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公开(公告)号：US11668984B2
公开(公告)日：2023-06-06
申请号：US17715496
申请日：2022-04-07
Applicant: Japan Display Inc.
Inventor： Hideaki Abe , Yasuhito Aruga , Hiroyuki Onodera , Hiroki Kato , Yasushi Nakano , Hitoshi Kawaguchi , Keisuke Asada
IPC: H05K1/11 , G02F1/1345 , H05K3/36 , H05K1/02 , H05K1/14 , H05K1/18 , H01L27/12 , G02F1/1368 , G02F1/1333
CPC classification number: G02F1/13452 , G02F1/13458 , H05K1/0266 , H05K1/11 , H05K1/144 , H05K1/181 , H05K3/368 , G02F1/1368 , G02F1/133354 , G02F2202/28 , H01L27/1214 , H05K2201/041 , H05K2201/049 , H05K2201/09936 , H05K2201/10136 , H05K2203/166
Abstract: A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals in the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.
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公开(公告)号：US11340667B2
公开(公告)日：2022-05-24
申请号：US16899784
申请日：2020-06-12
Applicant: Japan Display Inc.
Inventor： Keisuke Asada , Hideaki Abe , Kota Uogishi , Kazuyuki Yamada
Abstract: An electronic device includes a substrate including an input terminal arranged a plurality of terminals, a wiring substrate having a flexibility connected to the input terminal part. The wiring substrate includes a base film, a cover film covering the base film, a plurality of wirings between the base film and the cover film, a connection part, and a first region bent in a first the one side and a second region adjacent to the first region. The second region of the connection part includes a first connection terminal group connected to the plurality of wirings, a second connection terminal group, and a dummy terminal group between the first connection terminal group. The first region is provided with an opening through the base film and the cover film, the second region overlaps the input terminal part, and the dummy terminal group and the opening are adjacent to each other.
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公开(公告)号：US10080294B2
公开(公告)日：2018-09-18
申请号：US15846450
申请日：2017-12-19
Applicant: Japan Display Inc.
Inventor： Hideaki Abe , Yasushi Nakano , Hitoshi Kawaguchi , Ryouhei Suzuki
IPC: H05K1/18 , H05K5/00 , H05K1/11 , H01R4/04 , H01R12/62 , G02F1/1362 , G02F1/1345
CPC classification number: H05K1/189 , G02F1/1345 , G02F1/136286 , H01R4/04 , H01R12/62 , H01R2107/00 , H05K1/118 , H05K3/323 , H05K3/3442 , H05K3/361 , H05K2201/09663 , H05K2201/09918 , H05K2201/10136
Abstract: Terminal portions are arrayed at regular widths and regular intervals, and each face any enable terminal, and are electrically connected to the enable terminals by conductive particles. A lead portion is connected to the other terminal portion except for a pair of terminal portions which is a pair of terminal portions adjacent to each other, and extends from an overlap region to a lead region. A connection portion connects the respective terminal portions that are not connected with the lead portion to the adjacent terminal portions that are connected to the lead portion within an area of the overlap region. An interval between a pair of lead portions extending from a pair of connection portions located to sandwich a pair of terminal portions that are not connected with the lead portion therebetween is larger than an interval between the other adjacent lead portions.
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公开(公告)号：US11765829B2
公开(公告)日：2023-09-19
申请号：US17366238
申请日：2021-07-02
Applicant: Japan Display Inc.
Inventor： Youhei Iwai , Hideaki Abe
IPC: H05K1/18 , H05K1/14 , H05K1/02 , G02F1/1345 , H10K59/131
CPC classification number: H05K1/14 , H05K1/028 , G02F1/13452 , H05K2201/10128 , H10K59/131
Abstract: To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.
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公开(公告)号：US11665822B2
公开(公告)日：2023-05-30
申请号：US17568009
申请日：2022-01-04
Applicant: Japan Display Inc.
Inventor： Youhei Iwai , Hideaki Abe
CPC classification number: H05K1/147 , H05K1/028 , H05K1/0277 , H05K1/0278 , H05K1/0393 , H05K1/0298 , H05K2201/09027 , H05K2201/09063 , H05K2201/10681
Abstract: An electronic device comprising: a substrate having a curved surface, a printed circuit board, and plural flexible wiring substrates, each of two of the plural flexible substrates has a terminal portion that is connected to the curved surface, the printed circuit board has a cutout between the two flexible wiring substrates.
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Patent Agency Ranking
公开(公告)号：US11252819B2
公开(公告)日：2022-02-15
申请号：US16898942
申请日：2020-06-11
Applicant: Japan Display Inc.
Inventor： Youhei Iwai , Hideaki Abe
Abstract: An electronic device comprising: a substrate having a curved surface, a printed circuit board, and plural flexible wiring substrates, each of two of the plural flexible substrates has a terminal portion that is connected to the curved surface, the printed circuit board has a cutout between the two flexible wiring substrates.
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公开(公告)号：US10966315B2
公开(公告)日：2021-03-30
申请号：US16906124
申请日：2020-06-19
Applicant: Japan Display Inc.
Inventor： Kota Uogishi , Keisuke Asada , Hideaki Abe , Kazuyuki Yamada
Abstract: According to one embodiment, an electronic device includes a panel including a mounting edge and pad portions, a flexible printed circuit board mounted on the panel. The flexible printed circuit board includes a base member including a first surface and a second surface, wiring lines placed on a side of the first surface and a protective layer covering the wiring lines, and including a bent portion, the base member includes a groove portion located in the bend portion and formed in the second surface, the groove portion includes concavity portions extending along a second direction and arranged along the first direction, and a thickness of the base member in a site where the groove portion is formed is less than a thickness of the base member in a site overlapping the driver IC chip.
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公开(公告)号：US20190051593A1
公开(公告)日：2019-02-14
申请号：US16058405
申请日：2018-08-08
Applicant: Japan Display Inc.
Inventor： Hiroyuki Kimura , Yasuhito Aruga , Hideaki Abe , Hitoshi Kawaguchi
IPC: H01L23/498 , H01L27/12 , H01L27/32 , G02F1/1368 , G02F1/1362 , H01L23/00 , G02F1/1333 , G02F1/1345
Abstract: According to one embodiment, a display device includes a first signal wiring disposed on an insulating substrate, a base substrate, a first connection wiring on the base substrate and a conductive adhesive member which electrically connects the first signal wiring and the first connection wiring, wherein the base substrate includes a first end surface overlapping the first signal wiring, the insulating substrate includes a second end surface overlapping the first connection wiring, the first connection wiring has a first width in a position overlapping the first end surface and a second width in a position overlapping the second end surface, and the first width is less than the second width.
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公开(公告)号：US09836161B2
公开(公告)日：2017-12-05
申请号：US15293366
申请日：2016-10-14
Applicant: Japan Display Inc.
Inventor： Yasushi Nakano , Hitoshi Kawaguchi , Hideaki Abe
CPC classification number: G06F3/0416 , G06F3/0412 , G06F2203/04102 , G06F2203/04103 , H05K1/117 , H05K1/189
Abstract: A terminal connection structure includes plural first connection terminals which are arranged side by side in one direction on a first circuit substrate, and plural second connection terminals which are arranged side by side in the one direction on a second resin circuit substrate overlappingly connected to the first circuit substrate and are respectively connected to the plural first connection terminals. Each of the plural second connection terminals includes plural first wirings extending in a direction crossing the one direction, and a second wiring connected to the plural first wirings and extending in the one direction. The second wiring is provided in a region where the second circuit substrate is overlapped and connected to the first circuit substrate.
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公开(公告)号：US20170031508A1
公开(公告)日：2017-02-02
申请号：US15293366
申请日：2016-10-14
Applicant: Japan Display Inc.
Inventor： Yasushi NAKANO , Hitoshi Kawaguchi , Hideaki Abe
IPC: G06F3/041
CPC classification number: G06F3/0416 , G06F3/0412 , G06F2203/04102 , G06F2203/04103 , H05K1/117 , H05K1/189
Abstract: A terminal connection structure includes plural first connection terminals which are arranged side by side in one direction on a first circuit substrate, and plural second connection terminals which are arranged side by side in the one direction on a second resin circuit substrate overlappingly connected to the first circuit substrate and are respectively connected to the plural first connection terminals. Each of the plural second connection terminals includes plural first wirings extending in a direction crossing the one direction, and a second wiring connected to the plural first wirings and extending in the one direction. The second wiring is provided in a region where the second circuit substrate is overlapped and connected to the first circuit substrate.
Abstract translation: 端子连接结构包括在第一电路基板上沿一个方向并排设置的多个第一连接端子，以及在与第一电路基板重叠连接的第二树脂电路基板上沿一个方向并排配置的多个第二连接端子 并且分别连接到多个第一连接端子。 多个第二连接端子中的每一个包括沿与该一个方向交叉的方向延伸的多个第一布线，以及连接到多个第一布线并沿一个方向延伸的第二布线。 第二布线设置在第二电路基板重叠并连接到第一电路基板的区域中。
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