公开(公告)号：DE3272501D1

公开(公告)日：1986-09-18

申请号：DE3272501

申请日：1982-02-05

Applicant: IBM

Inventor： ECKER MARIO ENRIQUE ,  OLSON LEONARD THEODORE

IPC: H01L23/32 ,  H01L21/48 ,  H01L23/12 ,  H01L23/498 ,  H01L23/52 ,  H01L23/538 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H01L23/50 ,  H01L21/60

Abstract: A system for connecting a semiconductor chip (70) on a carrier substrate (11) to a printed circuit card (80) is described. The substrate (11) has a flexible, extendable wiring membrane (50) attached to the bottom thereof which extends beyond the periphery of the substrate (11) and in the area beyond the periphery is provided with electrical contacts (51). These electrical contacts (51) are mated to complementary contacts in the printed circuit card (80) which is biased from the semiconductor chip carrier by electrical and thermal contact means (91). The membrane (50) provides high density electrical contact between the semiconductor (70) and printed circuit card (80). A process for forming the same is also described.