公开(公告)号：DE1551415A1

公开(公告)日：1971-03-04

申请号：DE1551415

申请日：1967-06-03

Applicant: IBM

Inventor： OKTAY SEVGIN

IPC: F28C3/04 ,  G06F1/20 ,  H01F27/18 ,  H01J7/24 ,  H05K7/20

Abstract: 1,126,180. Cooling systems. INTERNATIONAL BUSINESS MACHINES CORP. 11 May, 1967 [7 June, 1966], No. 21919/67. Heading F4U. An article to be cooled is immersed in a first liquid 77 of relatively low boiling point having an interface 89 with a superimposed second liquid 75 of relatively high boiling point, vapour bubbles generated in the first liquid being condensed by direct heat exchange with the second liquid. In the embodiment shown the liquids are held in a container 73 which is located within and spaced from an outer container 85. The second liquid overflows from container 73 and forms a pool 93; a pump 97 draws liquid from the pool through a cooler 99 and recycles it to spray means 101 arranged to discharge the cooled liquid adjacent the interface 89. An additional cooling coil 87 is immersed in the second liquid. In a further embodiment (Fig. 1, not shown) the outer container is omitted and the upper liquid is circulated through an external circuit including a cooler and a thermostatically operated valve. The upper liquid may be cooled by the evaporator of a refrigeration system. To ensure that no vapour escapes from the liquid, a third liquid of still higher boiling point may be superimposed on the second (Fig. 3, not shown), The article to be cooled may be a computer memory array or logic circuit, electronic components, a transformer or a nuclear reactor. Suitable liquids are listed.