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公开(公告)号：US20170237228A1
公开(公告)日：2017-08-17
申请号：US15272481
申请日：2016-09-22
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN
IPC: H01S5/02 , H04J14/02 , H01S5/40 , H01S5/022 , H01S5/0683
CPC classification number: H01S5/02292 , H01S5/0064 , H01S5/02216 , H01S5/02248 , H01S5/02288 , H01S5/02296 , H01S5/4025 , H01S5/4087 , H04B10/40
Abstract: A microfabricated optical apparatus that includes a light source driven by a waveform, a turning mirror, and a beam shaping element, wherein the waveform is delivered to the light source by at least one through silicon via. The microfabricated optical apparatus may also include a light-sensitive receiver which generates an electrical signal in response to an optical signal. The electrical signal may be communicated to external devices by at least one additional through silicon via.
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公开(公告)号：US20170146793A1
公开(公告)日：2017-05-25
申请号：US15355461
申请日：2016-11-18
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN , Sangwoo Kim , Stuart Hutchinson , Marin SIGURDSON
CPC classification number: G03F7/26 , B81B7/0067 , B81B2201/042 , B81B2201/047 , B81C2203/0109 , G02B1/11 , G02B27/0983 , G03F7/2004 , G03F7/2008 , G03F7/201
Abstract: A microfabricated optical apparatus that includes a light source or light detector in combination with an integrated turning surface to form a microfabricated optical subassembly. The integrated turning surface may be formed directly in the substrate material using gray scale lithography.
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公开(公告)号：US20160343684A1
公开(公告)日：2016-11-24
申请号：US15149217
申请日：2016-05-09
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN , Paul J. RUBEL
IPC: H01L23/00
CPC classification number: B81C1/00269 , B81C2203/0118 , B81C2203/037
Abstract: A method for bonding two substrates is described, comprising providing a first and a second silicon substrate, providing a raised feature on at least one of the first and the second silicon substrate, forming a layer of gold on the first and the second silicon substrates, and pressing the first substrate against the second substrate, to form a thermocompression bond around the raised feature. The high initial pressure caused by the raised feature on the opposing surface provides for a hermetic bond without fracture of the raised feature, while the complete embedding of the raised feature into the opposing surface allows for the two bonding planes to come into contact. This large contact area provides for high strength.
Abstract translation: 描述了用于接合两个基板的方法，包括提供第一和第二硅基板，在第一和第二硅基板中的至少一个上提供凸起特征，在第一和第二硅基板上形成金层， 并且将第一基板压靠在第二基板上，以在凸起特征周围形成热压接。 由相对表面上的凸起特征引起的高初始压力提供密封接合而不破坏凸起特征，而将凸起特征完全嵌入到相对表面中允许两个结合面接触。 这种大的接触面积提供高强度。
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公开(公告)号：US20190341211A1
公开(公告)日：2019-11-07
申请号：US16515678
申请日：2019-07-18
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN
Abstract: Systems and methods for forming an electrostatic MEMS switch that is used to hot switch a source of current or voltage. At least one surface of the MEMS switch is treated with an ion milling machine to reduce surface roughness to less than about 10 nm rms.
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公开(公告)号：US20190221607A1
公开(公告)日：2019-07-18
申请号：US16246506
申请日：2019-01-13
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN
IPC: H01L27/20 , H03H9/02 , H03H9/145 , H03H9/05 , H03H9/64 , H01L41/047 , H01L41/187 , H01L41/313 , H01L41/338 , H03H3/08 , H01H59/00
CPC classification number: H01L27/20 , H01H59/0009 , H01H2239/01 , H01L41/0477 , H01L41/1873 , H01L41/1876 , H01L41/313 , H01L41/338 , H03H3/08 , H03H9/02559 , H03H9/0542 , H03H9/145 , H03H9/64
Abstract: Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second piezoelectric substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. The second piezoelectric substrate may include lithium tantalate (LiTaO3) or lithium niobate (LiNiO3) or lead zirconate titanate (Pb[Zr(x)Ti(1−x)]O3), or integrated circuits formed thereon.
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Patent Agency Ranking
公开(公告)号：US20190064061A1
公开(公告)日：2019-02-28
申请号：US16105693
申请日：2018-08-20
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN
IPC: G01N21/25 , H01S5/022 , H01S5/00 , H01S5/183 , G01N21/3504
Abstract: Systems and methods for forming a compact gas sensor include using a lithographically fabricated, reflective and lengthy gas channel formed in at least two substrate to make a relatively long gas channel. A VCSEL radiation source may be coupled to the channel and a photodiode detector to measure the transmitted light.
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公开(公告)号：US20180294891A1
公开(公告)日：2018-10-11
申请号：US15934450
申请日：2018-03-23
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN
CPC classification number: H04B10/801 , G02B6/12019 , H04B10/40
Abstract: A transceiver and interconnect for connecting a plurality of optical cables. In one embodiment, optical sources are joined to a plurality of fiber optic output cables. The structures may use a plurality of ball lenses to collimate the diverging light from the source and launch it down one of the plurality of fibers. Through holes in a silicon substrate may allow the radiation to pass, and these features may be made very precisely.
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公开(公告)号：US20180155184A1
公开(公告)日：2018-06-07
申请号：US15832276
申请日：2017-12-05
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN , Marin SIGURDSON
CPC classification number: B81B3/0024 , B81B3/0086 , B81B2201/014 , B81B2203/0118 , B81B2207/07 , B81B2207/094 , H01L23/481 , H01L23/66 , H01L2223/6616
Abstract: We describe here a method that employs through substrate vias (TSVs) to frustrate the standing waves that are formed in the metal trace. TSVs may be formed at intervals in the first substrate, electrically coupling the metal bondline to the ground plane.
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公开(公告)号：US20180144879A1
公开(公告)日：2018-05-24
申请号：US15355608
申请日：2016-11-18
Applicant: Innovative Micro Technology
Inventor： Suresh Sampath , Christopher S. GUDEMAN
CPC classification number: H01H1/0036 , B81B2201/018 , B81C1/00095 , B81C1/00166 , H01H2001/0052 , H01H2001/0057
Abstract: The present application discloses a method for forming electrical contacts on a semiconductor substrate. The method includes forming a first metal layer over the substrate, and forming a layer of a second metal oxide by sputter deposition of a second metal in an oxygen environment.
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20.发明申请DUAL SUBSTRATE ELECTROSTATIC MEMS SWITCH WITH MULTIPLE HINGES AND METHOD OF MANUFACTURE 有权具有多个铰链的双基板静电MEMS开关及其制造方法公开(公告)号：US20160268084A1
公开(公告)日：2016-09-15
申请号：US15060630
申请日：2016-03-04
Applicant: Innovative Micro Technology
Inventor： Christopher S. GUDEMAN , Paul J. RUBEL , Marin Sigurdson
CPC classification number: H01H59/0009 , B81B7/00 , B81B2201/012 , B81C1/00341 , H01H49/00 , H01H2001/0084
Abstract: Systems and methods for forming an electrostatic MEMS switch include forming a movable cantilevered beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate. The cantilevered beam may be formed by etching the perimeter shape in the device layer of an SOI substrate. An additional void may be formed in the movable beam such that it bends about an additional hinge line as a result of the additional void. This may give the beam and switch advantageous kinematic characteristics.
Abstract translation: 用于形成静电MEMS开关的系统和方法包括在第一基板上形成可移动的悬臂梁，在第二基板上形成电触点，并且使用气密密封来连接两个基板。 可以通过形成穿过第二基板的厚度的通孔来进行对静电MEMS开关的电接入。 可以通过蚀刻SOI衬底的器件层中的周边形状来形成悬臂梁。 可移动梁中可能形成一个额外的空隙，使其由于附加的空隙而围绕另外的铰链线弯曲。 这可以给出光束并切换有利的运动特性。
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