公开(公告)号：US10020420B2

公开(公告)日：2018-07-10

申请号：US15529602

申请日：2015-08-18

Applicant: Goertek.Inc

Inventor： Quanbo Zou ,  Zhe Wang

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/0095 ,  H01L24/95 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/62 ,  H01L2224/95 ,  H01L2933/0066

Abstract: A repairing method, manufacturing method, device and electronic apparatus of micro-LED are disclosed. The method for repairing micro-LED defects comprises: obtaining a micro-LED defect pattern on a receiving substrate; forming micro-LEDs (703b) corresponding to the defect pattern on a laser-transparent repair carrier substrate (707); aligning the micro-LEDs (703b) on the repair carrier substrate (707) with defect positions on the receiving substrate, and bringing the micro-LEDs (703b) into contact with pads at the defect positions; and irradiating the repair carrier substrate with a laser from the repair carrier substrate side, to lift-off the micro-LEDs from the repair carrier substrate (707).