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    LIQUID FILLING METHOD
    11.
    发明专利
    LIQUID FILLING METHOD 失效

    公开(公告)号：JP2000318711A

    公开(公告)日：2000-11-21

    申请号：JP13201699

    申请日：1999-05-12

    Applicant: KAO CORP

    Inventor： ARAKI YOSHIHIRO ,  KOBAYASHI MIKIO

    IPC: B05D3/00 ,  B05B1/24 ,  B65B39/00

    Abstract: PROBLEM TO BE SOLVED: To prevent a fluid flow path used for filling a liquid from being clogged by heating the flow path for use in a liquid filling method. SOLUTION: A liquid filling apparatus 10 fills a high temperature liquid (a liquid comprising a material which solidifies at an ordinary temperature) which is pressure-fed from a tank by a pump into a container 1 by a filling nozzle 11. The nozzle 11 has a heating wire 12 (heating means) embedded along a full length L of its flow path 11A to allow the path 11A to be heated. That is, the flow path 11A of the filling nozzle 11 is heated by the heating wire 12 for use. Therefore, even if supply of the high temperature liquid is stopped by interruption of filling or the like, the flow path 11A does not lower in temperature, so that the liquid attaching to the vicinity of an exit of the flow path 11A may not solidify nor the liquid left in the flow path 11A may solidify, resulting in no clogging in the nozzle 11. In addition, by heating the flow path 11A only when the liquid does not flow, deterioration in liquid quality due to overheat of the flow path 11A while the liquid flows can be avoided.

    INK RIBBON ASSEMBLING DEVICE
    12.
    发明专利
    INK RIBBON ASSEMBLING DEVICE 失效

    公开(公告)号：JPH06305222A

    公开(公告)日：1994-11-01

    申请号：JP9920593

    申请日：1993-04-26

    Applicant: KAO CORP ,  OM LTD

    Inventor： YAMADA HIROSHI ,  KOBAYASHI MIKIO ,  KITANO YOSHIO

    IPC: B41J32/00 ,  B41J35/04

    Abstract: PURPOSE:To surely assemble ink ribbon, which is wound so as to span between a pair of hubs, in a cassette together with a plurality of rollers. CONSTITUTION:After the ink ribbon 1, which is wound so as to span a pair of hubs 2, and a plurality of rollers 5A, 5B, 5C, 5D and 5E, the ink ribbon 1 is brought into the form of the course of running in a cassette by moving the rollers 5A and 5B and forming pieces 19. After that, by lifting the ink ribbon 1 under the condition that the hubs 2 and 2 and the rollers 5A, 5B, 5C, 5D and 5E are held in the state mentioned above, the ink ribbon 1 is carried above the cassette 3. Then, under the condition that the hubs 2 and 2 and the rollers 5A, 5B, 5C, 5D and 5E are released, the ink ribbon is assembled in the cassette 3.

    Manufacturing method for surface processing substrate
    13.
    发明专利
    Manufacturing method for surface processing substrate 审中-公开
    表面处理基板的制造方法

    公开(公告)号：JP2005022078A

    公开(公告)日：2005-01-27

    申请号：JP2004245198

    申请日：2004-08-25

    Applicant: Kao Corp ,  Nisshin Kikai Seisakusho:Kk ,  株式会社日進機械製作所 ,  花王株式会社

    Inventor： YAMAMOTO YUZO ,  NODA AKIRA ,  KOBAYASHI MIKIO ,  DAITO KIYOMASA

    IPC: B24B7/04 ,  B24B53/00

    Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method for a surface processing substrate free of the risk to generate microcracks.
    SOLUTION: The manufacturing method for the surface processing substrate to grind a base board using a grinding wheel, in which the cut-in depth of the grinding wheel itself is set to 0.05-20 μm and the cut-in depth by abrasive grains contained in the grinding wheel is set to a value equal to or below the ductile-brittle transition point, whereby grinding the base board using a plane grinder so that the grinding marks will become a sector shape.
    COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种表面处理基板的制造方法，没有产生微裂纹的风险。 解决方案：使用研磨轮研磨基板的表面处理基板的制造方法，其中砂轮本身的切入深度设定为0.05〜20μm，研磨深度为切削深度 砂轮中包含的颗粒被设定为等于或低于延性脆性转变点的值，由此使用平面研磨机研磨基板，使得研磨痕迹将变成扇形。 版权所有（C）2005，JPO＆NCIPI

    ARTICLE ASSEMBLING DEVICE
    14.
    发明专利
    ARTICLE ASSEMBLING DEVICE 失效

    公开(公告)号：JPH08169529A

    公开(公告)日：1996-07-02

    申请号：JP33239194

    申请日：1994-12-14

    Applicant: KAO CORP

    Inventor： KOBAYASHI MIKIO ,  SUZUKI NOBUO

    IPC: B65G43/08 ,  B65G47/52 ,  B65G47/91 ,  B65H19/30

    Abstract: PURPOSE: To deliver an assembling article to a tray without detecting the exis tence of article receiving parts of the tray and its position, and improve the working efficiency in taking out an article from the article receiving parts of the tray by an article taking-out device. CONSTITUTION: In a web winding device (an article assembling device), exclusive web receiving parts 24A to 24J are determined with respective web winders 21A and 21B or the like to a tray 24, and a detector to detect the existence of a web winding body 10 in the respective web receiving parts 24A to 24J of the tray 24, is arranged on the outlet side of a tray carrying conveyor 22, and a web taking-out device performs web taking-out operation on the web receiving parts 24A top 24J on which the existence of the web winding body 10 is detected.

    SURFACE-MACHINED SUBSTRATE AND ITS MANUFACTURE
    16.
    发明专利
    SURFACE-MACHINED SUBSTRATE AND ITS MANUFACTURE 失效

    公开(公告)号：JPH0976147A

    公开(公告)日：1997-03-25

    申请号：JP25697895

    申请日：1995-09-08

    Applicant: KAO CORP ,  NISSIN MACHINE WORKS

    Inventor： YAMAMOTO YUZO ,  NODA AKIRA ,  KOBAYASHI MIKIO ,  DAITO KIYOMASA

    IPC: B24B1/00 ,  G11B5/73 ,  G11B5/82 ,  G11B5/84 ,  H01L21/304

    Abstract: PROBLEM TO BE SOLVED: To provide a surface-machined substrate free of micro-cracks by grinding a substrate by means of a grinding wheel and under a ductile mode so as to form sector-form machining traces. SOLUTION: The generating-line form of a shoulder of a grinding wheel is adjusted by precise turning, so that the depth of cut of individual abrasive grains becomes lower than the ductility-brittleness transition point (about 50nm) of a carbon substrate. The substrate is fixed by a great many of vacuum suction holes made in a work table, or by a vacuum chucking method, and both surfaces the substrate are machined under a ductile mode. Thus, sector-form machining traces are formed on the surface-machined substrate. In this case, no cross-over of these machining traces is formed. With this, the occurrence of micro-cracks is restricted, while Ra (surface roughness) becomes 1 to 100Å and Rp (projection height)/Ra 2 to 10.

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