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    THIN OPTOELECTRONIC MODULES WITH APERTURES AND THEIR MANUFACTURE
    11.
    发明申请
    THIN OPTOELECTRONIC MODULES WITH APERTURES AND THEIR MANUFACTURE 审中-公开
    薄型光电子模块及其制造

    公开(公告)号：WO2017146645A1

    公开(公告)日：2017-08-31

    申请号：PCT/SG2017/050078

    申请日：2017-02-21

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

    Inventor： YU, Qichuan ,  RUDMANN, Hartmut ,  WANG, Ji ,  NG, Kian Siang ,  GUBSER, Simon ,  EILERTSEN, James ,  GNANA SAMBANDAM, Sundar Raman

    IPC: G01S7/481 ,  H01L31/00 ,  H01L51/44 ,  H01L23/28 ,  H01L33/52 ,  H01L25/16

    CPC classification number: G01S7/481 ,  G01S17/02 ,  G01S17/026 ,  H01L25/16 ,  H01L31/00 ,  H01L33/54 ,  H01L33/58 ,  H01L51/44 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/1815 ,  H01L2933/005 ,  H01L2924/00014

    Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

    Abstract translation: 晶圆级制造方法使得可以制造诸如光电模块的超薄光学装置。 对包括有源光学元件和晶圆尺寸衬底的初始晶圆进行清晰的封装。 其中，产生包括孔的可光结构化不透明涂层。 然后，产生穿过透明封装并建立中间产品侧壁的沟槽。 然后，将不透明封装施加到中间产品上，从而填充沟槽。 通过切割存在于沟槽中的不透明封装材料，产生经分割的光学模块，其中中间产品的侧壁被不透明封装材料覆盖。 在大多数工艺步骤中，晶圆尺寸的基板可以连接到刚性载体晶圆上。

    OPTICAL MODULE, IN PARTICULAR OPTO-ELECTRONIC MODULE, AND METHOD OF MANUFACTURING THE SAME
    15.
    发明申请
    OPTICAL MODULE, IN PARTICULAR OPTO-ELECTRONIC MODULE, AND METHOD OF MANUFACTURING THE SAME 审中-公开
    光学模块，特别是光电模块及其制造方法

    公开(公告)号：WO2014014413A1

    公开(公告)日：2014-01-23

    申请号：PCT/SG2013/000285

    申请日：2013-07-09

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

    Inventor： RUDMANN, Hartmut ,  ROSSI, Markus

    IPC: G02B7/02 ,  H01L31/0232 ,  H01L27/14

    CPC classification number: F21V7/0033 ,  F21V13/02 ,  G01J1/0271 ,  G01J1/0407 ,  G02B5/10 ,  G02B7/003 ,  G02B7/021 ,  G02B7/182 ,  G02B17/023 ,  G02B27/4244 ,  H01L27/14601 ,  H01L31/02325 ,  Y10T29/49826

    Abstract: The optical module (1) comprises - a first member (O) having a first face (F1) which is substantially planar; - a second member (P) having a second face (F2) facing the first face (F1), which is substantially planar and is aligned substantially parallel to the first face; - a third member (S) comprised in the first member (O) or comprised in the second member (P) or distinct from and located between these, which comprises an opening (4); - a mirror element (31'; 31''') present on the second face (F2); and - an active optical component (26) present on the second face (F2) and electrically connected to the second member (P); wherein at least one of the first and second members comprises one or more transparent portions (t) through which light can pass. The method for manufacturing the optical module (1) comprises the steps of a) providing a first wafer; b) providing a second wafer on which the mirror elements (31'...) are present; c) providing a third wafer, wherein the third wafer is comprised in the first wafer or is comprised in the second wafer or is distinct from these, and wherein the third wafer comprises openings (4); e) forming a wafer stack comprising these wafers; wherein at least one of the first wafer and the second wafer comprises transparent portions (t) through which light can pass.

    Abstract translation: 光学模块（1）包括 - 具有大致平面的第一面（F1）的第一构件（O） - 第二构件（P），其具有面向所述第一面（F1）的第二面（F2），所述第二面基本上是平面的并且基本上平行于所述第一面排列; - 包括在所述第一构件（O）中或包括在所述第二构件（P）中的第三构件（S）或与所述第一构件（O）不同并位于其中的第三构件（S），其包括开口（4）; - 存在于所述第二面（F2）上的镜子元件（31'; 31“）; 和 - 存在于所述第二面（F2）上并电连接到所述第二构件（P）的有源光学部件（26）; 其中所述第一和第二构件中的至少一个包括光可以通过的一个或多个透明部分（t）。 制造光学模块（1）的方法包括以下步骤：a）提供第一晶片; b）提供其上存在镜元件（31'）的第二晶片; c）提供第三晶片，其中所述第三晶片包括在所述第一晶片中或包含在所述第二晶片中或与所述第三晶片不同，并且其中所述第三晶片包括开口（4）; e）形成包括这些晶片的晶片堆叠; 其中所述第一晶片和所述第二晶片中的至少一个包括光可以通过的透明部分（t）。

    OPTO-ELECTRONIC MODULE AND METHOD FOR MANUFACTURING THE SAME
    16.
    发明申请
    OPTO-ELECTRONIC MODULE AND METHOD FOR MANUFACTURING THE SAME 审中-公开

    公开(公告)号：WO2013020238A1

    公开(公告)日：2013-02-14

    申请号：PCT/CH2012/000178

    申请日：2012-08-02

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD. ,  RUDMANN, Hartmut ,  BARGE, Michel

    Inventor： RUDMANN, Hartmut ,  BARGE, Michel

    IPC: H01L25/16 ,  H01L27/146

    CPC classification number: H01L33/486 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14685 ,  H01L31/02327 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12044 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A method for manufacturing a device (1) is suggested. The device comprises at least one opto-electronic modul (1), and the method comprises creating a wafer stack (2) comprising a substrate wafer (PW), and an optics wafer (OW); wherein a multitude of active optical components (E) is mounted on the substrate wafer (PW), and the optics wafer (OW) comprises a multitude of passive optical components (L). Each of the optoelectronic modules (1) comprises at least one of the active optical components (E) and at least one of the passive optical components (L). The optics wafer (OW) can comprise at least one portion, referred to as blocking portion, which is at least substantially non- transparent for at least a specific wavelength range, and at least one other portion, referred to as transparent portion, which is at least substantially non-transparent for at least said specific wavelength range. 11.The opto-electronic module comprises a substrate member; an optics member; at least one active optical component mounted on said subtrate member; and at least one passive optical component comprised in said optics member. The optics member (OW) is directly or indirectly fixed to said substrate member (PW). The opto-electronic modules (1) can have an excellent manufacturability while being small in dimension and having a high alignment accuracy.

    Abstract translation: 提出了一种制造装置（1）的方法。 该装置包括至少一个光电子模块（1），并且该方法包括产生包括衬底晶片（PW）和光学晶片（OW）的晶片堆叠（2）。 其中多个有源光学部件（E）安装在所述基板晶片（PW）上，并且所述光学晶片（OW）包括多个无源光学部件（L）。 每个光电子模块（1）包括有源光学部件（E）和至少一个无源光学部件（L）中的至少一个。 光学晶片（OW）可以包括至少一个部分，称为阻挡部分，其至少在特定波长范围内至少基本上不透明，并且至少一个称为透明部分的其它部分 至少基本上不透明至少所述特定波长范围。 光电模块包括衬底构件; 光学元件; 至少一个有源光学部件安装在所述减速部件上; 以及包括在所述光学元件中的至少一个无源光学元件。 光学构件（OW）直接或间接地固定到所述衬底构件（PW）上。 光电模块（1）可以具有优异的可制造性，同时尺寸小并且具有高对准精度。

    OPTOELECTRONIC MODULE ASSEMBLY AND MANUFACTURING METHOD
    18.
    发明申请
    OPTOELECTRONIC MODULE ASSEMBLY AND MANUFACTURING METHOD 审中-公开
    光电模块组装及制造方法

    公开(公告)号：WO2017164819A1

    公开(公告)日：2017-09-28

    申请号：PCT/SG2017/050148

    申请日：2017-03-23

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

    Inventor： BALIMANN, Martin Lukas ,  GLOOR, Matthias ,  BOUCHILLOUX, Philippe ,  ALASIRNIÖ, Jukka ,  RUDMANN, Hartmut ,  SPRING, Nicola

    IPC: H01L31/0232 ,  H01L33/48 ,  H01L27/146

    Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.

    Abstract translation: 光电子模块组件包括光电子模块。 该模块包括：安装衬底中或安装衬底上的有源光电子器件，光学子组件以及设置在安装衬底和光学子组件之间的间隔物，以便在有源光电子器件和光学子组件之间建立特定的距离 分总成。 光电子模块组件还包括包括第一表面和第二表面的凹陷基板，其中第二表面在比第一表面更靠近光学子组件的平面内。 光电模块安装在第一表面上。 第二个表面用于安装其他组件。

    WAFER-LEVEL OPTICAL DEVICE HAVING LIGHT GUIDE PROPERTIES
    19.
    发明申请
    WAFER-LEVEL OPTICAL DEVICE HAVING LIGHT GUIDE PROPERTIES 审中-公开
    具有轻型导光性能的水平光学装置

    公开(公告)号：WO2017039535A1

    公开(公告)日：2017-03-09

    申请号：PCT/SG2016/050410

    申请日：2016-08-24

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

    Inventor： SPRING, Nicola ,  RUDMANN, Hartmut ,  ROSSI, Markus

    IPC: G02B6/10 ,  B81B7/02 ,  G02B5/04 ,  G02B5/08 ,  G02B6/12 ,  G02B6/42 ,  G02B7/18 ,  G02B23/08 ,  G02F1/295 ,  H01L31/0232 ,  H01L33/60 ,  H05K1/03

    CPC classification number: B81B7/02 ,  G02B6/00 ,  G02B6/10 ,  G02B6/12 ,  G02B6/42 ,  G02B19/0028 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H05K1/03

    Abstract: An optical device (1) includes two prism bodies (41, 42) and four side panels (71-74) attached to both prism bodies (41, 42). A cavity (9) is thereby enclosed. A first reflector (81) can be present at a first side face (81) of the first prism body (41), and a second reflector (82) can be present at a second side face (82) of the second prism body (42). At least one of the prism bodies (41, 42) and/or at least one of the side panels (71-74) can be at least in part made of a non-transparent dielectric material such as a printed circuit board. In some implementations, an optoelectronic component (90) can be attached to the respective constituent of the optical device (1).

    Abstract translation: 光学装置（1）包括两个棱镜体（41,42）和附接到两个棱镜体（41,42）的四个侧面板（71-74）。 因此封闭空腔（9）。 第一反射器（81）可以存在于第一棱镜体（41）的第一侧面（81）处，并且第二反射器（82）可以存在于第二棱镜体的第二侧面（82） 42）。 至少一个棱镜体（41,42）和/或至少一个侧板（71-74）可以至少部分地由不透明的电介质材料例如印刷电路板制成。 在一些实施方案中，可以将光电子部件（90）附接到光学装置（1）的各个组成部分。

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