Abstract:
A method includes delivering current in parallel to a first resistive heating element, a second resistive heating element and a third resistive heating element during a first operating mode of a hot melt dispensing system, and delivering current in parallel to the first resistive heating element, the second resistive heating element and third and fourth resistive heating elements during a second operating mode of a hot melt dispensing system where the third and fourth resistive heating elements are arranged in series.
Abstract:
A hot melt system includes a melt system, a feed system, a dispensing system, and a pump. The melt system melts the pellets to produce a liquid, and the pump delivers the liquid to the dispensing system. The feed system is coordinated with the operation of the pump to control the amount of pellets delivered to the melt system.
Abstract:
A mix chamber for a plural component sprayer is configured to receive first and second component materials and emit a spray of a resulting plural component material. The mix chamber includes a chamber body extending between a first end and a second end and including flat lateral sides. A ramp feature is disposed proximate the first end and is configured to contact and push first and second side seals, respectively, away from a body axis as the mix chamber shifts in a first direction through a cartridge bore to increase a gap between the first side seal and the second side seal such that the first side seal engages the first flat lateral side and the second side seal engages the second flat lateral side.
Abstract:
A fluid cartridge for a plural component sprayer is configured to receive first and second component materials and purge air from the sprayer and provide the first and second component materials and purge air to a mix chamber for spraying. The fluid cartridge includes a cartridge body, material flowpaths extending from a second end to a cartridge bore, and a purge path extending from the second end to the cartridge bore. Fluid checks are disposed in the material flowpaths and purge path to prevent backflow out of the fluid cartridge. Side seals are disposed in the material paths and are pre-loaded to extend into the cartridge bore and engage a mix chamber within the cartridge bore.
Abstract:
First and second fluid components are individually pumped to a device from first and second pumps. A first volumetric flow rate of the first fluid component discharged from the first fluid component is measured. A second volumetric flow rate of the second fluid component discharged from the second pump is measured. Operation of at least one of the first and second pumps is controlled based on the measured first volumetric flow rate and the measured second volumetric flow rate to produce a target ratio of the first fluid component and the second fluid component at the device.
Abstract:
An adhesive melting system comprises a melter, an ultrasonic sensor, and a feed system. The melter contains and melts adhesive. The ultrasonic sensor is positioned to sense a level of adhesive in the melter. The feed system supplies unmelted adhesive to the melter as a function of the sensed level of adhesive in the melter.
Abstract:
Pivotably affixed to mast 12 at pivot 14 is boom arm 16. Pivotably attached to the distal end of boom arm 16 is extended arm 18 at swivel joint 20. Gusset 22 helps stabilize boom 24. The pivot points and components allow the operator to successfully fold the boom 24 into itself. The assembly 10 is held in position by two pins 26 and 28, which are inserted into the pivot points 30 and 32 located near the top of the boom arm 16 and along the gusset 22. A sleeve 34 slides over the gusset pivot point to add another level of strength and stability to the joint.
Abstract:
Off-the-shelf electronic packages eliminate the much of the need for hardware redesign for each product. The base unit has a base plastic housing and a power/communication board. The component module is comprised of a mid-section plastic housing, a common board, a component board, panels with connectors and a housing cover. The component board is unique board to each platform and could be, for example, a fluid control module, a low power temperature control module, a gateway module, a USB module, etc.