公开(公告)号：EP3726658A1

公开(公告)日：2020-10-21

申请号：EP20161584.6

申请日：2020-03-06

Applicant: Intel Corporation

Inventor： LEE, Jaejin ,  LIAO, Jun ,  LI, Xiang ,  VERGIS, George ,  COX, Christopher E.

IPC: H01R12/70 ,  H01R13/6471 ,  H01R12/73 ,  H01R12/72

Abstract: Embodiments of the present disclosure relate to a connector to connect a printed circuit board (PCB) with a memory device, where the connector includes a housing couplable with the PCB; a first signal pin coupled with the housing, where the first signal pin includes a first portion that includes a first curve, and a second portion that extends from the first portion and includes a second curve; and a second signal pin coupled with the housing, where the second signal pin includes a third portion that includes a third curve, and a fourth portion that extends from the third portion and includes a fourth curve, where the first curve is curved in a first opposite direction relative to the third curve, and where the second curve is curved in a second opposite direction relative to the fourth curve.

公开(公告)号：EP3232451A1

公开(公告)日：2017-10-18

申请号：EP17158552.4

申请日：2017-02-28

Applicant: INTEL Corporation

Inventor： LEE, Jaejin ,  CHEN, Chung-Hao J. ,  YAO, Zhen ,  YANG, Songnan ,  ROSENFELD, Jonathan ,  KASTURI, Sreenivas

IPC: H01F27/36 ,  H01F38/14 ,  H02J5/00 ,  H02J7/02 ,  H02J50/10

CPC classification number: H02J7/025 ,  H01F27/36 ,  H01F38/14 ,  H02J7/04 ,  H02J50/12 ,  H04B5/0037

Abstract: Techniques for focusing the energy radiated by a wireless power transmitting unit are described. An example power transmitting unit includes a transmit coil configured to generate a magnetic field to wirelessly power a device within an active wireless charging area. The power transmitting unit also includes a power generating circuitry to deliver current to the transmit coil to generate the magnetic field. The power transmitting unit also includes a patch array disposed in parallel with the transmit coil to reduce the strength of the magnetic field at frequencies outside of the operating frequency during operation of the power transmitting unit.

Abstract translation: 描述了用于聚焦由无线电力发射单元辐射的能量的技术。 示例功率发射单元包括发射线圈，该发射线圈被配置为产生磁场以无线地为有源无线充电区域内的设备供电。 功率发射单元还包括功率发生电路，用于将电流递送到发射线圈以产生磁场。 功率发送单元还包括与发送线圈并联设置的贴片阵列，以在功率发送单元的操作期间降低在工作频率之外的频率处的磁场强度。

公开(公告)号：EP3716010A1

公开(公告)日：2020-09-30

申请号：EP20158317.6

申请日：2020-02-19

Applicant: Intel Corporation

Inventor： LEE, Jaejin ,  LIAO, Jun ,  LI, Xiang ,  COX, Christopher

IPC: G06F1/18 ,  H05K9/00 ,  H01R13/6595 ,  H01R13/6596 ,  H05K1/14 ,  H05K1/02

Abstract: A device includes a printed circuit board (PCB) and a shield for the PCB. The shield can reduce high frequency electromagnetic frequency (EMF) noise generated by one or more components of the PCB. The PCB includes pads to interface with a corresponding connector. For example, for a dual inline memory module (DIMM) PCB, the PCB includes pads to insert into a DIMM connector. The shield includes a gap in its perimeter that aligns with clips in the corresponding connector. The gaps will correspond to similar features of the PCB that interface with the corresponding connector to allow the shield to attach to the PCB. The shield includes lock fingers to extend from a connector-facing edge of the shield to interface with the corresponding connector to align the shield with the corresponding connector.

公开(公告)号：EP3232451B1

公开(公告)日：2019-09-04

申请号：EP17158552.4

申请日：2017-02-28

Applicant: Intel Corporation

Inventor： LEE, Jaejin ,  CHEN, Chung-Hao J. ,  YAO, Zhen ,  YANG, Songnan ,  ROSENFELD, Jonathan ,  KASTURI, Sreenivas

IPC: H01F38/14 ,  H01F27/36 ,  H04B5/00 ,  H02J50/12 ,  H02J7/02

公开(公告)号：EP4082077A1

公开(公告)日：2022-11-02

申请号：EP19957186.0

申请日：2019-12-27

Applicant: Intel Corporation

Inventor： HAN, Dong-Ho ,  KULKARNI, Shantanu ,  LARSEN, Denica ,  LEE, Jaejin ,  LEE, Kwan Ho

IPC: H01Q1/52 ,  H01Q1/24

公开(公告)号：EP4017233A1

公开(公告)日：2022-06-22

申请号：EP21198671.6

申请日：2021-09-23

Applicant: INTEL Corporation

Inventor： LIU, Kae-An ,  LEE, Jaejin ,  BROWNING, David W.

IPC: H05K7/20 ,  H05K9/00 ,  H01P1/211 ,  F28D15/02 ,  H01Q1/00 ,  H01Q1/02 ,  H01Q1/52

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a heat source on the substrate, and a heat pipe. The heat pipe includes a plurality of bumps that extend from the heat pipe towards the substrate but do not come into contact with the substrate. The bumps are configured to help mitigate radio frequency interference in the electronic device. More specifically, the bumps can be configured to provide a resonant frequency in a specific radio frequency band and act as a radio frequency filter.

公开(公告)号：EP3882967A3

公开(公告)日：2021-09-29

申请号：EP20215675.8

申请日：2020-12-18

Applicant: Intel Corporation

Inventor： LEE, Jaejin ,  COX, Christopher E. ,  LIAO, Jun ,  LI, Xiang

IPC: H01L23/552 ,  H01L23/31

Abstract: A memory device includes a grounded molding. The memory device includes a substrate having a first surface for a memory die, where the substrate has ground vias through substrate to connect to a ground reference. The substrate has a ball grid array (BGA) on the opposite surface, including perimeter balls to connect to ground connections. The grounded molding includes an electrically conductive epoxy mold to cover the memory die, where the electrical conductivity of the molding, with the molding grounded can provide radio frequency interference (RFI) shielding.

公开(公告)号：EP4241383A1

公开(公告)日：2023-09-13

申请号：EP20960954.4

申请日：2020-11-03

Applicant: Intel Corporation

Inventor： THAKUR, Jayprakash ,  DEGANI, Ofir ,  KRONFELD, Ronen ,  RESHEF, Ehud ,  SUH, Seong-Youp, J. ,  SHOSHANA, Tal ,  MANN, Eytan ,  TAMRAKAR, Maruti ,  RAVI, Ashoke ,  CAMACHO PEREZ, Jose Rodrigo ,  HUUSARI, Timo Sakari ,  BOROKHOVICH, Eli ,  RUBIN, Amir ,  BENJAMIN, Ofer ,  YANG, Tae Young ,  SKINNER, Harry ,  LEE, Kwan Ho ,  LEE, Jaejin ,  HAN, Dong-Ho ,  GROSS, Shahar ,  SEGEV, Eran ,  KAMGAING, Telesphor

IPC: H04B1/50 ,  H04B1/00 ,  H04B1/44 ,  H01Q1/24

公开(公告)号：EP4016245A1

公开(公告)日：2022-06-22

申请号：EP21198626.0

申请日：2021-09-23

Applicant: Intel Corporation

Inventor： LEE, Jaejin ,  PANAKKAL, James ,  LIM, Min Suet ,  PIOUS, Aiswarya M.

IPC: G06F1/18 ,  H05K7/20 ,  H05K9/00

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to EMI shielding and thermal conduction without using any surface area of a PCB. Embodiments of the EMI shield may include a planar top, with one or more walls extending from the planar top to a bottom surface of the PCB, the PCB having a top surface disposed between the bottom surface of the PCB and the planar top. A ground of the PCB may electrically couple with the one or more walls. The bottom of the walls may couple with an EMI gasket applied to a bottom chassis to increase the volume of EMI shielding. Other embodiments may be described and/or claimed.