted to the user device via a device connector or a wireless connection.
Abstract translation: 公开了用于提供被配置为可释放地附接到移动电话或其他便携式电子设备并向其提供红外成像功能的设备附件的各种技术。 例如，设备附件可以包括在其后表面上具有桶以至少部分地接收用户设备的壳体，设置在壳体内并被配置为捕获红外图像数据的红外传感器组件以及通信耦合的处理模块 到红外传感器组件并且被配置为将红外图像数据传输到用户设备。 红外图像数据可以由红外传感器组件捕获并且由处理模块响应于由应用程序发送的请求或在用户设备上运行的其他软件/硬件例程而发送到用户设备。 红外图像数据可以经由设备连接器或无线连接被发送到用户设备。
-
公开(公告)号：US10122944B2
公开(公告)日：2018-11-06
申请号：US15645949
申请日：2017-07-10
Applicant: FLIR Systems, Inc.
Inventor： Mark Nussmeier , Eric A. Kurth , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
Abstract: Various techniques are provided for implementing an infrared imaging system. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors. The bias voltage is selected from a range of approximately 0.2 volts to approximately 0.7 volts. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.
-
公开(公告)号：US10079982B2
公开(公告)日：2018-09-18
申请号：US14245990
申请日：2014-04-04
Applicant: FLIR Systems, Inc.
Inventor： Pierre Boulanger , Per Elmfors , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Barbara Sharp , Eric A. Kurth
CPC classification number: H04N5/33 , H04N5/3651
Abstract: Various techniques are provided for using one or more shielded (e.g., blinded, blocked, and/or obscured) infrared sensors of a thermal imaging device. In one example, a method includes capturing a signal from a shielded infrared sensor that is substantially blocked from receiving infrared radiation from a scene. The method also includes capturing a signal from an unshielded infrared sensor configured to receive the infrared radiation from the scene. The method also includes determining an average thermographic offset reference for the shielded and unshielded infrared sensors based on the captured signal of the shielded infrared sensor. The method also includes determining an absolute radiometric value for the scene based on the average thermographic offset reference and the captured signal of the unshielded infrared sensor.
-
-
-
-
-
-
-
-
-
Search Results
93
records
(took 0.053 seconds)
