公开(公告)号：US20210057477A1

公开(公告)日：2021-02-25

申请号：US16963291

申请日：2018-11-27

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Shin-ichiro TAKAGI ,  Yasuhito YONETA ,  Masaharu MURAMATSU ,  Nao INOUE ,  Hirokazu YAMAMOTO ,  Shinichi NAKATA ,  Takuo KOYAMA

IPC: H01L27/146 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

Abstract: A semiconductor device includes a support body including a mount region, a semiconductor chip disposed on the mount region with a predetermined distance therebetween, a bump disposed between the support body and the semiconductor chip, a wall portion disposed between the support body and the semiconductor chip along a part of an outer edge of the semiconductor chip, and an underfill resin layer disposed between the support body and the semiconductor chip. The underfill resin layer covers an outer side surface of the wall portion.

公开(公告)号：US20190109167A1

公开(公告)日：2019-04-11

申请号：US16152494

申请日：2018-10-05

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Nao INOUE ,  Ryosuke KOIKE ,  Haruyuki NAKAYAMA

IPC: H01L27/146

Abstract: A light detection device includes: a back-illuminated light receiving element; a circuit element; a connection member; an underfill; and a light shielding mask. The light shielding mask includes a frame having an opening and a light shielding layer formed on an inner surface of the opening. A first opening edge on the side of the circuit element in the opening is located at the outside of an outer edge of the light receiving element. A second opening edge opposite to the circuit element in the opening is located at the inside of the outer edge of the light receiving element. The opening is narrowed from the first opening edge toward the second opening edge. A width of the frame increases from the first opening edge toward the second opening edge. The underfill reaches a gap between the light receiving element and the light shielding layer.

公开(公告)号：US20180108625A1

公开(公告)日：2018-04-19

申请号：US15562004

申请日：2016-03-31

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Noburo HOSOKAWA ,  Nao INOUE ,  Katsumi SHIBAYAMA

IPC: H01L23/00 ,  H01L23/48 ,  H01L21/768

CPC classification number: H01L27/14687 ,  H01L21/3205 ,  H01L21/768 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/522 ,  H01L23/532 ,  H01L24/02 ,  H01L24/05 ,  H01L24/13 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14643 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02161 ,  H01L31/022408 ,  H01L31/103 ,  H01L31/107 ,  H01L2224/02313 ,  H01L2224/0233 ,  H01L2224/0235 ,  H01L2224/0236 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/02381 ,  H01L2224/0345 ,  H01L2224/05558 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/10126 ,  H01L2224/11 ,  H01L2224/12105 ,  H01L2224/13007 ,  H01L2224/13009 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2924/10253 ,  H01L2924/12043 ,  H01L2924/351 ,  H01L2924/00014

Abstract: A semiconductor device includes a semiconductor substrate in which a through hole is formed, a first wiring that is provided on a first surface of the semiconductor substrate, an insulating layer provided on an inner surface of the through hole and a second surface of the semiconductor substrate, and a second wiring that is provided on a surface of the insulating layer and electrically connected to the first wiring in an opening. The surface of the insulating layer includes a first region, a second region, a third region, a fourth region that is curved to continuously connect the first and the second regions, and a fifth region that is curved to continuously connect the second and the third regions. An average inclination angle of the second region is smaller than that of the first region and is smaller than that of the inner surface.

公开(公告)号：US20250022901A1

公开(公告)日：2025-01-16

申请号：US18714708

申请日：2022-09-09

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Nao INOUE ,  Shingo SHIMAI ,  Yosuke SUWA ,  Tatsuhiro KOMATSU

IPC: H01L27/146 ,  H01L25/00 ,  H01L25/065 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0224 ,  H01L33/36 ,  H01L33/56 ,  H01L33/62

Abstract: An optical semiconductor package includes a first chip, a second chip, a first resin portion formed to cover a side surface of the first chip, a second resin portion formed to cover a side surface of the second chip, a first terminal provided on a first inner surface of the first chip, a second terminal provided on a second inner surface of the second chip, and a first wiring electrically connected to the first terminal, passing through an inside of the first resin portion, and extending from a first inner surface side to a first outer surface side of the first chip in a facing direction in which the first inner surface and the second inner surface face each other. The second chip is an optical element. The first resin portion and the second resin portion are integrally provided or continuously provided via another member.

公开(公告)号：US20210387852A1

公开(公告)日：2021-12-16

申请号：US17288250

申请日：2019-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Daiki SUZUKI ,  Nao INOUE ,  Katsumi SHIBAYAMA

IPC: B81B3/00 ,  B81C1/00 ,  G02B26/08

Abstract: The damascene wiring structure includes a base including a main surface provided with a groove, an insulating layer including a first portion provided on an inner surface of the groove and a second portion provided on the main surface, a metal layer provided on the first portion, a wiring portion embedded in the groove, and a cap layer provided to cover the second portion, an end portion of the metal layer, and the wiring portion. A surface of a boundary part between the first portion and the second portion includes an inclined surface inclined with respect to a direction perpendicular to the main surface. The end portion of the metal layer enters between the cap layer and the inclined surface, and in the end portion, a first surface along the cap layer and a second surface along the inclined surface form an acute angle.

公开(公告)号：US20200049974A1

公开(公告)日：2020-02-13

申请号：US16492672

申请日：2018-03-14

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tatsuya SUGIMOTO ,  Kyosuke KOTANI ,  Tomofumi SUZUKI ,  Katsumi SHIBAYAMA ,  Noburo HOSOKAWA ,  Nao INOUE ,  Masashi ITO ,  Yutaka KURAMOTO

IPC: G02B26/06 ,  G01J3/45 ,  G01N21/35 ,  G02B26/08 ,  B81B3/00 ,  G02B6/35

Abstract: A light module includes an optical element and a base on which the optical element is mounted. The optical element has an optical portion which has an optical surface; an elastic portion which is provided around the optical portion such that an annular region is formed; and a pair of support portions which is provided such that the optical portion is sandwiched in a first direction along the optical surface and in which an elastic force is applied and a distance therebetween is able to be changed in accordance with elastic deformation of the elastic portion. The base has a main surface, and a mounting region in which an opening communicating with the main surface is provided. The support portions are inserted into the opening in a state where an elastic force of the elastic portion is applied.