公开(公告)号：US09185798B2

公开(公告)日：2015-11-10

申请号：US14299938

申请日：2014-06-09

Applicant: INNOVA DYNAMICS, INC.

Inventor： Michael Eugene Young ,  Arjun Daniel Srinivas ,  Matthew R. Robinson ,  Alexander Chow Mittal

IPC: H01L31/00 ,  H01L31/048 ,  H01L31/0216 ,  H05K1/02 ,  H01L31/055 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/09 ,  H01L31/02167 ,  H01L31/0481 ,  H01L31/05 ,  H01L31/055 ,  H05K1/0274 ,  H05K1/0313 ,  H05K1/115 ,  H05K2201/0302 ,  H05K2201/0326 ,  H05K2201/0364 ,  H05K2201/10977 ,  Y02E10/52 ,  Y02E10/54 ,  Y02E10/542

Abstract: Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

Abstract translation: 活性或功能添加剂嵌入主体材料的表面，用作各种电子或光电子器件中的组件，包括太阳能装置，智能窗户，显示器等。 所得到的表面嵌入式设备组件提供了改进的性能，以及由其组成和制造过程产生的成本优势。

公开(公告)号：US20150137049A1

公开(公告)日：2015-05-21

申请号：US14522080

申请日：2014-10-23

Applicant: Innova Dynamics, Inc.

Inventor： Alexander Chow Mittal ,  Arjun Daniel Srinivas ,  Matthew R. Robinson ,  Michael Eugene Young

IPC: H01B1/22 ,  H05K1/09

CPC classification number: H01B1/22 ,  B05D1/005 ,  B05D3/007 ,  H01L23/373 ,  H01L31/022466 ,  H01L31/035209 ,  H01L31/1884 ,  H01L51/442 ,  H01L51/5206 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/097 ,  Y02E10/50 ,  Y10T428/24364 ,  Y10T428/24372 ,  Y10T428/249921 ,  Y10T428/25 ,  H01L2924/00

Abstract: Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

Abstract translation: 导电或半导体添加剂被嵌入主体材料的表面以用于各种应用和装置中。 所得的表面嵌入结构表现出改善的性能，以及由其组成和制造工艺产生的成本优势。