公开(公告)号：WO03012867A2

公开(公告)日：2003-02-13

申请号：PCT/GB0203436

申请日：2002-07-26

Applicant: IBM ,  IBM UK

Inventor： ALCOE DAVID JAMES ,  COFFIN JEFFREY THOMAS ,  GAYNES MICHAEL ANTHONY ,  HAMEL HARVEY CHARLES ,  INTERRANTE MARIO ,  PETERSON BRENDA LEE ,  SHANNON MEGAN ,  SABLINSKI WILLIAM EDWARD ,  SPRING CHRISTOPHER TODD ,  STUTZMAN RANDALL JOSEPH ,  WEISMAN RENEE ,  ZITZ JEFFREY ALLEN

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/552 ,  H05K9/00 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00

Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

Abstract translation: 结合有EMI屏蔽的电子封装，特别是包含嵌入有接地带的半导体芯片载体结构的半导体器件，其适于减少用于高速开关电子封装的输出和事件EMI发射。

公开(公告)号：PL323321A1

公开(公告)日：1998-06-22

申请号：PL32332197

申请日：1997-11-25

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  SATHE SANJEEV BALWANT

IPC: H01L21/56 ,  H01L23/12 ,  H05K7/20 ,  H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/433

Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.

公开(公告)号：CZ290553B6

公开(公告)日：2002-08-14

申请号：CZ363897

申请日：1997-11-17

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  SATHE SANJEEV BALWANT

IPC: H05K7/20 ,  H01L21/56 ,  H01L23/12 ,  H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/433

Abstract: In the present invention there is disclosed an electronic package assembly (10) wherein an electronic device (18) (for example a chip) on a circuitized substrate of the package assembly (10) is thermally coupled to a heatsink (22) in a separable manner using a plurality of compressible, thermally conductive members (26) (for example solder balls). These members (26) are compressed and permanently deformed as part of the thermal coupling. Disclosed is also a process for producing such electronic package assembly, which process comprises manufacture of a substrate with conductors placed thereon, placing an electronic device on such circuitized substrate and connecting thereof to the conductors, thermal coupling of a heatsink to the electronic device in a separable manner, placing compressible, thermally conductive members between the electronic device and the heatsink and exerting compressible force on this package assembly.

公开(公告)号：CZ9703638A3

公开(公告)日：1998-11-11

申请号：CZ363897

申请日：1997-11-17

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  SATHE SANJEEV BALWANT

IPC: H05K7/20 ,  H01L21/56 ,  H01L23/12 ,  H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/433

CPC classification number: H01L23/3733 ,  H01L21/563 ,  H01L23/3677 ,  H01L23/4093 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/01322 ,  Y10T156/1089 ,  Y10T156/1093 ,  H01L2924/00

公开(公告)号：SG66409A1

公开(公告)日：1999-07-20

申请号：SG1997004056

申请日：1997-11-14

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  SATHE SANJEEV BALWANT

IPC: H01L21/56 ,  H01L23/12 ,  H01L23/34 ,  H05K7/20 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/433 ,  H01L23/10

Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.

公开(公告)号：HU0401737A2

公开(公告)日：2004-12-28

申请号：HU0401737

申请日：2002-07-26

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  COFFIN JEFFREY THOMAS ,  GAYNES MICHAEL ANTHONY ,  HAMEL HARVEY CHARLES ,  INTERRANTE MARIO ,  PETERSON BRENDA LEE ,  SHANNON MEGAN ,  SABLINSKI WILLIAM EDWARD ,  SPRING CHRISTOPHER TODD ,  STUTZMAN RANDALL JOSEPH ,  WEISMAN RENEE ,  ZITZ JEFFREY ALLEN

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/552 ,  H05K9/00 ,  H01L23/66

Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

公开(公告)号：HU9701376A2

公开(公告)日：1998-07-28

申请号：HU9701376

申请日：1997-08-11

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  SATHE SANJEEV BALWANT

IPC: H05K7/20 ,  H01L21/56 ,  H01L23/12 ,  H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/433 ,  H01L23/02

Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.

公开(公告)号：HU9701376D0

公开(公告)日：1997-10-28

申请号：HU9701376

申请日：1997-08-11

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  SATHE SANJEEV BALWANT

IPC: H05K7/20 ,  H01L21/56 ,  H01L23/12 ,  H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/433

Abstract: An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.

公开(公告)号：PL367099A1

公开(公告)日：2005-02-21

申请号：PL36709902

申请日：2002-07-26

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  COFFIN JEFFREY THOMAS ,  GAYNES MICHAEL ANTHONY ,  HAMEL HARVEY CHARLES ,  INTERRANTE MARIO ,  PETERSON BRENDA LEE ,  SHANNON MEGAN ,  SABLINSKI WILLIAM EDWARD ,  SPRING CHRISTOPHER TODD ,  STUTZMAN RANDALL JOSEPH ,  WEISMAN RENEE ,  ZITZ JEFFREY ALLEN

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/552 ,  H05K9/00

Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

公开(公告)号：MY118259A

公开(公告)日：2004-09-30

申请号：MYPI9705477

申请日：1997-11-14

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  SATHE SANJEEV BALWANT

IPC: H01L23/10 ,  H01L21/44 ,  H05K7/20 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L23/12 ,  H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/40 ,  H01L23/433

Abstract: AN ELECTRONIC PACKAGE (10,10'',10")WHEREIN AN ELECTRONIC DEVICE (18)(E.G., CHIP) ON A CIRCUITIZED SUBSTRATE (12) OF THE PACKAGE IS THERMALLY COUPLED TO A HEATSINK (22) IN A SEPARABLE MANNER USING A PLURALITY OF COMPRESSIBLE, THERMALLY CONDUCTIVE MEMBERS (26,26'',26")(E.G., SOLDER BALLS). THESE MEMBERS ARE COMPRESSED AND PERMANENTLY DEFORMED AS PART OF THE THERMAL COUPLING.