公开(公告)号：EP4268278A1

公开(公告)日：2023-11-01

申请号：EP20967194.0

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： ACIKALIN, Tolga ,  YANG, Tae, Young ,  CHOUDHURY, Debabani ,  YAMADA, Shuhei ,  DOOSTNEJAD, Roya ,  NIKOPOUR, Hosein ,  KIPNIS, Issy ,  ORHAN, Oner ,  RAHMAN, Mehnaz ,  FOUST, Kenneth P. ,  HULL, Christopher, D. ,  KAMGAING, Telesphor ,  KARHADE, Omkar ,  PELLERANO, Stefano ,  SAGAZIO, Peter ,  VADLAMANI, Sai

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/532 ,  H01L23/66 ,  H01L23/498 ,  H01L23/48 ,  H01L23/522 ,  H01L23/538 ,  H01L25/065 ,  H01L23/50

公开(公告)号：EP3716084A1

公开(公告)日：2020-09-30

申请号：EP20157955.4

申请日：2020-02-18

Applicant: INTEL Corporation

Inventor： ZHU, Zhenyu ,  HUNSAKER, Mikal ,  VADIVELU, Karthi R. ,  BHATT, Rahul ,  FOUST, Kenneth P. ,  BHASKAR, Rajesh ,  SRIVASTAVA, Amit Kumar

IPC: G06F13/16 ,  G06F13/28 ,  G06F13/40 ,  G06F13/38 ,  G06F3/06 ,  G06F13/42

Abstract: In one embodiment, a flash sharing controller (220) is to enable a plurality of components (255, 260, 272, 274) of a platform (200) to share a flash memory (230). The flash sharing controller (220) may include: a flash sharing class layer including a configuration controller to configure the plurality of components (255, 260, 272, 274) to be flash master devices and configure a flash sharing slave device for the flash memory (230); and a physical layer coupled to the flash sharing class layer to communicate with the plurality of components (255, 260, 272, 274) via a bus (240). Other embodiments are described and claimed.