公开(公告)号：WO2018093360A1

公开(公告)日：2018-05-24

申请号：PCT/US2016/062185

申请日：2016-11-16

Applicant: INTEL CORPORATION ,  WU, Jr-Wei ,  VERMA, Chetan ,  PIOUS, Aiswarya M.

Inventor： WU, Jr-Wei ,  VERMA, Chetan ,  PIOUS, Aiswarya M.

IPC: H02J7/02 ,  H02J50/00 ,  G02B27/01

Abstract: System and techniques for wireless charging of a portable virtual reality (VR) host system are described herein. The present subject matter provides various examples to power a portable VR host system that allows for free movement by the user. In various embodiments the present subject matter provides connections on the footwear of the user that supply electrical power to a VR host worn by the user. In various examples, a connection technology is employed to provide connections between the user wearing the VR host system and conductive mats, plates, or flooring that are powered to provide electrical power to the VR host system via connections to the user's apparel when standing. Other forms of connection technology may be employed, such as inductive wireless technology or radio frequency signal technology that uses wireless power coils or antennae to receive power and provide it to the VR host worn by the user.

公开(公告)号：EP4020130A1

公开(公告)日：2022-06-29

申请号：EP21198562.7

申请日：2021-09-23

Applicant: INTEL Corporation

Inventor： PIOUS, Aiswarya M. ,  JAMES, Raji ,  ALAPARTHI, Phani K. ,  VERGIS, George ,  NALE, Bill ,  GANGULY, Konika

IPC: G06F1/3225 ,  G06F1/3234 ,  G06F1/3296 ,  G11C5/04 ,  G11C5/14 ,  G11C11/4074

Abstract: Examples described herein relate to a device that includes: a first power rail to provide a signal from a power source to a reference supply voltage pin of a memory controller; a second power rail to provide a signal from the power source to an output buffer pin of the memory controller and to an output buffer pin of a central processing unit (CPU). In some examples, the second power rail is separate from the first power rail, during a high power state, the power source is to supply a same voltage to each of the reference supply voltage pin, the output buffer pin of the memory controller, and the output buffer pin of the CPU, and during a connected standby state, the power source is to reduce voltage provided to the output buffer pin of the memory controller and the output buffer pin of the CPU using the second power rail and maintain a voltage provided to the reference supply voltage pin.

公开(公告)号：EP4123420A1

公开(公告)日：2023-01-25

申请号：EP22161808.5

申请日：2022-03-14

Applicant: INTEL Corporation

Inventor： SINGH, Navneet Kumar ,  ALVA, Samarth ,  KANIVIHALLI, Raghavendra S. ,  PIOUS, Aiswarya M. ,  RAO, Samantha ,  SINGH, Bijendra

IPC: G06F1/20 ,  H01B7/42

Abstract: An air mover external to a mobile computing device provides enhanced cooling to the device by generating forced air delivered to the device via cooling channels connected to openings in the device chassis. If the mobile computing device is passively cooled (is a fanless device), the enhanced cooling can enable the device or device components to operate at a higher power consumption level without exceeding device/component thermal limits or for features that consume high amounts of power (e.g., fast charging) to be incorporated into the device. The air mover can be integrated into or attached to a cable that provides power to the mobile computing device. The air mover can be powered by the cable. The air mover can dynamically adjust the flow rate of the forced air based on device/component performance information (temperature, power consumption, current consumption) or operational state information of the device.

公开(公告)号：EP4016245A1

公开(公告)日：2022-06-22

申请号：EP21198626.0

申请日：2021-09-23

Applicant: Intel Corporation

Inventor： LEE, Jaejin ,  PANAKKAL, James ,  LIM, Min Suet ,  PIOUS, Aiswarya M.

IPC: G06F1/18 ,  H05K7/20 ,  H05K9/00

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to EMI shielding and thermal conduction without using any surface area of a PCB. Embodiments of the EMI shield may include a planar top, with one or more walls extending from the planar top to a bottom surface of the PCB, the PCB having a top surface disposed between the bottom surface of the PCB and the planar top. A ground of the PCB may electrically couple with the one or more walls. The bottom of the walls may couple with an EMI gasket applied to a bottom chassis to increase the volume of EMI shielding. Other embodiments may be described and/or claimed.