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公开(公告)号:DE69415604D1
公开(公告)日:1999-02-11
申请号:DE69415604
申请日:1994-07-11
Applicant: IBM
Inventor: JACOBOWITZ LAWRENCE , ECKER MARIO ENRIQUE , DECUSATIS CASIMER MAURICE
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公开(公告)号:DE2238639A1
公开(公告)日:1973-02-15
申请号:DE2238639
申请日:1972-08-05
Applicant: IBM
Inventor: ECKER MARIO ENRIQUE
Abstract: An electrical connector is provided which prevents damage to the edge of the card by the contact points during initial insertion but allows for wiping the circuit card at the contact terminal areas. The connector operates with two basic components, a resilient U-shaped element containing points for electrically contacting the circuit card and a rigid-conformal housing which controls the point of insertion at which electrical contact will take place as well as acts to hold the circuit card tightly in place after insertion.
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公开(公告)号:DE69415604T2
公开(公告)日:1999-07-22
申请号:DE69415604
申请日:1994-07-11
Applicant: IBM
Inventor: JACOBOWITZ LAWRENCE , ECKER MARIO ENRIQUE , DECUSATIS CASIMER MAURICE
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公开(公告)号:DE3272501D1
公开(公告)日:1986-09-18
申请号:DE3272501
申请日:1982-02-05
Applicant: IBM
Inventor: ECKER MARIO ENRIQUE , OLSON LEONARD THEODORE
IPC: H01L23/32 , H01L21/48 , H01L23/12 , H01L23/498 , H01L23/52 , H01L23/538 , H05K1/02 , H05K1/11 , H05K1/14 , H05K3/30 , H05K3/34 , H05K3/36 , H01L23/50 , H01L21/60
Abstract: A system for connecting a semiconductor chip (70) on a carrier substrate (11) to a printed circuit card (80) is described. The substrate (11) has a flexible, extendable wiring membrane (50) attached to the bottom thereof which extends beyond the periphery of the substrate (11) and in the area beyond the periphery is provided with electrical contacts (51). These electrical contacts (51) are mated to complementary contacts in the printed circuit card (80) which is biased from the semiconductor chip carrier by electrical and thermal contact means (91). The membrane (50) provides high density electrical contact between the semiconductor (70) and printed circuit card (80). A process for forming the same is also described.
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公开(公告)号:DE69215427T2
公开(公告)日:1997-05-28
申请号:DE69215427
申请日:1992-03-27
Applicant: IBM
Inventor: JACOBOWITZ LAWRENCE , ECKER MARIO ENRIQUE
Abstract: The present invention relates generally to a new interface and a method for making the same, and more particularly, to an electrical transmission-line interface and a method for making the same. On a substrate having semiconductors, a driver or receiver circuit is provided to interface with an electrical transmission-line. Integral means for the electrical transmission-line alignment, support and transit through a sealed environment is also provided. A fluid tight seal can also be provided for the various components that are in the interior of the housing. Variable time-delay means is provided for a computer clock system or other microwave applications.
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公开(公告)号:DE3787429D1
公开(公告)日:1993-10-21
申请号:DE3787429
申请日:1987-05-19
Applicant: IBM
IPC: H01L21/82 , G06F1/22 , H01L21/822 , H01L23/538 , H01L27/04 , H01L23/52 , G06F1/00
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公开(公告)号:DE69215427D1
公开(公告)日:1997-01-09
申请号:DE69215427
申请日:1992-03-27
Applicant: IBM
Inventor: JACOBOWITZ LAWRENCE , ECKER MARIO ENRIQUE
Abstract: The present invention relates generally to a new interface and a method for making the same, and more particularly, to an electrical transmission-line interface and a method for making the same. On a substrate having semiconductors, a driver or receiver circuit is provided to interface with an electrical transmission-line. Integral means for the electrical transmission-line alignment, support and transit through a sealed environment is also provided. A fluid tight seal can also be provided for the various components that are in the interior of the housing. Variable time-delay means is provided for a computer clock system or other microwave applications.
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公开(公告)号:DE3787429T2
公开(公告)日:1994-04-21
申请号:DE3787429
申请日:1987-05-19
Applicant: IBM
IPC: H01L21/82 , G06F1/22 , H01L21/822 , H01L23/538 , H01L27/04 , H01L23/52 , G06F1/00
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公开(公告)号:DE69224099D1
公开(公告)日:1998-02-26
申请号:DE69224099
申请日:1992-03-27
Applicant: IBM
Inventor: ECKER MARIO ENRIQUE , JACOBOWITZ LAWRENCE
IPC: G02B6/42 , H04B10/12 , H04B10/135 , H04B10/14 , H04B10/2581
Abstract: The present invention relates to an optical fiber interface and a method for making the same. A Thermal Conduction Module or TCM (10), comprises a lower frame (12), an upper frame (16), sandwiching a seal frame (14), are held together by bolts (18). Usually a cold plate (17), having a number of coolant channels (21), is secured to the upper surface of the upper frame (16), A substrate (40), having stepped edge (42), and having semiconductor chips (50), thereon, is secured between the ledge (41), of the lower frame (12), and the extension of seal frame (14), with a gasket (46), therebetween. Heat exchange elements (52) transfer the heat generated by the chips (50), to the upper frame (16). A retainer (51), holds the heat exchange elements (52), in place, and is also used to provide the guide grooves and securing means for an optical fiber (23). Cooling devices where there is no retainer, can be modified to provide means for guiding and securing the optical fiber (23), from the exterior of the TCM (10) , to an optoelectronic device on the substrate (40). A fluid tight seal for the chips (50), that are on the substrate 40, is achieved by means of gaskets (46, 48). An optical fiber mounting assembly (20), provides the interface between the multi-fiber optical cable (25), and the TCM (10). Face plate (22), keeper (32), wave washer (31), retainer (30), and shoulder (28), are various components of the optical fiber mounting assembly (20), that normally protrude out of the TCM (10). The optical fiber mounting assembly (20), may be located between any adjacent pair of bolts (18), along the sides of the TCM (10). Therefore, any side of the TCM (10), may then accommodate (N-1) optical fiber mounting assemblies (20), where N = number of bolts along the given side of the TCM (10). Each optical fiber mounting assembly (20), can have a multi-fiber optical cable (25), having one or more optical fibers (23) having a core of a first refractive index material with a cladding of a second refractive index material and a protective jacket which is typically of a polymeric material.
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公开(公告)号:DE3880385T2
公开(公告)日:1993-10-28
申请号:DE3880385
申请日:1988-06-16
Applicant: IBM
Inventor: ECKER MARIO ENRIQUE , OLSON LEONARD THEODORE
Abstract: Printed circuit panel for reducing cross talk between electrical circuit conductors (17, 18, 19, 20) wherein the conductors lie within individual parallel channels (13) within the same plane or different parallel planes within the induced voltage or cross talk region of an energized and a quiet conductor and either converge or diverge with respect to each other. The amount of relative convergence or divergence, preferably more than six degrees and less than 15 degrees, is that required to attenuate the magnitude of any signal induced by the activated conductor in a neighboring or quiet conductor to maintain an acceptable and desired signal-to-noise ratio.
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