公开(公告)号：US11437329B2

公开(公告)日：2022-09-06

申请号：US17070377

申请日：2020-10-14

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Johnatan A. Kantarovsky ,  Vibhor Jain ,  Siva P. Adusumilli ,  Ajay Raman ,  Sebastian T. Ventrone ,  Yves T. Ngu

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/522 ,  H01L49/02

Abstract: The present disclosure relates to integrated circuits, and more particularly, to an anti-tamper x-ray blocking package for secure integrated circuits and methods of manufacture and operation. In particular, the present disclosure relates to a structure including: one or more devices on a front side of a semiconductor material; a plurality of patterned metal layers under the one or more devices, located and structured to protect the one or more devices from an active intrusion; an insulator layer between the plurality of patterned metal layers; and at least one contact providing an electrical connection through the semiconductor material to a front side of the plurality of metals.