公开(公告)号：CZ363897A3

公开(公告)日：1998-11-11

申请号：CZ363897

申请日：1997-11-17

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  SATHE SANJEEV BALWANT

IPC: H05K7/20 ,  H01L21/56 ,  H01L23/12 ,  H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/433

Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.