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公开(公告)号：US09504155B2
公开(公告)日：2016-11-22
申请号：US14961454
申请日：2015-12-07
Applicant: Japan Display Inc.
Inventor： Yasushi Nakano , Hitoshi Kawaguchi , Hideaki Abe
CPC classification number: G06F3/0416 , G06F3/0412 , G06F2203/04102 , G06F2203/04103 , H05K1/117 , H05K1/189
Abstract: Touch sensor includes plural first connection terminals which are arranged side by side in one direction on a first circuit substrate, and plural second connection terminals which are arranged side by side in the one direction on a second substrate connected to the plural first connection terminals. Each of the plural second connection terminals includes plural first wirings extending in a direction crossing the one direction, and a second wiring connected to the plural first wirings and extending in the one direction. The second wiring is provided in a region where the second circuit substrate is overlapped with the first circuit substrate.
Abstract translation: 触摸传感器包括在第一电路基板上沿一个方向并排布置的多个第一连接端子，以及连接到多个第一连接端子的第二基板上沿一个方向并排布置的多个第二连接端子。 多个第二连接端子中的每一个包括沿与该一个方向交叉的方向延伸的多个第一布线，以及连接到多个第一布线并沿一个方向延伸的第二布线。 第二布线设置在第二电路基板与第一电路基板重叠的区域。
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公开(公告)号：US12105566B2
公开(公告)日：2024-10-01
申请号：US18347030
申请日：2023-07-05
Applicant: Japan Display Inc.
Inventor： Keisuke Asada , Hideaki Abe , Kota Uogishi , Kazuyuki Yamada
CPC classification number: G06F1/189 , G06F1/1605 , G06F1/1652 , G09F9/301
Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.
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13.发明授权公开(公告)号：US11342300B2
公开(公告)日：2022-05-24
申请号：US17001701
申请日：2020-08-25
Applicant: Japan Display Inc.
Inventor： Youhei Iwai , Hideaki Abe
IPC: H01L23/00 , H01L23/31 , H01L21/78 , H01L21/304
Abstract: The purpose of the invention is to counter measure a disconnection between the driver IC and the terminal when the terminal area of the electronic device is curved. One of the structures is as follows. An electronic device comprising: a driver IC installed in a terminal area, the terminal area being curved, wherein the driver IC has a circuit and plural bumps, the driver IC has a tapered portion formed on an opposite surface from a surface that the plural bumps are formed, the tapered portion overlaps with an outer most bump of the plural bumps.
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公开(公告)号：US12232262B2
公开(公告)日：2025-02-18
申请号：US18407700
申请日：2024-01-09
Applicant: Japan Display Inc.
Inventor： Hideaki Abe
Abstract: According to one embodiment, an electronic device includes a panel, a circuit board, a first flexible wiring board, and a first IC chip. The panel includes a curved display surface, a mounting portion curved, and a plurality of first pads disposed at intervals on the mounting portion. The circuit board is a plate-like. The first flexible wiring board has a first end portion mounted on the plurality of first pads and a second end portion connected to the circuit board. The first IC chip is mounted on the mounting portion and electrically connected to the first flexible wiring board. A first center of the first flexible wiring board is closer to a third center of the panel than a second center of the first IC chip in plan view.
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公开(公告)号：US11910528B2
公开(公告)日：2024-02-20
申请号：US17577435
申请日：2022-01-18
Applicant: Japan Display Inc.
Inventor： Hideaki Abe
CPC classification number: H05K1/118 , H05K1/147 , H05K2201/10128
Abstract: According to one embodiment, an electronic device includes a panel, a circuit board, a first flexible wiring board, and a first IC chip. The panel includes a curved display surface, a mounting portion curved, and a plurality of first pads disposed at intervals on the mounting portion. The circuit board is a plate-like. The first flexible wiring board has a first end portion mounted on the plurality of first pads and a second end portion connected to the circuit board. The first IC chip is mounted on the mounting portion and electrically connected to the first flexible wiring board. A first center of the first flexible wiring board is closer to a third center of the panel than a second center of the first IC chip in plan view.
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Patent Agency Ranking
公开(公告)号：US11815955B2
公开(公告)日：2023-11-14
申请号：US17451050
申请日：2021-10-15
Applicant: Japan Display Inc.
Inventor： Hideaki Abe , Kazuyuki Yamada , Keisuke Asada , Kota Uogishi
CPC classification number: G06F1/1652 , G06F1/183 , G06F1/189 , H05K1/189 , H05K2201/10128
Abstract: According to one embodiment, a display device including a display panel including a mount side curved to correspond to the curved shape of a display surface, a flat circuit board, and a first flexible wiring board mounted on the display panel in a first end side while being connected to the circuit board in a second end side, wherein the first flexible wiring board includes a first base member including a first surface and a second surface, a first line positioned in the first surface side, and a first protection layer covering the first line, and includes a first bending part to be bent between a first bending boundary and a second bending boundary, the second bending boundary is inclined with respect to the first bending boundary, and the first base member includes a first groove positioned in the first bending part and formed in the second surface.
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公开(公告)号：US11410976B2
公开(公告)日：2022-08-09
申请号：US16986919
申请日：2020-08-06
Applicant: Japan Display Inc.
Inventor： Hideaki Abe
Abstract: A display device includes a substrate, a first pixel region including a first light emitting element group over the substrate, a second pixel region including a second light emitting element group over the substrate and adjacent to the first light emitting element group, and a partition wall between the first light emitting element group and the second light emitting element. A height of the partition wall is larger than heights of a plurality of emitting elements included in each of the first light emitting element group and the second light emitting element group.
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公开(公告)号：US10921657B2
公开(公告)日：2021-02-16
申请号：US16269906
申请日：2019-02-07
Applicant: Japan Display Inc.
Inventor： Hideaki Abe , Yasuhito Aruga , Hiroyuki Onodera , Hiroki Kato , Yasushi Nakano , Hitoshi Kawaguchi , Keisuke Asada
IPC: H05K1/02 , G02F1/1345 , H05K3/36 , H05K1/14 , H05K1/11 , H05K1/18 , H01L27/12 , G02F1/1333 , G02F1/1368
Abstract: A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals in the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.
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公开(公告)号：US12183865B2
公开(公告)日：2024-12-31
申请号：US17570398
申请日：2022-01-07
Applicant: Japan Display Inc.
Inventor： Hideaki Abe
IPC: H01L33/38 , H01L25/075 , H01L33/62
Abstract: An LED module includes a first protrusion and a second protrusion adjacent to the first protrusion arranged on an insulating surface, a first electrode arranged on the first protrusion, and a second electrode arranged on the second protrusion, and an LED chip arranged on upper sides of the first protrusion and the second protrusion. The LED chip is connected to the first electrode and the second electrode via conductive members, and the first protrusion and the second protrusion are insulative and have a height of 1 μm to 50 μm.
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公开(公告)号：US12010797B2
公开(公告)日：2024-06-11
申请号：US18364543
申请日：2023-08-03
Applicant: Japan Display Inc.
Inventor： Youhei Iwai , Hideaki Abe
IPC: H05K1/18 , H05K1/02 , H05K1/14 , G02F1/1345 , H10K59/131
CPC classification number: H05K1/14 , H05K1/028 , G02F1/13452 , H05K2201/10128 , H10K59/131
Abstract: To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.
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