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    TRANSIENT THERMAL MANAGEMENT SYSTEMS FOR SEMICONDUCTOR DEVICES
    11.
    发明申请
    TRANSIENT THERMAL MANAGEMENT SYSTEMS FOR SEMICONDUCTOR DEVICES 审中-公开
    用于半导体器件的瞬态热管理系统

    公开(公告)号：WO2013100913A1

    公开(公告)日：2013-07-04

    申请号：PCT/US2011/067422

    申请日：2011-12-27

    Applicant: INTEL CORPORATION ,  AHUJA, Sandeep ,  SAUCIUC, Ioan ,  SMITH, Susan F.

    Inventor： AHUJA, Sandeep ,  SAUCIUC, Ioan ,  SMITH, Susan F.

    IPC: H01L21/02

    CPC classification number: H01L23/473 ,  G06F1/206 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Thermal management systems for semiconductor devices are provided. Embodiments of the invention provide two or more liquid cooling subsystems that are each capable of providing active cooling to one or more semiconductor devices, such as packaged processors. In operation, a first liquid cooling subsystem can provide active cooling to the semiconductor device(s) while the second cooling subsystem is circulating a heat transfer fluid within its own subsystem. The second liquid cooling subsystem can be then switched into operation and provides active cooling to the semiconductor device(s) while the first cooling subsystem is circulating heat transfer fluid within its own subsystem. In alternate embodiments, the heat transfer fluid remains in the subsystem, but does not circulate within the subsystem when the subsystem is not providing cooling to the semiconductor device(s). The subsystems comprise heat dissipation units. The switching between cooling systems allows the semiconductor device(s) to be maintained at a lower operating temperature than if switching between cooling subsystems were not employed.

    Abstract translation: 提供半导体器件的热管理系统。 本发明的实施例提供两个或更多个液体冷却子系统，每个液体冷却子系统能够向一个或多个半导体器件（例如封装的处理器）提供主动冷却。 在操作中，第一液体冷却子系统可以向半导体器件提供主动冷却，而第二冷却子系统在其自身子系统内循环传热流体。 然后可以将第二液体冷却子系统切换到操作中，并且在第一冷却子系统在其自己的子系统内循环传热流体时，向半导体装置提供主动冷却。 在替代实施例中，传热流体保留在子系统中，但是当子系统不向半导体器件提供冷却时，该子系统不会在子系统内循环。 子系统包括散热单元。 冷却系统之间的切换允许半导体器件保持在比不使用冷却子系统之间切换的较低的工作温度。

    APPARATUS AND METHOD TO PROVIDE A THERMAL PARAMETER REPORT FOR A MULTI-CHIP PACKAGE
    13.
    发明公开
    APPARATUS AND METHOD TO PROVIDE A THERMAL PARAMETER REPORT FOR A MULTI-CHIP PACKAGE 审中-公开

    公开(公告)号：EP3789846A1

    公开(公告)日：2021-03-10

    申请号：EP20203849.3

    申请日：2015-11-19

    Applicant: INTEL Corporation

    Inventor： THOMAS, Tessil ,  STEINBRECHER, Robin A. ,  AHUJA, Sandeep ,  BERKTOLD, Michael ,  KAM, Timothy Y. ,  CHIN, Howard ,  KANDULA, Phani Kumar ,  SISTLA, Krishnakanth V.

    IPC: G06F1/32 ,  G06F1/26 ,  G06F1/20

    Abstract: The present disclosure provides an apparatus comprising a multi-die package substrate, a plurality of dies mounted on the multi-die package substrate, and a power management unit to execute thermal management firmware to manage temperatures of the plurality of dies. The plurality of dies comprises a first die and a second die. The first die comprises a first plurality of cores to execute instructions and process data, a first plurality of integrated voltage regulators, the first plurality of integrated voltage regulators associated with respective cores of the first plurality of cores, a shared cache coupled to the first plurality of cores, and a first plurality of temperature sensors associated with the first plurality of cores to generate first temperature measurement data. The second die coupled to the first die over a bi-directional interconnect comprises a second temperature sensor integral to the second die to generate second temperature measurement data. The power management unit is to periodically read temperature values from the plurality of dies in accordance with a specified time period, including temperature values from the first plurality of temperature sensors, the second temperature sensor, and additional temperature values from additional dies of the plurality of dies, and process the temperature values to determine a thermal management result, wherein processing the temperature values includes determining a maximum temperature value. A clock frequency of one or more of the plurality of dies is to be reduced based, at least in part, on the thermal management result.

    IMMERSION COOLING SYSTEM WITH MULTIPLE COOLING LIQUIDS
    15.
    发明公开
    IMMERSION COOLING SYSTEM WITH MULTIPLE COOLING LIQUIDS 审中-公开

    公开(公告)号：EP4531511A1

    公开(公告)日：2025-04-02

    申请号：EP24190436.6

    申请日：2024-07-23

    Applicant: INTEL Corporation

    Inventor： AHUJA, Sandeep ,  CHANG, Je-Young ,  KLEMES, Max ,  MITRA, Arpita

    IPC: H05K7/20

    Abstract: An apparatus is described. The apparatus includes a chamber to contain one or more electronic components, a first liquid and a second liquid. The electronics to be immersed in the second liquid. The first liquid having less density than the second liquid so that the first liquid floats above the second liquid. The first liquid to return second liquid molecules received from the second liquid back to the second liquid. The chamber comprising a first fluidic channel to drain the first liquid from the chamber while the second liquid is within the chamber.

    APPARATUS AND METHOD TO PROVIDE A THERMAL PARAMETER REPORT FOR A MULTI-CHIP PACKAGE
    16.
    发明公开
    APPARATUS AND METHOD TO PROVIDE A THERMAL PARAMETER REPORT FOR A MULTI-CHIP PACKAGE 审中-公开
    提供用于多芯片封装的热参数报告的装置和方法

    公开(公告)号：EP3237999A1

    公开(公告)日：2017-11-01

    申请号：EP15873930.0

    申请日：2015-11-19

    Applicant: Intel Corporation

    Inventor： THOMAS, Tessil ,  STEINBRECHER, Robin A. ,  AHUJA, Sandeep ,  BERKTOLD, Michael ,  KAM, Timothy Y. ,  CHIN, Howard ,  KANDULA, Phani Kumar ,  SISTLA, Krishnakanth V.

    IPC: G06F1/32 ,  G06F1/26

    CPC classification number: G06F1/206 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F3/0412 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

    Abstract: In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.

    Abstract translation: 在一个实施例中，处理器包括至少一个核心和电源管理逻辑。 功率管理逻辑将从包括处理器的封装内的多个管芯接收温度数据，并且确定多个温度控制余量中的最小温度控制余量。 每个温度控制余量将基于与管芯相关联的相应热控制温度以及还基于与管芯相关联的相应温度数据来确定。 电源管理逻辑还可生成包含最小温度控制余量的热报告，并存储热报告。 描述并要求保护其他实施例。

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