公开(公告)号：WO2015016776A2

公开(公告)日：2015-02-05

申请号：PCT/SG2014/000352

申请日：2014-07-25

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： RUDMANN, Hartmut ,  GUBSER, Simon ,  WESTENHOFER, Susanne ,  HEIMGARTNER, Stephan ,  GEIGER, Jens ,  YI, Xu ,  KIM, Thng Chong ,  VIDALLON, John A. ,  WANG, Ji ,  YU, Qi Chuan ,  LEONG, Kam Wah

IPC: H01L27/00

CPC classification number: H01L27/14623 ,  F21V5/048 ,  F21Y2115/10 ,  G02B5/22 ,  G02B7/02 ,  G02B13/0085 ,  H01L24/94 ,  H01L25/50 ,  H01L31/0203 ,  H01L31/0543 ,  H01L33/486 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2933/0033 ,  H04N5/2252 ,  H04N5/2257 ,  Y02E10/52 ,  Y10T29/41 ,  H01L2924/00

Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.

Abstract translation: 光电子模块包括光电子器件和透明盖子。 在透明盖的侧壁上提供不透明材料，这可以帮助减少来自透明盖的侧面的光泄漏，或者可以帮助减少杂散光进入模块。 例如，可以在晶圆级工艺中制造模块。 在一些实施方式中，诸如沟槽的开口形成在透明晶片中。 然后可以使用例如真空注入工具将沟槽填充不透明材料。 当随后将包括沟槽填充的透明晶片的晶片堆分离成单独的模块时，结果是每个模块可以包括具有由不透明材料覆盖的侧壁的透明盖。

公开(公告)号：WO2013091830A1

公开(公告)日：2013-06-27

申请号：PCT/EP2012/005224

申请日：2012-12-18

Applicant: HEPTAGON MICRO OPTICS PTE. LTD. ,  HEPTAGON OY

Inventor： ROSSI, Markus ,  RUDMANN, Hartmut ,  HEIMGARTNER, Stephan ,  BIETSCH, Alexander ,  LENART, Robert

IPC: H01L27/146 ,  H01L27/148

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L27/14818 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The optical device comprises a first substrate (SI) comprising at least one optical structure (1) comprising a main portion (2) and a surrounding portion (3) at least partially surrounding said main portion. The device furthermore comprises non-transparent material (5, 5a, 5b) applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of • a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and • b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.

Abstract translation: 光学装置包括包括至少一个光学结构（1）的第一基板（S1），该至少一个光学结构（1）包括主要部分（2）和至少部分地围绕所述主要部分的环绕部分（3）。 该装置还包括施加到所述周围部分上的不透明材料（5,5a，5b）。 所述光电模块包括包含在所述第一衬底中的多个这些光学器件。 制造光学器件的方法包括以下步骤。 a）提供包括至少一个光学结构的第一基板，所述至少一个光学结构包括主要部分和至少部分地围绕所述主要部分的环绕部分; 和。 b）将不透明材料施加到至少所述周围部分上。 所述不透明材料存在于仍在最终光学装置中的至少所述周围部分上。

公开(公告)号：WO2013026174A2

公开(公告)日：2013-02-28

申请号：PCT/CH2012/000200

申请日：2012-08-24

Applicant: HEPTAGON MICRO OPTICS PTE. LTD. ,  RUDMANN, Hartmut ,  MALUCK, Matthias ,  BIETSCH, Alexander ,  ROENTGEN, Peter ,  HEIMGARTNER, Stephan

Inventor： RUDMANN, Hartmut ,  MALUCK, Matthias ,  BIETSCH, Alexander ,  ROENTGEN, Peter ,  HEIMGARTNER, Stephan

IPC: H01L27/146

CPC classification number: G02B13/0085 ,  B23K26/361 ,  G01J1/42 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2924/0002 ,  Y10T29/49748 ,  Y10T83/04 ,  H01L2924/00

Abstract: The device (50) comprises an optics member (60) and a spacer member (70), said optics member comprising N ≥ 2 sets of passive optical components (65) comprising one or more passive optical components each. The spacer member (70) comprises N light channels (77), each of said N light channels being associated with one of said N sets of passive optical components. All of said N light channels (77) have an at least substantially identical geometrical length (g), and an optical path length of a first of said N light channels is different from an optical path length of at least one second of said N light channels. Methods for manufacturing such devices are described, too. The invention can allow to mass produce high-precision devices (50) at a high yield.

Abstract translation: 所述装置（50）包括光学构件（60）和间隔构件（70），所述光学构件包括N = 2组无源光学组件（65），每个无源光学组件包括一个或多个无源光学组件。 间隔构件（70）包括N个光通道（77），所述N个光通道中的每一个与所述N组无源光学部件中的一个相关联。 所有所述N个光通道（77）具有至少基本上相同的几何长度（g），并且所述N个光通道中的第一个的光路长度不同于所述N个光的至少一秒的光路长度 通道。 还描述了制造这种装置的方法。 本发明可以以高产率批量生产高精度装置（50）。

公开(公告)号：WO2016060615A1

公开(公告)日：2016-04-21

申请号：PCT/SG2015/050387

申请日：2015-10-14

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： HEIMGARTNER, Stephan ,  BIETSCH, Alexander ,  RIEL, Peter

IPC: G02B7/00 ,  B32B37/12 ,  H01L31/0232

CPC classification number: H01L27/3209 ,  B32B37/02 ,  B32B37/1292 ,  B32B2037/243 ,  B32B2307/412 ,  B32B2307/418 ,  B32B2551/00 ,  G02B3/0012 ,  G02B5/1847 ,  G02B5/1866 ,  G02B27/0944 ,  G02B27/0977 ,  G02B27/4205 ,  G02B2207/00 ,  H01L24/94 ,  H01L31/0232 ,  H01L2227/32 ,  H01S5/005

Abstract: The present disclosure describes optical element stack assemblies that include multiple substrates stacked one over another. At least one of the substrates includes an optical element, such as a DOE, on its surface. The stack assemblies can be fabricated, for example, in wafer-level processes.

Abstract translation: 本公开描述了包括多个彼此堆叠的衬底的光学元件堆叠组件。 至少一个基板在其表面上包括诸如DOE的光学元件。 堆叠组件可以例如在晶片级工艺中制造。

公开(公告)号：WO2015009237A1

公开(公告)日：2015-01-22

申请号：PCT/SG2014/000334

申请日：2014-07-16

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： ALASIRNIO, Jukka ,  RUDMANN, Hartmut ,  CESANA, Mario ,  HEIMGARTNER, Stephan

IPC: G03B17/00 ,  G02B7/02

CPC classification number: G02B7/021 ,  G02B3/00 ,  G02B7/02 ,  G03B17/02 ,  G03B29/00 ,  H04N5/225 ,  H04N5/2254 ,  H04N5/2257

Abstract: Camera modules include a lens, a lens stack and/or an array of lenses. One or more of the lenses have a non-circular shape, which in some cases can provide greater flexibility in the dimensions of the module and can result in a very small camera module.

Abstract translation: 相机模块包括透镜，透镜组和/或透镜阵列。 一个或多个透镜具有非圆形形状，这在一些情况下可以在模块的尺寸上提供更大的灵活性并且可以导致非常小的相机模块。

公开(公告)号：WO2015041602A1

公开(公告)日：2015-03-26

申请号：PCT/SG2014/000440

申请日：2014-09-17

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： ALASIRNIÖ, Jukka ,  HEIMGARTNER, Stephan

IPC: G03B17/00 ,  H01L21/56 ,  H04N5/225

CPC classification number: H04N5/2257 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2924/19105 ,  H04N5/2252 ,  H05K3/284 ,  H01L2924/00014

Abstract: Compact camera module can include auxiliary spacers to facilitate use of dam-and-fill encapsulation techniques. An encapsulant disposed on side edges of the auxiliary spacer can close off a gap between the auxiliary spacer and a support on which an image sensor is mounted so as to substantially seal off an area in which bond wires or other components are located. In some cases, the thickness of a transmissive substrate in the module can be reduced near its periphery to provide more head room for the bond wires, which can result in a smaller overall footprint for the module.

Abstract translation: 紧凑型相机模块可以包括辅助间隔件，以便于使用阻塞和灌装封装技术。 设置在辅助间隔物的侧边缘上的密封剂可以封闭辅助间隔件和安装有图像传感器的支撑件之间的间隙，从而基本上密封接合线或其它部件所在的区域。 在一些情况下，模块中的透射基板的厚度可以在其周边附近减小以为接合线提供更多的头部空间，这可以导致模块的更小的整体尺寸。

公开(公告)号：WO2015016775A1

公开(公告)日：2015-02-05

申请号：PCT/SG2014/000351

申请日：2014-07-25

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： RUDMANN, Hartmut ,  GUBSER, Simon ,  WESTENHOFER, Susanne ,  HEIMGARTNER, Stephan ,  GEIGER, Jens ,  HANSELMANN, Sonja ,  FRIESE, Christoph ,  YI, Xu ,  KIM, Thng Chong ,  VIDALLON, John A. ,  WANG, Ji ,  YU, Qi Chuan ,  LEONG, Kam Wah

IPC: H01L27/00 ,  H01L33/00

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2933/0058 ,  H01L2924/00

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Abstract translation: 描述了包括光电子器件（例如，发光或光检测元件）和透明盖的各种光电模块。 在透明盖的侧壁上设置不透明材料，在一些实施方式中，这可以帮助减少透明盖的侧面的光泄漏，或有助于防止杂散光进入模块。 还描述了制造模块的制造技术。

公开(公告)号：WO2014070115A1

公开(公告)日：2014-05-08

申请号：PCT/SG2013/000470

申请日：2013-10-31

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： HEIMGARTNER, Stephan ,  KETTUNEN, Ville ,  SPRING, Nicola ,  BIETSCH, Alexander ,  CESANA, Mario ,  RUDMANN, Hartmut ,  ALASIRNIO, Jukka ,  LENART, Robert

IPC: G02B13/00 ,  G02B7/02 ,  H01L31/0232 ,  H04N5/225

CPC classification number: H01L27/14625 ,  G02B27/0025 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02325 ,  H01L31/18 ,  H04N5/2254 ,  Y10T29/49826

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

Abstract translation: 制造光学器件可以包括在衬底上安装多个单独的透镜系统，将衬底的厚度调整到至少一些透镜系统的下方，以为透镜系统提供相应的焦距校正，随后将衬底分离成多个 光学模块，每个光学模块包括安装在基板的一部分上的透镜系统之一。 调整衬底的厚度可以包括例如微加工衬底以在透镜系统的至少一些下方形成相应的孔，或者在透镜系统的至少一些之下添加一个或多个层，以便校正透镜系统中的变化 镜头系统的焦距。

公开(公告)号：WO2016003367A1

公开(公告)日：2016-01-07

申请号：PCT/SG2015/050148

申请日：2015-06-09

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： ROSSI, Markus ,  HEIMGARTNER, Stephan

IPC: G02B27/09 ,  G02B3/00 ,  B29D11/00 ,  B32B7/00

CPC classification number: G02B7/028 ,  G02B1/041 ,  G02B3/0031 ,  G02B3/02 ,  G02B3/08 ,  G02B27/0955

Abstract: According to embodiments of the present invention, an apparatus comprising a beam shaping element (lens) is provided. The apparatus comprises a substrate; a beam shaping element; and an elastic intermediate layer disposed between, and in contact with, the substrate and the beam shaping element, wherein the elastic intermediate layer has a Young's Modulus in a range of 2 -600 MPa and a Poisson's ratio in a range of 0.2 -0.5. Techniques for reducing thermal distortion of lens are described.

Abstract translation: 根据本发明的实施例，提供一种包括光束成形元件（透镜）的装置。 该装置包括基板; 光束成形元件; 以及设置在所述基板和所述光束成形元件之间并与所述光束成形元件接触的弹性中间层，其中所述弹性中间层的杨氏模量在2 -600MPa的范围内，泊松比在0.2-0.5的范围内。 描述了减少透镜热失真的技术。

公开(公告)号：WO2015119571A1

公开(公告)日：2015-08-13

申请号：PCT/SG2015/000028

申请日：2015-02-02

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： RUDMANN, Hartmut ,  ROSSI, Markus ,  CESANA, Mario ,  MEITAV, Ohad ,  ROENTGEN, Peter ,  ALASIRNIÖ, Jukka ,  HEIMGARTNER, Stephan ,  ENGELHARDT, Kai

IPC: G02B7/02 ,  G02B3/00 ,  B29C33/42 ,  B29C45/00

CPC classification number: G02B3/0062 ,  G02B7/003 ,  G02B7/021 ,  G02B7/022 ,  G02B27/0961

Abstract: Various stacks of arrays of beam shaping elements are described. Each array of beam shaping elements can be formed, for example, as part of a monolithic piece that includes a body portion as well as the beam shaping elements. In some implementations, the monolithic pieces may be formed, for example, as integrally formed molded pieces. The monolithic pieces can include one or more features to facilitate stacking, aligning and/or centering of the arrays with respect to one another.

Abstract translation: 描述了束形成元件阵列的各种堆叠。 波束成形元件的每个阵列可以例如形成为包括主体部分以及波束成形元件的整体件的一部分。 在一些实施方案中，整体件可以形成为例如整体成型的模制件。 单块件可以包括一个或多个特征，以便于阵列相对于彼此的堆叠，对准和/或对中。