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    Method for forming heat sinks on semiconductor device chips
    1.
    发明授权
    Method for forming heat sinks on semiconductor device chips 失效
    在半导体器件芯片上形成散热片的方法

    公开(公告)号：US3706127A

    公开(公告)日：1972-12-19

    申请号：US3706127D

    申请日：1970-04-27

    Applicant: IBM

    Inventor： OKTAY SEVGIN ,  SCHMECKENBECHER ARNOLD F

    IPC: F28F13/00 ,  F28F13/18 ,  H01L23/367 ,  H01L23/373 ,  B01J17/00

    CPC classification number: H01L23/3733 ,  F28F13/00 ,  F28F13/187 ,  H01L23/3677 ,  H01L2924/0002 ,  Y10S165/911 ,  Y10T29/4935 ,  H01L2924/00

    Abstract: A method is disclosed for producing a brush-like heat exchanging structure on a semiconductor device chip. A given amount of ferromagnetic powder is distributed uniformly in an electroless plating bath. Completed semiconductor device wafers are placed at the bottom of the bath, the rear wafer surfaces facing upward. An array of poles of a single electro-magnet is placed immediately below each wafer, each pole registering with a respective chip position on the wafer. The ferro-magnetic powder is permitted to settle on the rear surfaces of the wafers and then current is applied to each electro-magnet attracting substantially equal amounts of ferro-magnetic powder toward each magnet pole. This results in the erection of brush-like structures of ferromagnetic particles on the rear surfaces of the wafer opposite the individual poles. The bath temperature is then raised to the required operating temperature for electroless plating while each electro magnet remains energized. A uniform deposit of electroless metal transforms the brush-like structures into rigid heat exchangers firmly attached to each wafer at the chip locations. The wafers are then diced to yield individual chips each having its own heat exchanging structure.

    Abstract translation: 公开了一种用于在半导体器件芯片上制造刷状热交换结构的方法。 给定量的铁磁粉末均匀地分布在化学镀浴中。 完成的半导体器件晶片放置在电解槽的底部，后晶片表面朝上。 在每个晶片的正下方放置单个电磁体的极数阵列，每个磁极与晶片上的相应芯片位置对准。 允许铁磁性粉末沉淀在晶片的后表面上，然后将电流施加到每个电磁体上，吸引大致相等量的铁磁粉末朝向每个磁极。 这导致在与各个极相对的晶片的后表面上架设铁磁性颗粒的刷状结构。 然后在每个电磁体保持通电的同时，将浴温度提高到所需的无电镀操作温度。 无电金属的均匀沉积将刷状结构转换成在芯片位置牢固地附接到每个晶片的刚性热交换器。 然后对晶片进行切割，以产生各自具有其自己的热交换结构的各个芯片。

    COOLING MEANS FOR INTEGRATED CIRCUIT CHIP DEVICE.
    2.
    发明公开
    COOLING MEANS FOR INTEGRATED CIRCUIT CHIP DEVICE. 失效
    冷却器的高集成电路。

    公开(公告)号：EP0097157A4

    公开(公告)日：1985-03-08

    申请号：EP82900586

    申请日：1981-12-29

    Applicant: IBM

    Inventor： HASSAN JAVATHU K ,  OKTAY SEVGIN ,  PAIVANAS JOHN A ,  SPECTOR CLARENCE J

    IPC: H01L23/36 ,  H01L23/373 ,  H01L23/433 ,  H01L23/02 ,  H01L23/12 ,  H01L25/04

    CPC classification number: H01L23/3736 ,  H01L23/4338 ,  H01L2224/16 ,  H01L2224/73253

    Abstract: A cooling means (18) for a circuit chip device (10) employs a noneutectic metal alloy (22) to form a low thermal resistance bridging interface between the surface of the chip device and a heat sink (18). The alloy has a solidus-liquidus temperature range such that the solidus is slightly below the maximum operating temperature of the chip, and thus has the capability to reestablish and maintain the interface at a low thermal resistance if stressed during circuit operation, even with a low contact load at the interface of the chip device and the heat sink. In addition to the chip interface, the above cooling means is also used at other interfacial regions of the heat sink, dependent on design, to achieve very low thermal resistance.

    COOLING MEANS FOR INTEGRATED CIRCUIT CHIP DEVICE
    4.
    发明专利
    COOLING MEANS FOR INTEGRATED CIRCUIT CHIP DEVICE 未知

    公开(公告)号：DE3176475D1

    公开(公告)日：1987-11-05

    申请号：DE3176475

    申请日：1981-12-29

    Applicant: IBM

    Inventor： HASSAN JAVATHU K ,  OKTAY SEVGIN ,  PAIVANAS JOHN A ,  SPECTOR CLARENCE J

    IPC: H01L23/36 ,  H01L23/373 ,  H01L23/433 ,  H01L23/02 ,  H01L23/12 ,  H01L25/04

    Abstract: Semiconductor assembly comprises (a) a substrate(12); (b) a semiconductor chip(10) having one surface bonded to the substrate, (c) a heat transfer element closely adjacent the second surface of the chip; (d) a thin layer(22) of heat conductive noneutectic alloy at the interface between heat transfer element and chip, pref. an alloy contg. Bi; and pref. (e) a spring type piston providing a load force to the heat transfer element, increasing contact between element and chip. The assembly pref. also includes a hat(20) providing a cover for the assembly and diffusing heat. A thin layer(22) of conductive noneutectic alloy is pref. provided at the interface between heat transfer element and hat surface. A diagonal spring type piston(16) pref. provides a load force increasing contact between heat transfer element and hat and chip surfaces. The thermal resistance of the chip interface is pref. 0.1-0.2 deg.C./W and of the heat interface is pref. 0.01-0.02 deg.C./W, both for contact load of 100g. The alloy allows resistance loads 5-7 times less than those obtd. using thermal grease.

    COOLING TUNNELS FOR SEMICONDUCTOR DEVICES
    5.
    发明专利
    COOLING TUNNELS FOR SEMICONDUCTOR DEVICES 未知

    公开(公告)号：CA1115822A

    公开(公告)日：1982-01-05

    申请号：CA329381

    申请日：1979-06-08

    Applicant: IBM

    Inventor： OKTAY SEVGIN ,  TORGERSEN GERARD J ,  WONG ALEXANDER C

    IPC: H05K7/20 ,  H01L23/42 ,  H01L23/427 ,  H01L23/44 ,  H01L23/473 ,  H01L23/34

    Abstract: COOLING TUNNELS FOR SEMICONDUCTOR DEVICES A structure for cooling high density integrated circuit devices composed of a heat sink bonded to the backside of the integrated circuit devices. The integrated circuit devices are mounted on a board and the board positioned 80 that the tunnels in the heat sink are oriented vertically. The tunnels are totally immersed in a liquid so that the integrated circuit devices are cooled by nucleate boiling and bubbles form within the tunnels and propagate out of the tunnels. FI9-77-066

    SLOTTED HEAT SINKS FOR HIGH POWERED AIR COOLED MODULES
    7.
    发明专利
    SLOTTED HEAT SINKS FOR HIGH POWERED AIR COOLED MODULES 未知

    公开(公告)号：CA1140681A

    公开(公告)日：1983-02-01

    申请号：CA360338

    申请日：1980-09-16

    Applicant: IBM

    Inventor： LEAYCRAFT EDGAR C ,  OKTAY SEVGIN ,  OSTERGREN CARL D

    IPC: H05K7/20 ,  H01L23/367 ,  H01L23/467 ,  H01L23/24

    Abstract: Slotted Heat Sinks For High Powered Air Cooled Modules An air cooled high density integrated circuit system wherein heat sink structures are located on one of the surfaces of the modules in the system. The heat sink is composed of a plurality of hollow or flat heat conductive bodies having an opening or openings extending from the module surface toward, but not reaching, the top of the hollow heat sink. Means are provided to direct air flow to the upper end of the body. The air flow will be from the top of the heat sink and out of the opening or openings to cool the heat sink and the module. The heat sink structure provides greater surface area and effects the breaking up of the boundary layer near the surface of the module for enhanced cooling. FI9-79-030

    10.
    发明专利
    未知

    公开(公告)号：DE1751585A1

    公开(公告)日：1971-08-05

    申请号：DE1751585

    申请日：1968-06-24

    Applicant: IBM

    Inventor： OKTAY SEVGIN

    IPC: H05K7/20

    Abstract: 1,166,586. Cooling systems. INTERNATIONAL BUSINESS MACHINES CORP. 23 May, 1968 [26 June, 1967], No. 24576/68. Addition to 1,126,180. Heading F4U. In cooling apparatus of the type described in Specification 1,126,180 the superimposed second liquid is cooled by a heat conducting member which extends into the liquid and dissipates heat to a fluid surrounding the container. As shown, the member comprises a lower set of fins 32 depending into the liquid 16 and an upper set of fins 36 over which ambient air is blown by a fan 38, air inlets 40 being provided in the walls of the container 22. In a modification (Figs. 3 and 4, not shown) the fins extend vertically and are arranged in rows, each row being encased in a rectangular housing which communicates at its lower end with the ambient atmosphere. Air thus flows by convection through the spaces between the ajdacent fins of each row and leaves the container through apertures in the top wall thereof.

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