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    TECHNOLOGIES FOR PROCESSOR LOADING MECHANISMS
    2.
    发明申请
    TECHNOLOGIES FOR PROCESSOR LOADING MECHANISMS 审中-公开

    公开(公告)号：WO2022182449A1

    公开(公告)日：2022-09-01

    申请号：PCT/US2022/013499

    申请日：2022-01-24

    Applicant: INTEL CORPORATION

    Inventor： MIELE, Ralph V. ,  GENG, Phil ,  LIU, Mengqi ,  SHIA, David ,  AHUJA, Sandeep ,  BUDDRIUS, Eric W. ,  SMALLEY, Jeffory L.

    IPC: H01L23/40

    Abstract: Techniques for processor loading mechanisms are disclosed. In the illustrative embodiment, a heat sink is in contact with a top surface of a processor, applying a downward force on the processor. A load plate is also in contact with the processor, applying a downward force to the processor as well. The combination of the downward force from the load plate and the heat sink keep the processor in good physical contact with pins of the processor socket. The heat sink has enough force applied to the processor to be in good thermal contact with the processor without applying higher stress to the heat sink. The load plate can apply force to the processor without regard to the thermal characteristics of the load plate. Other embodiments are envisioned and described.

    MULTI-PIECE HEAT SPREADER FOR MULTI-CHIP PACKAGE
    3.
    发明申请
    MULTI-PIECE HEAT SPREADER FOR MULTI-CHIP PACKAGE 审中-公开

    公开(公告)号：WO2019066862A1

    公开(公告)日：2019-04-04

    申请号：PCT/US2017/054058

    申请日：2017-09-28

    Applicant: INTEL CORPORATION

    Inventor： AHUJA, Sandeep ,  CHANG, Je-young ,  GENG, Phil ,  KOTHARI, Shrenik ,  LOZANO SANCHEZ, Francisco Gabriel

    IPC: H01L23/367 ,  H01L23/40

    Abstract: A microelectronic device may include a substrate, a first component, a second component, a slug, a heat spreader, and a heatsink. The substrate may include a plurality of electrically conductive elements. The first component may be coupled to the substrate. The second component may be coupled to the substrate. The slug may be thermally coupled to the second component. The heat spreader may be in contact with the substrate, where the heat spreader may be thermally coupled to the first component. The heatsink may be thermally coupled to the heat spreader and the slug.

    DETERMINING THERMAL MARGINS IN A MULTI-DIE PROCESSOR
    4.
    发明申请
    DETERMINING THERMAL MARGINS IN A MULTI-DIE PROCESSOR 审中-公开
    确定多模处理器中的热边距

    公开(公告)号：WO2017171998A1

    公开(公告)日：2017-10-05

    申请号：PCT/US2017/014835

    申请日：2017-01-25

    Applicant: INTEL CORPORATION

    Inventor： AHUJA, Sandeep ,  RIDGE, Jeremy ,  BERKTOLD, Michael

    IPC: G06F1/20 ,  G05D23/19 ,  G06F1/32 ,  G06F9/50

    CPC classification number: G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3243 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/152 ,  Y02D10/16 ,  Y02D10/172 ,  Y02D50/20

    Abstract: In one embodiment, a processor comprises: a first die including at least one core and at least one first die thermal sensor; a second die including at least one memory and at least one second die thermal sensor; and a thermal controller to receive first thermal data from the at least one first die thermal sensor and second thermal data from the at least one second die thermal sensor, calculate a first thermal margin for the first die based at least in part on the first thermal data and a first thermal loadline for the first die and calculate a second thermal margin for the second die based at least in part on the second thermal data and a second thermal loadline for the second die. Other embodiments are described and claimed.

    Abstract translation: 在一个实施例中，处理器包括：包括至少一个核心和至少一个第一管芯热传感器的第一管芯; 包括至少一个存储器和至少一个第二管芯热传感器的第二管芯; 以及热控制器，其接收来自所述至少一个第一管芯热传感器的第一热数据和来自所述至少一个第二管芯热传感器的第二热数据，至少部分地基于所述第一热量来计算所述第一管芯的第一热余量 数据和第一热负载线，并且至少部分地基于用于第二管芯的第二热数据和第二热负载线来计算第二管芯的第二热余量。 描述并要求保护其他实施例。

    MAINTENANCE PREDICTION OF ELECTRONIC DEVICES USING PERIODIC THERMAL EVALUATION
    5.
    发明申请
    MAINTENANCE PREDICTION OF ELECTRONIC DEVICES USING PERIODIC THERMAL EVALUATION 审中-公开
    使用定期热评估的电子设备的维护预测

    公开(公告)号：WO2014105634A1

    公开(公告)日：2014-07-03

    申请号：PCT/US2013/076549

    申请日：2013-12-19

    Applicant: INTEL CORPORATION ,  STEINBRECHER, Robin A. ,  AHUJA, Nishi ,  AHUJA, Sandeep

    Inventor： STEINBRECHER, Robin A. ,  AHUJA, Nishi ,  AHUJA, Sandeep

    IPC: G06F1/20

    CPC classification number: H05K7/20836

    Abstract: A method for determining whether to perform maintenance for an electronic device includes generating a baseline characterization of thermal performance for a heat-generating component of the electronic device at a baseline date. The method also includes generating an assessment characterization of the thermal performance at an assessment date after the baseline date. The method further includes generating a historical trend that includes the baseline characterization and the assessment characterization. Additionally, the method includes determining whether to perform maintenance for the heat-generating component based on the historical trend and a specified maintenance parameter.

    Abstract translation: 一种用于确定是否对电子设备进行维护的方法包括在基线日期产生电子设备的发热部件的热性能的基线表征。 该方法还包括在基准日之后的评估日产生热性能的评估表征。 该方法还包括产生包括基线表征和评估表征的历史趋势。 此外，该方法包括基于历史趋势和指定的维护参数确定是否对发热部件进行维护。

    SYSTEM, APPARATUS AND METHOD FOR CONTROLLABLE PROCESSOR CONFIGURATION BASED ON A TEMPERATURE SPECIFICATION
    6.
    发明申请
    SYSTEM, APPARATUS AND METHOD FOR CONTROLLABLE PROCESSOR CONFIGURATION BASED ON A TEMPERATURE SPECIFICATION 审中-公开

    公开(公告)号：WO2019190683A1

    公开(公告)日：2019-10-03

    申请号：PCT/US2019/019946

    申请日：2019-02-28

    Applicant: INTEL CORPORATION

    Inventor： AHUJA, Sandeep ,  GUPTA, Nikhil ,  SRINIVASAN, Vasudevan

    IPC: G06F1/20 ,  G06F1/32

    Abstract: In one embodiment, a processor includes a non-volatile storage to store a plurality of configurations for the processor, the non-volatile storage including a plurality of entries to store configuration information for the processor for one of the plurality of configurations, the configuration information including at least one of a guaranteed operating frequency and a core count, at least one of the entries to store the core count. The processor further includes a power controller to control the processor to operate at one of the plurality of configurations based at least in part on a selected thermal set point of a plurality of thermal set points of the processor, each of the plurality of thermal set points associated with one of the configurations. Other embodiments are described and claimed.

    THERMAL THROTTLING OF ELECTRONIC DEVICES
    7.
    发明申请
    THERMAL THROTTLING OF ELECTRONIC DEVICES 审中-公开
    电子设备的热转折

    公开(公告)号：WO2016209348A1

    公开(公告)日：2016-12-29

    申请号：PCT/US2016/028849

    申请日：2016-04-22

    Applicant: INTEL CORPORATION

    Inventor： KAM, Timothy Y. ,  AHUJA, Sandeep ,  AGARWAL, Rajat ,  SODANI, Avinash ,  SUH, Jinho ,  CHINTHAMANI, Meenakshisundaram

    IPC: G06F1/20

    CPC classification number: G06F1/206 ,  G06F1/3206 ,  G06F1/3225 ,  G06F1/3234 ,  G06F1/324 ,  G06F1/3275 ,  G06F2212/1028 ,  Y02D10/126 ,  Y02D10/14 ,  Y02D10/16

    Abstract: Disclosed herein is a computing device configured to implement thermal throttling of a component of the computing device. The computing device includes an electronic component and a temperature sensor thermally coupled to the electronic component. The computing device also includes a thermal management controller to receive a temperature measurement from the temperature sensor and generate a throttling factor for the electronic component. If the temperature measurement is greater than a specified threshold, the throttling factor is to reduce performance of the electronic component to be at least the performance guarantee for the electronic component.

    Abstract translation: 这里公开了一种被配置为实现计算设备的部件的热调节的计算设备。 计算设备包括热耦合到电子部件的电子部件和温度传感器。 计算设备还包括热管理控制器，用于从温度传感器接收温度测量并产生电子部件的节流因子。 如果温度测量值大于指定的阈值，则节流因素是将电子元件的性能降至至少为电子元件的性能保证。

    APPARATUS AND METHOD TO PROVIDE A THERMAL PARAMETER REPORT FOR A MULTI-CHIP PACKAGE
    8.
    发明申请
    APPARATUS AND METHOD TO PROVIDE A THERMAL PARAMETER REPORT FOR A MULTI-CHIP PACKAGE 审中-公开
    提供多芯片封装的热参数报告的装置和方法

    公开(公告)号：WO2016105710A1

    公开(公告)日：2016-06-30

    申请号：PCT/US2015/061517

    申请日：2015-11-19

    Applicant: INTEL CORPORATION

    Inventor： THOMAS, Tessil ,  STEINBRECHER, Robin A. ,  AHUJA, Sandeep ,  BERKTOLD, Michael ,  KAM, Timothy Y. ,  CHIN, Howard ,  KANDULA, Phani Kumar ,  SISTLA, Krishnakanth V.

    IPC: G06F1/32 ,  G06F1/26

    CPC classification number: G06F1/206 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F3/0412 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

    Abstract: In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.

    Abstract translation: 在一个实施例中，处理器包括至少一个核心和电源管理逻辑。 电源管理逻辑用于从包括处理器的封装内的多个管芯接收温度数据，并且确定多个温度控制裕度的最小温度控制余量。 每个温度控制余量将基于与管芯相关联的相应的热控制温度并且还基于与管芯相关联的相应的温度数据来确定。 电源管理逻辑还可以生成包含最小温度控制余量的热报告，并存储热报告。 描述和要求保护其他实施例。

    SECURING THERMAL MANAGEMENT PARAMETERS IN FIRMWARE FROM CYBER ATTACK
    10.
    发明申请
    SECURING THERMAL MANAGEMENT PARAMETERS IN FIRMWARE FROM CYBER ATTACK 审中-公开
    从CYBER攻击中保护固件的热管理参数

    公开(公告)号：WO2013147760A1

    公开(公告)日：2013-10-03

    申请号：PCT/US2012/030861

    申请日：2012-03-28

    Applicant: INTEL CORPORATION ,  AHUJA, Sandeep ,  STEINBRECHER, Robin ,  RICHARDSON, David

    Inventor： AHUJA, Sandeep ,  STEINBRECHER, Robin ,  RICHARDSON, David

    IPC: G06F21/00 ,  G06F21/20

    CPC classification number: G06F21/554 ,  G06F1/206 ,  G06F21/00 ,  G06F21/572 ,  G06F2221/034 ,  Y02D10/16

    Abstract: Methods and systems may provide for identifying a thermal management setting in a computing system, and comparing the thermal management setting to valid configuration information. In addition, the thermal management setting may be modified if it does not comply with the valid configuration information, wherein the modification can cause the thermal management setting to comply with the valid configuration information. Additionally, a threat risk notification can be initiated in order to notify users of the non-compliance.

    Abstract translation: 方法和系统可以提供用于识别计算系统中的热管理设置，并将热管理设置与有效配置信息进行比较。 此外，如果热管理设置不符合有效配置信息，则可以修改热管理设置，其中修改可以使得热管理设置符合有效配置信息。 此外，可以启动威胁风险通知，以通知用户不遵守规定。

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