公开(公告)号：DE2629097A1

公开(公告)日：1977-02-03

申请号：DE2629097

申请日：1976-06-29

Applicant: IBM

Inventor： BELLESON JAMES GARMAN ,  CLARK KENDALL

IPC: G01D5/26 ,  G01B11/00 ,  G01B11/02 ,  G01B11/24 ,  G01B11/245 ,  G01R31/265 ,  G01R31/308 ,  G01R31/309 ,  H01L21/66 ,  H05K13/08 ,  G01R31/28 ,  B07C5/34

Abstract: This patent discloses an improved inspection tool for rapidly inspecting miniature electronic conductor patterns, circuits and the like. The tool focuses a laser beam to a small laser spot that raster scans a large conductor pattern area on the workpiece being inspected. Reflected laser light from the workpiece impinges upon a light detector that generates electrical signals according to the presence or absence of conductor pattern material on the workpiece at the momentary X and Y coordinate of the scanning laser spot. The light detector signals are compared with a previously encoded data image of the correct circuit pattern for the X and Y coordinates of the scanning laser spot. When the signals and the data agree at all X and Y coordinate points the workpiece is accepted. If the signals and the data do not agree at one or more X and Y coordinate points a defect in the circuit pattern is indicated. A defect may indicate out-of-tolerance dimensions, possible electrical short circuits, and/or open circuits. The extent of a defect may be determined by adjacent X and Y coordinate points and suitable computer programming, while workpieces having extended or out-of-tolerance defects are rejected. The improved disclosed inspection tool includes apparatus for automatically compensating for variations in the workpieces, and to effect registration for the scanning laser spot.

公开(公告)号：CA832115A

公开(公告)日：1970-01-13

申请号：CA832115D

Applicant: IBM

Inventor： CLARK KENDALL

公开(公告)号：FR2309317A1

公开(公告)日：1976-11-26

申请号：FR7533262

申请日：1975-10-20

Applicant: IBM

Inventor： CLARK KENDALL ,  SHAPIRO MILTON R

IPC: B23K26/00 ,  B23K26/08 ,  B23K26/12 ,  B23K26/14 ,  B23K26/18 ,  B23K26/38 ,  B23K26/40 ,  B23K26/42 ,  B26F1/31 ,  H05K1/03 ,  H05K3/00 ,  B26F1/30 ,  B28D5/06

Abstract: Apparatus and processes are utilized to pierce holes in a brittle material by the use of laser induced shock waves. The waves are generated in an environment of compressed gas which confines the shock wave and carries the debris away. The material is moved into and/or through the work area in the y-direction either by a supporting web with associated rollers or sliding action. The laser beam scans in the x-direction and computer control is utilized to either deflect a continuous beam or switch a pulsed beam "on" where a hole is desired in the material.

公开(公告)号：FR2277390A1

公开(公告)日：1976-01-30

申请号：FR7515552

申请日：1975-05-09

Applicant: IBM

Inventor： CLARK KENDALL ,  LEMBERGER ALAN D ,  SHAPIRO MILTON R

IPC: H01J17/49 ,  G09F13/44

Abstract: This patent discloses an improved gas discharge display panel typically of the type used for luminous displays showing lines of electrically changeable alpha-numeric characters, figures and the like. The gas discharge display panel comprises a transparent front cover plate, a rear cover plate, and marginal sealing areas extending adjacent to and about the periphery of each of the plates.

公开(公告)号：CA878741A

公开(公告)日：1971-08-17

申请号：CA878741D

Applicant: IBM

Inventor： CLARK KENDALL ,  HERRMANN KARL E ,  KLEIN WILLIAM A

公开(公告)号：DE1640492B1

公开(公告)日：1971-02-04

申请号：DE1640492

申请日：1966-11-12

Applicant: IBM

Inventor： CLARK KENDALL ,  SCHUELKE WALTER JOSEPH ,  BOWERS RONALD WALTER

IPC: G01M99/00 ,  G01N27/20 ,  G01R31/02 ,  G01R31/18 ,  G01R31/26 ,  G01R31/28 ,  H05K13/00 ,  H05K13/08 ,  H05K3/34

Abstract: 1,159,456. Testing bonded joints. INTERNATIONAL BUSINESS MACHINES CORP. Nov. 9, 1966 [Nov. 15, 1965(2); April 25, 1966], No. 50092/66. Heading G1S. An apparatus and method for testing a bonded joint between an electrical component and a substrate comprises subjecting the bonded joint to a blast of a fluid medium and monitoring the bonded joint for changes in electrical resistance during said blast. In the embodiments described the components under test are micro-miniature electronic devices attached to a printed circuit board. In one embodiment Fig. 3 the modules 411 under test are placed on firing sticks 419 which are fed sequentially between rollers 432N, 432S, 433N, 433S, 434N and 434S. While passing between the rollers the modules are subjected to a blast of air under pressure so that a weak bond can be detected. The module is placed in circuit with a source of current so that if the bond is broken the break is detected since no current will flow in the circuit or if the bond is just weakened the resistance of the circuit will be decreased. In a second embodiment Fig. 11 the modules 11 are placed on firing sticks 12 and fed along conveyors 41 at the end of which they are placed on sprockett wheel 52 which convey them to a carrier table 24. At the carrier table 24 the modules are removed from the firing sticks and placed in recesses in the table 24. As the table 24 rotates the modules are moved through various stations, at one of which the module is subjected to a blast of air from a nozzle mounted on the table 36. If the module is not faulty it is removed from the table 24 at the next station and placed on a firing stick which has been moved into place by conveyors parallel to the first conveyors and further sprocket wheels. If the module is faulty, detected as described above in connection with first embodiment it passes the next station and at the next after that it is removed from the table and placed in a disposal chute. The functions of the apparatus are controlled electrically in such a way that if a faulty module is detected, the means which removes the modules on to the firing sticks after testing is not actuated and also the firing stick is not progressed.

公开(公告)号：DE1901293A1

公开(公告)日：1969-09-04

申请号：DE1901293

申请日：1969-01-11

Applicant: IBM

Inventor： CLARK KENDALL ,  FEDELE LIA RUDOLPH ,  LUIS DE TURRIS FRAND ,  GENE KAPER RONALD

IPC: H01F19/08 ,  H01F15/02 ,  H01F27/02

公开(公告)号：DE2554367A1

公开(公告)日：1976-06-24

申请号：DE2554367

申请日：1975-12-03

Applicant: IBM

Inventor： CLARK KENDALL ,  SHAPIRO MILTON R

IPC: B23K26/00 ,  B23K26/08 ,  B23K26/12 ,  B23K26/14 ,  B23K26/18 ,  B23K26/38 ,  B23K26/40 ,  B23K26/42 ,  B26F1/31 ,  H05K1/03 ,  H05K3/00 ,  B26F1/26

Abstract: Apparatus and processes are utilized to pierce holes in a brittle material by the use of laser induced shock waves. The waves are generated in an environment of compressed gas which confines the shock wave and carries the debris away. The material is moved into and/or through the work area in the y-direction either by a supporting web with associated rollers or sliding action. The laser beam scans in the x-direction and computer control is utilized to either deflect a continuous beam or switch a pulsed beam "on" where a hole is desired in the material.

公开(公告)号：DE2526179A1

公开(公告)日：1976-01-22

申请号：DE2526179

申请日：1975-06-12

Applicant: IBM

Inventor： CLARK KENDALL ,  LEMBERGER ALAN D ,  SHAPIRO MILTON R

IPC: H01J17/49 ,  H01J61/92

Abstract: This patent discloses an improved gas discharge display panel typically of the type used for luminous displays showing lines of electrically changeable alpha-numeric characters, figures and the like. The gas discharge display panel comprises a transparent front cover plate, a rear cover plate, and marginal sealing areas extending adjacent to and about the periphery of each of the plates.

公开(公告)号：DE1591226A1

公开(公告)日：1970-09-24

申请号：DE1591226

申请日：1967-10-25

Applicant: IBM

Inventor： CLARK KENDALL ,  HERRMANN THEODOR ,  CARPENTER LATTIN JOCELYN ,  MEDWID JOHN

IPC: H05K13/04 ,  B26D7/06

Abstract: 1,179,799. Bending cutters; attaching electrical components to printed circuits INTERNATIONAL BUSINESS MACHINES CORP. 2 Oct., 1967 [26 Oct., 1966], No. 44713/67. Headings B3A and B3W. In apparatus for forming a wire element for a printed circuit and positioning it on a substrate S, a length of wire fed on to a mandrel 40 and retained by vacuum means on a transfer member 38 is sheared by a cutter 42 surrounding the member 38 which co-operates with the mandrel to bend the wire into a bridge (E), Fig. 10 (not shown); the member 38 continues downwardly, setting the bridge firmly on lands (L) on the substrate and then ejecting it by means of a jet of air. A frame 50 mounted on a longitudinally and transversely adjustable base supports the apparatus through a rotatable head 34 which can be locked in position by means of a spring bolt 52. A drive shaft 54 carries cams 56, 58, 60, 62. Cam 62, through cam follower 74, actuates a slide 75 and a pawl- and-ratchet assembly 72, 70 drivingly connected with a roller 66 to feed wire from a dispenser 64 through rollers 66, 68 to the head 34 until it abuts the far side of the recess in which the cutter reciprocates and then overdrives it. A spring-urged pawl 73 prevents reverse rotation of ratchet 70. Cam 60, through cam follower 94 and spring-return levers 93, 92 actuates movement of the cutter 42. Engagement of an abutment 99 on the cutter as it descends with a push-rod 98 swings the mandrel 40 out of the forming position. Cam 58 actuates movement of member 38 relative to the cutter 42 through cam follower 82 and spring-return levers 78, 80. The lever 78 is urged against a flange 84 on the member 38 by a spring 86. The formed bridge (E), Fig. 10, is temporarily located on the substrate by means of a flux and then heated to fuse the ends of the bridge to the lands (L).