公开(公告)号：MY114888A

公开(公告)日：2003-02-28

申请号：MYPI9501897

申请日：1995-07-06

Applicant: IBM

Inventor： COCKERILL MARTHA ASHLEY CLARK ,  MALTABES JOHN GEORGE ,  O'CONNOR LORETTA JEAN ,  VOLDMAN STEVEN HOWARD

IPC: H01L25/00 ,  H01L27/00 ,  H01L21/66 ,  H01L21/98 ,  H01L25/065

Abstract: A FABRICATION METHOD FOR MANUFACTURING A MONOLITHIC ELECTRONIC MODULE(31) COMPRISING A PLURALITY OF STACKED PLANAR EXTENDING ARRAYS (23) OF INTEGRATED CIRCUIT CHIPS (13,17). THE FABRICATION METHOD INCLUDES DICING A WAFER OF INTEGRATED CIRCUIT CHIPS INTO A PLURALITY OF ARRAYS OF INTEGRATED CIRCUIT CHIPS. THE ARRAYS OF INTEGRATED CIRCUIT CHIPS ARE THEN STACKED TO FORM AN ELECTRONIC MODULE. A METALLIZATION PATTERN (33) MAY BE DEPOSITED ON A SUBSTANTIALLY PLANAR SURFACE OF THE ELECTRONIC MODULE, AND USED TO INTERCONNECT THE VARIOUS ARRAYS OF INTEGRATED CIRCUIT CHIPS CONTAINED THEREIN. SPECIFIC DETAILS OF THE FABRICATION METHOD AND RESULTANT MULTI-CHIP PACKAGE ARE SET FORTH.

公开(公告)号：SG51705A1

公开(公告)日：1998-09-28

申请号：SG1996007295

申请日：1996-04-04

Applicant: IBM

Inventor： HUGHBANKS TIMOTHY SCOTT ,  ROBERTSON NEIL LESLIE ,  VOLDMAN STEVEN HOWARD ,  WALLASH ALBERT JOHN

IPC: G11B5/10 ,  G11B5/11 ,  G11B5/31 ,  G11B5/39 ,  G11B5/40 ,  G11B5/596 ,  G11B5/00 ,  G11B21/00

Abstract: A magneto-resistive read head (107) having a "parasitic shield" (124) provides an alternative path for currents associated with sparkovers, thus preventing such currents from damaging the read head (107). The parasitic shield (124) is provided in close proximity to a conventional magnetic shield (113, 115). The electrical potential of parasitic shield (124) is held essentially equal to the electrical potential of the sensor element (111). If charges accumulate on the conventional shield (113, 115), current will flow to the parasitic shield (124) at a lower potential than would be required for current to flow between the conventional shield (113, 115) and the sensor element (111). Alternatively, conductive spark gap devices (203, 206) are electrically coupled to sensor element leads and to each magnetic shield (201, 202). Each spark gap (203, 206) device is brought within very close proximity of the substrate (207) to provide an alternative path for charge that builds up between the sensor element (213) and the substrate (207) to be discharged. The ends of the spark gaps (203, 206) that are brought into close proximity of the substrate are preferably configured with high electric field density inducing structures which reduce the voltage required to cause a sparkover between the spark gap device (203, 206) and the substrate (207).