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    PRINTED WIRING BOARD, AND METHOD OF FLIP-CHIP BONDING
    3.
    发明专利
    PRINTED WIRING BOARD, AND METHOD OF FLIP-CHIP BONDING 失效

    公开(公告)号：JP2002093853A

    公开(公告)日：2002-03-29

    申请号：JP2000271237

    申请日：2000-09-07

    Applicant: IBM

    Inventor： MORI HIROYUKI ,  YAMANAKA KIMIHIRO ,  TSUKADA YUTAKA

    IPC: H05K3/34 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H05K1/02 ,  H05K3/46

    Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board for mounting thereon a semiconductor chip and to provide a method for flip-chip bonding the semiconductor chip to the printed wiring board. SOLUTION: A printed wiring board 1 for flip-chip bonding thereto a semiconductor chip 7, includes each circuit pattern 6a connected with each conductive protrusion 8 provided in each corner portion of the semiconductor chip 7 and an insulation layer 3a for holding thereon the circuit patterns 6a. Furthermore, at each portion of the insulation layer 3a which is present near each circuit pattern 6a connected with each conductive protrusion 8, each protective pad 9 corresponding to each corner portion of the semiconductor chip 7 is formed.

    4.
    发明专利
    未知

    公开(公告)号：DE69222356D1

    公开(公告)日：1997-10-30

    申请号：DE69222356

    申请日：1992-05-28

    Applicant: IBM

    Inventor： SHIRAI MASAHARU ,  YAMANAKA KIMIHIRO

    IPC: H01L21/48 ,  H01L23/538 ,  H05K1/11 ,  H05K3/34 ,  H01L21/60

    Abstract: An opening (15) is formed in an insulating film (14) which covers a electric line (12) formed on a substrate (11) and a pad connecting portion (13) of the electric line is exposed and a pad is constructed. In this case, the pad connecting portion is set to a size having an allowance size 2 larger than a size L of the pad to be formed. The opening is set to a size having an allowance size 2d larger than a width D of the pad connecting portion and is formed so as to cross the pad connecting portion. Even when a positional deviation occurs in an opening which is formed in an insulating film, it is permitted and pads each having a predetermined area are formed with a predetermined positional relation.

    Substrate provided with electric lines and its manufacturing method
    5.
    发明专利
    Substrate provided with electric lines and its manufacturing method 未知

    公开(公告)号：HK1011458A1

    公开(公告)日：1999-07-09

    申请号：HK98112231

    申请日：1998-11-24

    Applicant: IBM

    Inventor： SHIRAI MASAHARU ,  YAMANAKA KIMIHIRO

    IPC: H01L21/48 ,  H01L23/538 ,  H05K1/11 ,  H05K3/34 ,  H01L ,  H05K

    Abstract: An opening (15) is formed in an insulating film (14) which covers a electric line (12) formed on a substrate (11) and a pad connecting portion (13) of the electric line is exposed and a pad is constructed. In this case, the pad connecting portion is set to a size having an allowance size 2 larger than a size L of the pad to be formed. The opening is set to a size having an allowance size 2d larger than a width D of the pad connecting portion and is formed so as to cross the pad connecting portion. Even when a positional deviation occurs in an opening which is formed in an insulating film, it is permitted and pads each having a predetermined area are formed with a predetermined positional relation.

    Multilayer circuit board
    7.
    发明专利
    Multilayer circuit board 审中-公开
    多层电路板

    公开(公告)号：JP2003332754A

    公开(公告)日：2003-11-21

    申请号：JP2002139876

    申请日：2002-05-15

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーション

    Inventor： YAMANAKA KIMIHIRO ,  KOSAKA YOSHIYUKI ,  SUGISAWA KAZUYASU

    IPC: H05K3/28 ,  H01L23/12 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46

    CPC classification number: H05K1/0271 ,  H05K3/4602 ,  H05K2201/09354 ,  H05K2201/0959

    Abstract: PROBLEM TO BE SOLVED: To provide a multilayer circuit board in which a micro-crack or migration hardly occur even if a RFP is arranged near edges.
    SOLUTION: A multilayer circuit board 10 is provided with an inner layer 13 having an RFP 16, outer layers 14 and 15, RFP lands 19 and 20, and conductors 21 and 22. Outside edges 23 and 24 of the conductors 21 and 22 extend outward from outside edges 25 and 26 of the RFP lands 19 and 20. Even when the multilayer circuit board 10 is heated and a stress is developed near a buried through hole 16, since the conductors 21 and 22 are formed so as to cover the RFP lands 19 and 20, a reaction takes place against the stress and the occurrence of micro-cracks is suppressed. Furthermore, since the conductors intercept the permeation of moisture into the vicinity of the buried through hole from the surface, the occurrence of copper migration is suppressed.
    COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题：为了提供即使RFP布置在边缘附近也难以发生微裂纹或迁移的多层电路板。 解决方案：多层电路板10设置有具有RFP 16，外层14和15，RFP焊盘19和20以及导体21和22的内层13.导体21和22的外边缘23和24 22从RFP焊盘19和20的外边缘25和26向外延伸。即使当多层电路板10被加热并且在埋入通孔16附近产生应力时，由于导体21和22形成为覆盖 RFP平台19和20，抵抗应力发生反应，并且抑制了微裂纹的发生。 此外，由于导体阻止水分从表面渗入到埋入通孔附近，所以铜迁移的发生被抑制。 版权所有（C）2004，JPO

    THROUGH-HOLE STRUCTURE AND PRINTED BOARD CONTAINING IT
    8.
    发明专利
    THROUGH-HOLE STRUCTURE AND PRINTED BOARD CONTAINING IT 失效

    公开(公告)号：JP2002094205A

    公开(公告)日：2002-03-29

    申请号：JP2000271251

    申请日：2000-09-07

    Applicant: IBM

    Inventor： KOBAYASHI KAORU ,  MORI HIROYUKI ,  YAMANAKA KIMIHIRO

    IPC: H05K1/11 ,  H05K1/02 ,  H05K3/42

    Abstract: PROBLEM TO BE SOLVED: To provide a through-hole structure used for connecting connectors for high frequency to a printed board and to provide a printed board containing the through-hole structure. SOLUTION: The through-hole structure 2 used for connecting connectors to the printed board 1 contains a through-hole 3 for signal which is treated to become conductive for supplying signals, through-holes 4 for power which are treated to become conductive for supplying electric power, and dielectric constant adjusting sections 5 formed between the through-holes 3 and 4. The printed board 1 contains the through-hole structure 2.

    Hole forming method, and hole forming device
    9.
    发明专利
    Hole forming method, and hole forming device 审中-公开
    孔形成方法和孔形成装置

    公开(公告)号：JP2004243404A

    公开(公告)日：2004-09-02

    申请号：JP2003038532

    申请日：2003-02-17

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

    Inventor： YASUDA MASAHARU ,  MAEDA YOJI ,  YAMANAKA KIMIHIRO ,  TSUKADA YUTAKA

    IPC: B23K26/00 ,  B23K26/04 ,  B23K26/38 ,  B23K101/42 ,  H05K3/00

    CPC classification number: B23K26/042 ,  B23K26/382 ,  B23K26/384 ,  B23K2201/42 ,  B23K2203/50 ,  H05K3/0026

    Abstract: PROBLEM TO BE SOLVED: To provide a hole forming method and a hole forming device for forming a hole in which the hole diameters of the upper part and the bottom part are the same in hole forming using a laser. SOLUTION: The hole forming device is composed in such a manner that a laser 10 is vertically irradiated to a substrate 12, and a hole with a taper shape in which the hole diameter in the bottom part is smaller than that in the upper part. Further, in the hole forming device, the tapered hole is irradiated with the laser 10 so as to be tilted to the substrate 12, and the hole diameters in the upper part and the bottom part are made uniform. By applying the laser 10 so as to be tilted in this way, a straight hole 14 can be formed. COPYRIGHT: (C)2004,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种用于形成孔的孔形成方法和孔形成装置，其中上部和下部的孔直径在使用激光的孔形成中相同。 解决方案：孔形成装置以激光器10垂直照射到基板12的方式构成，并且具有锥形形状的孔，其中底部的孔直径小于上部的孔直径 部分。 此外，在孔形成装置中，锥形孔用激光器10照射以与基板12倾斜，并使上部和底部的孔直径均匀。 通过以这种方式施加激光10以使其倾斜，可以形成直孔14。 版权所有（C）2004，JPO＆NCIPI

    WIRING BOARD AND MANUFACTURE THEREOF
    10.
    发明专利
    WIRING BOARD AND MANUFACTURE THEREOF 失效

    公开(公告)号：JPH04354398A

    公开(公告)日：1992-12-08

    申请号：JP15612391

    申请日：1991-05-31

    Applicant: IBM

    Inventor： SHIRAI MASAHARU ,  YAMANAKA KIMIHIRO

    IPC: H01L21/48 ,  H01L23/538 ,  H05K1/11 ,  H05K3/34

    Abstract: PURPOSE: To form pads having a prescribed area with prescribed positional relation by allowing positional deviations generated on apertures formed on an insulating film. CONSTITUTION: Apertures 15 are formed on an insulating film 14 covering wirings formed on a substrate 11 and pad constitution parts 13 are exposed to constitute pads. In this case, each pad constitution part 13 has an excess dimension 21 exceeding the dimension L of each pad and each aperture 15 has an excess dimension 2d exceeding the width of each pad constitution part 3 and is formed so as to cross the pad constitution part 13.

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