Abstract:
PROBLEM TO BE SOLVED: To provide a chemically amplified resist composition, from which a pattern can be formed that satisfies simultaneously demands for high sensitivity, high resolution (for example, high resolving power, superior pattern features and low line edge roughness (LER)), reduction of scum, improvement in dry etching durability, reduction of dependency on PEB temperature and improvement in PED stability in the formation of a fine pattern by exposure using electron beams or extreme UV rays, and to provide a resist film, a mask blank and a method for forming a resist pattern using the resist composition.SOLUTION: The chemically amplified resist composition comprises a compound (α) having a structural part (a) that is decomposed by irradiation with actinic rays or radiation to generate an acid, a phenolic hydroxyl group and an acid-crosslinking group.
Abstract:
PROBLEM TO BE SOLVED: To provide a chemically amplified resist composition, from which a pattern can be formed having high sensitivity, high resolution (for example, high resolving power, an excellent pattern profile and small line edge roughness (LER)), high stability with time, little production of scum and good dry etching durability, in particular, a chemically amplified resist composition, which shows a good balance between sensitivity and stability with time owing to an ester group included in an acid multiplication agent expressed by general formula (I), and which is excellent in improving sensitivity by generating a carboxylic acid when the acid multiplication agent is decomposed by an acid, and to provide a resist film, a resist coated mask blank, a method for forming a resist pattern and a photomask using the above composition.SOLUTION: The chemically amplified resist composition comprises (A) a compound expressed by general formula (I) and (B) a compound that generates an acid by irradiation with actinic rays or radiation. In general formula (I), Rto Reach represent a hydrogen atom or a substituent, and two or more in Rto Rmay be bonded to form a ring; Rrepresents a substituent; and A represents a monovalent organic group.
Abstract:
PROBLEM TO BE SOLVED: To provide: a chemically amplified positive resist composition which can satisfy high sensitivity, high resolving power, a preferable pattern cross-sectional shape and a preferable roughness property in forming an isolated line pattern; and a resist film, a resist coated mask blank, a resist pattern formation method, and a photomask which use the composition.SOLUTION: Provided is a chemically amplified positive resist composition containing: (A) a compound represented by the specified general formula (1); and (B) a compound having a phenolic hydroxyl group and a group which has a group represented by the specified general formula (2) or (3) substituted for a hydrogen atom of a phenolic hydroxyl group. Also provided are a resist film, a resist coated mask blank, a resist pattern formation method, and a photomask which use the composition. In the specified general formula (1), Z represents a monovalent organic group. In the specified general formulas (2) and (3), Qand Qrepresent an alkyl group or an aryl group.
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method, an actinic ray-sensitive or radiation-sensitive resin composition and a resist film, showing high sensitivity, high resolution and excellent line width roughness (LWR) in microprocessing such as formation of a fine pattern in a semiconductor element, particularly, in forming a negative type pattern by organic solvent development, and to provide a method for manufacturing an electronic device and an electronic device using the above method and the composition.SOLUTION: The pattern forming method includes: a step (1) of forming a film by using the following actinic ray-sensitive or radiation-sensitive resin composition; a step (2) of exposing the film by using actinic rays or radiation; and a step (4) of developing the film after exposure by using a developing solution containing an organic solvent to form a negative type pattern. The resin composition comprises: (A) a resin including an acid decomposable repeating unit and showing decrease in the solubility with a developing solution including an organic solvent by an action of an acid; (B) a compound that generates an acid by irradiation with actinic rays or radiation; (C) a compound that is decomposed by an action of an acid to generate an acid; and (D) a solvent. The present invention also discloses an actinic ray-sensitive or radiation-sensitive resin composition to be used for the above pattern forming method, a resist film formed by using the composition, and a method for manufacturing an electronic device and an electronic device using the above pattern forming method.