Abstract:
An ohmic RF MEMS relay includes a substrate with a capacitive coupling, C sub ; two actuating elements electrically coupled in series, so as to define a channel, wherein the actuating elements are configured to be independently actuated or simultaneously operated. The actuating elements have their own capacitive coupling, C gap ; a midpoint on the channel is in electrical communication with the actuating elements; and an anchor mechanically coupled to the substrate and supporting at least one of the actuating elements. Also, an ohmic RF MEMS relay that includes an input port; a plurality of first MEMS switches that make up a first switching group in electrical communication with the input port, thereby defining a plurality of channels each leading from each of the MEMS switches; and at least one outlet port along each of the channels distal from the first switching group and in electrical communication with the input port.
Abstract:
A microwave emitter (206) for use in a microwave sensor assembly (110) that includes an emitter body (300) includes a first arm (310) that extends radially outward from the emitter body. The first arm is at least partially non-linear and includes at least one peak (334) and at least one trough (336). The microwave emitter also includes a second arm (312) that extends radially outward from the emitter body. The second arm includes at least one peak and at least one trough. The first arm and the second arm generate an electromagnetic field when at least one microwave signal is received.
Abstract:
A filter package and method of manufacturing thereof is disclosed. The filter device (14) package (10, 12) includes a first dielectric layer (18) having an acoustic wave filter device (14) attached thereto, the acoustic wave filter device (14) comprising an active area (34) and I/O pads (30). The filter device (14) package (10, 12) also includes an adhesive (24) positioned between the first dielectric layer (18) and the acoustic wave filter device (14) to secure the layer to the device, vias (26) formed through the first dielectric layer (18) and the adhesive (24) to the I/O pads (30) of the acoustic wave filter device (14), and metal interconnects (28) formed in the vias (26) and mechanically and electrically coupled to the I/O pads (30) of the acoustic wave filter device (14) to form electrical interconnections thereto, wherein an air cavity (32) is formed in the adhesive (24) between the acoustic wave filter device (14) and the first dielectric layer (18), in a location adjacent the active area (34) of the acoustic wave filter device (14).
Abstract:
A sensor system (101) for determining a condition associated with a piston rod (106) of a reciprocating system (100) includes an interrogator system (204) having a first antenna (136). The sensor system further includes a second antenna (138) separated from the first antenna by an air gap distance (404). The second antenna is configured to be coupled to the piston rod of the reciprocating system. The second antenna is a patch antenna and is configured to communicate with the first antenna through a range of translational movement relative to the first antenna. The sensor system further includes a radio frequency sensor (140) coupled to the second antenna. The radio frequency sensor is configured to be coupled to the piston rod of the reciprocating system, measure a characteristic associated with the piston rod of the reciprocating system, and transmit data associated with the characteristic to the first antenna of the interrogator system through the second antenna.
Abstract:
A resonant sensor assembly includes a dielectric substrate having a sensing region. The sensor assembly further comprises a plurality of tuning elements operatively coupled to the sensing region, where the sensing region is coupled to the plurality of tuning elements to define a plurality of resonant circuits.
Abstract:
A sensor system 100 includes one or more rotor antennas 102 on a shaft 106 that moves within a stator bracket 112 one or more of around an axis 110 of the sensor system 100 or along the axis 110 of the sensor system 100, the one or more rotor antennas 102 configured to communicate sensed data with one or more stator antennas 104 on the stator bracket 112. Each rotor antenna 102 has a rotor signal trace 204 disposed on an outer rotor side 210 of a dielectric substrate 208 of the rotor antenna 102 and a rotor return trace 206 disposed on the outer rotor side 210 of the dielectric substrate 208, wherein the rotor signal trace 204 and the rotor return trace 206 are not concentric with respect to each other. The one or more rotor antennas 102 are configured to extend one or more of radially around an outer surface 116 of the shaft 106 of a sensor or along the outer surface 116 of the shaft 106 of the sensor.
Abstract:
A RF MEMS package includes a MEMS die assembly having a signal line formed on a top surface of a first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line.