公开(公告)号：US20160283375A1

公开(公告)日：2016-09-29

申请号：US14670578

申请日：2015-03-27

Applicant: Intel Corporation

Inventor： Debendra Das Sharma ,  Michelle C. Jen ,  Brian S. Morris

IPC: G06F12/08 ,  G06F13/16 ,  G06F13/42 ,  G06F3/06

CPC classification number: G06F12/084 ,  G06F3/061 ,  G06F3/0635 ,  G06F3/0673 ,  G06F12/0806 ,  G06F12/0808 ,  G06F13/1673 ,  G06F13/4282 ,  G06F2212/1016 ,  G06F2212/60 ,  G06F2212/62

Abstract: A shared memory controller receives a flit from another first shared memory controller over a shared memory link, where the flit includes a node identifier (ID) field and an address of a particular line of the shared memory. The node ID field identifies that the first shared memory controller corresponds to a source of the flit. Further, a second shared memory controller is determined from at least the address field of the flit, where the second shared memory controller is connected to a memory element corresponding to the particular line. The flit is forwarded to the second shared memory controller using a shared memory link according to a routing path

Abstract translation: 共享存储器控制器通过共享存储器链路从另一个第一共享存储器控制器接收飞行，其中，飞行包括节点标识符（ID）字段和共享存储器的特定行的地址。 节点ID字段标识第一个共享存储器控制器对应于一个源的源。 此外，从至少第二共享存储器控制器的地址字段确定第二共享存储器控制器，其中第二共享存储器控制器连接到对应于特定行的存储器元件。 根据路由路径，使用共享存储器链路将闪存转发到第二共享存储器控制器

公开(公告)号：US11755486B2

公开(公告)日：2023-09-12

申请号：US17236692

申请日：2021-04-21

Applicant: Intel Corporation

Inventor： Debendra Das Sharma ,  Michelle C. Jen ,  Brian S. Morris

IPC: G06F12/00 ,  G06F12/084 ,  G06F3/06 ,  G06F13/16 ,  G06F13/42 ,  G06F12/0806 ,  G06F12/0808

CPC classification number: G06F12/084 ,  G06F3/061 ,  G06F3/0635 ,  G06F3/0673 ,  G06F12/0806 ,  G06F12/0808 ,  G06F13/1673 ,  G06F13/4282 ,  G06F2212/1016 ,  G06F2212/60 ,  G06F2212/62

Abstract: A shared memory controller receives a flit from another first shared memory controller over a shared memory link, where the flit includes a node identifier (ID) field and an address of a particular line of the shared memory. The node ID field identifies that the first shared memory controller corresponds to a source of the flit. Further, a second shared memory controller is determined from at least the address field of the flit, where the second shared memory controller is connected to a memory element corresponding to the particular line. The flit is forwarded to the second shared memory controller using a shared memory link according to a routing path.

公开(公告)号：US20220012203A1

公开(公告)日：2022-01-13

申请号：US17485337

申请日：2021-09-25

Applicant: Intel Corporation

Inventor： Debendra Das Sharma ,  Michelle C. Jen ,  Prahladachar Jayaprakash Bharadwaj ,  Bruce A. Tennant ,  Mahesh Wagh

IPC: G06F13/40 ,  G06F13/42

Abstract: Systems, methods, and devices can involve a host device that includes a root complex, a link, and an interconnect protocol stack coupled to a bus link. The interconnect protocol stack can include multiplexing logic to select one of a Peripheral Component Interconnect Express (PCIe) upper layer mode, or an accelerator link protocol upper layer mode, the PCIe upper layer mode or the accelerator link protocol upper layer mode to communicate over the link, and physical layer logic to determine one or more low latency features associated with one or both of the PCIe upper layer mode or the accelerator link protocol upper layer mode.

公开(公告)号：US11144492B2

公开(公告)日：2021-10-12

申请号：US16812156

申请日：2020-03-06

Applicant: Intel Corporation

Inventor： Debendra Das Sharma ,  Michelle C. Jen ,  Prahladachar Jayaprakash Bharadwaj ,  Bruce A. Tennant ,  Mahesh Wagh

IPC: G06F13/40 ,  G06F13/42

Abstract: Systems, methods, and devices can involve a host device that includes a root complex, a link, and an interconnect protocol stack coupled to a bus link. The interconnect protocol stack can include multiplexing logic to select one of a Peripheral Component Interconnect Express (PCIe) upper layer mode, or an accelerator link protocol upper layer mode, the PCIe upper layer mode or the accelerator link protocol upper layer mode to communicate over the link, and physical layer logic to determine one or more low latency features associated with one or both of the PCIe upper layer mode or the accelerator link protocol upper layer mode.

公开(公告)号：US11095556B2

公开(公告)日：2021-08-17

申请号：US15639393

申请日：2017-06-30

Applicant: INTEL CORPORATION

Inventor： Debendra Das Sharma ,  Michelle C. Jen ,  Mark S. Myers ,  Don Soltis ,  Ramacharan Sundararaman ,  Stephen R. Van Doren ,  Mahesh Wagh

IPC: H04L12/781 ,  H04L29/06 ,  H04L12/931 ,  H04L29/08

Abstract: Embodiments may be generally direct to apparatuses, systems, method, and techniques to provide multi-interconnect protocol communication. In an embodiment, an apparatus for providing multi-interconnect protocol communication may include a component comprising at least one connector operative to connect the component to at least one off-package device via a standard interconnect protocol, and logic, at least a portion of the logic comprised in hardware, the logic to determine data to be communicated via a multi-interconnect protocol, provide the data to a multi-protocol multiplexer to determine a route for the data, route the data on-package responsive to the multi-protocol multiplexer indicating a multi-interconnect on-package mode, and route the data off-package via the at least one connector responsive to the multi-protocol multiplexer indicating a multi-interconnect off-package mode. Other embodiments are described.

公开(公告)号：US10606785B2

公开(公告)日：2020-03-31

申请号：US16171342

申请日：2018-10-25

Applicant: Intel Corporation

Inventor： Debendra Das Sharma ,  Michelle C. Jen ,  Prahladachar Jayaprakash Bharadwaj ,  Bruce A. Tennant ,  Mahesh Wagh

IPC: G06F13/40 ,  G06F13/42

Abstract: Systems, methods, and devices can involve a host device that includes a root complex, a link, and an interconnect protocol stack coupled to a bus link. The interconnect protocol stack can include multiplexing logic to select one of a Peripheral Component Interconnect Express (PCIe) upper layer mode, or an accelerator link protocol upper layer mode, the PCIe upper layer mode or the accelerator link protocol upper layer mode to communicate over the link, and physical layer logic to determine one or more low latency features associated with one or both of the PCIe upper layer mode or the accelerator link protocol upper layer mode.

公开(公告)号：US20190303342A1

公开(公告)日：2019-10-03

申请号：US16446470

申请日：2019-06-19

Applicant: Intel Corporation

Inventor： Michelle C. Jen ,  Minxi Gao ,  Debendra Das Sharma ,  Fulvio Spagna ,  Bruce A. Tennant ,  Noam Dolev Geldbard

IPC: G06F13/42

Abstract: An interface couples a controller to a physical layer (PHY) block, where the interface includes a set of data pins comprising transmit data pins to send data to the PHY block and receive data pins to receive data from the PHY block. The interface further includes a particular set of pins to implement a message bus interface, where the controller is to send a write command to the PHY block over the message bus interface to write a value to at least one particular bit of a PHY message bus register, bits of the PHY message bus register are mapped to a set of control and status signals, and the particular bit is mapped to a recalibration request signal to request that the PHY block perform a recalibration.

公开(公告)号：US20190065426A1

公开(公告)日：2019-02-28

申请号：US16171342

申请日：2018-10-25

Applicant: Intel Corporation

Inventor： Debendra Das Sharma ,  Michelle C. Jen ,  Prahladachar Jayaprakash Bharadwaj ,  Bruce A. Tennant ,  Mahesh Wagh

IPC: G06F13/40 ,  G06F13/42

Abstract: Systems, methods, and devices can involve a host device that includes a root complex, a link, and an interconnect protocol stack coupled to a bus link. The interconnect protocol stack can include multiplexing logic to select one of a Peripheral Component Interconnect Express (PCIe) upper layer mode, or an accelerator link protocol upper layer mode, the PCIe upper layer mode or the accelerator link protocol upper layer mode to communicate over the link, and physical layer logic to determine one or more low latency features associated with one or both of the PCIe upper layer mode or the accelerator link protocol upper layer mode.

公开(公告)号：US20220269641A1

公开(公告)日：2022-08-25

申请号：US17738625

申请日：2022-05-06

Applicant: Intel Corporation

Inventor： Michelle C. Jen ,  Minxi Gao ,  Debendra Das Sharma ,  Fulvio Spagna ,  Bruce A. Tennant ,  Noam Dolev Geldbard

IPC: G06F13/42

Abstract: An interface couples a controller to a physical layer (PHY) block, where the interface includes a set of data pins comprising transmit data pins to send data to the PHY block and receive data pins to receive data from the PHY block. The interface further includes a particular set of pins to implement a message bus interface, where the controller is to send a write command to the PHY block over the message bus interface to write a value to at least one particular bit of a PHY message bus register, bits of the PHY message bus register are mapped to a set of control and status signals, and the particular bit is mapped to a recalibration request signal to request that the PHY block perform a recalibration.

公开(公告)号：US20220012189A1

公开(公告)日：2022-01-13

申请号：US17485360

申请日：2021-09-25

Applicant: Intel Corporation

Inventor： Debendra Das Sharma ,  Robert G. Blankenship ,  Suresh S. Chittor ,  Kenneth C. Creta ,  Balint Fleischer ,  Michelle C. Jen ,  Mohan J. Kumar ,  Brian S. Morris

IPC: G06F13/16 ,  G06F13/38 ,  G06F12/14 ,  G06F13/42

Abstract: A shared memory controller is to service load and store operations received, over data links, from a plurality of independent nodes to provide access to a shared memory resource. Each of the plurality of independent nodes is to be permitted to access a respective portion of the shared memory resource. Interconnect protocol data and memory access protocol data are sent on the data links and transitions between the interconnect protocol data and memory access protocol data can be defined and identified.