公开(公告)号：DE1640492B1

公开(公告)日：1971-02-04

申请号：DE1640492

申请日：1966-11-12

Applicant: IBM

Inventor： CLARK KENDALL ,  SCHUELKE WALTER JOSEPH ,  BOWERS RONALD WALTER

IPC: G01M99/00 ,  G01N27/20 ,  G01R31/02 ,  G01R31/18 ,  G01R31/26 ,  G01R31/28 ,  H05K13/00 ,  H05K13/08 ,  H05K3/34

Abstract: 1,159,456. Testing bonded joints. INTERNATIONAL BUSINESS MACHINES CORP. Nov. 9, 1966 [Nov. 15, 1965(2); April 25, 1966], No. 50092/66. Heading G1S. An apparatus and method for testing a bonded joint between an electrical component and a substrate comprises subjecting the bonded joint to a blast of a fluid medium and monitoring the bonded joint for changes in electrical resistance during said blast. In the embodiments described the components under test are micro-miniature electronic devices attached to a printed circuit board. In one embodiment Fig. 3 the modules 411 under test are placed on firing sticks 419 which are fed sequentially between rollers 432N, 432S, 433N, 433S, 434N and 434S. While passing between the rollers the modules are subjected to a blast of air under pressure so that a weak bond can be detected. The module is placed in circuit with a source of current so that if the bond is broken the break is detected since no current will flow in the circuit or if the bond is just weakened the resistance of the circuit will be decreased. In a second embodiment Fig. 11 the modules 11 are placed on firing sticks 12 and fed along conveyors 41 at the end of which they are placed on sprockett wheel 52 which convey them to a carrier table 24. At the carrier table 24 the modules are removed from the firing sticks and placed in recesses in the table 24. As the table 24 rotates the modules are moved through various stations, at one of which the module is subjected to a blast of air from a nozzle mounted on the table 36. If the module is not faulty it is removed from the table 24 at the next station and placed on a firing stick which has been moved into place by conveyors parallel to the first conveyors and further sprocket wheels. If the module is faulty, detected as described above in connection with first embodiment it passes the next station and at the next after that it is removed from the table and placed in a disposal chute. The functions of the apparatus are controlled electrically in such a way that if a faulty module is detected, the means which removes the modules on to the firing sticks after testing is not actuated and also the firing stick is not progressed.