公开(公告)号：DE69222356T2

公开(公告)日：1998-03-26

申请号：DE69222356

申请日：1992-05-28

Applicant: IBM

Inventor： SHIRAI MASAHARU ,  YAMANAKA KIMIHIRO

IPC: H01L21/48 ,  H01L23/538 ,  H05K1/11 ,  H05K3/34 ,  H01L21/60

Abstract: An opening (15) is formed in an insulating film (14) which covers a electric line (12) formed on a substrate (11) and a pad connecting portion (13) of the electric line is exposed and a pad is constructed. In this case, the pad connecting portion is set to a size having an allowance size 2 larger than a size L of the pad to be formed. The opening is set to a size having an allowance size 2d larger than a width D of the pad connecting portion and is formed so as to cross the pad connecting portion. Even when a positional deviation occurs in an opening which is formed in an insulating film, it is permitted and pads each having a predetermined area are formed with a predetermined positional relation.