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11.发明公开OVERLAY AND SEMICONDUCTOR PROCESS CONTROL USING A NOVEL WAFER GEOMETRY METRIC 有权OVERLAY- UND HALBLEITERPROZESSSTEUERUNG UNTER VERWENDUNG EINER NEUARTIGEN WAFERGEETRIEMETRIK
公开(公告)号：EP2766923A4
公开(公告)日：2015-06-10
申请号：EP12839940
申请日：2012-10-10
Applicant: KLA TENCOR CORP
Inventor： VUKKADALA PRADEEP , VEERARAGHAVAN SATHISH , SINHA JAYDEEP K
CPC classification number: H01L21/67288 , G01B9/02021 , G01B9/02027 , G01B9/02057 , G01B11/161 , G01B11/2441 , G01B11/272 , G03F7/70633 , G03F7/70783 , H01L21/67271 , H01L22/12 , H01L2924/0002 , H01L2924/00
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12.发明公开LOCALIZED SUBSTRATE GEOMETRY CHARACTERIZATION 审中-公开CHARAKTERISIERUNG EINER LOKALISIERTEN SUBSTRATGEOMETRIE
公开(公告)号：EP2324495A4
公开(公告)日：2013-06-05
申请号：EP09810639
申请日：2009-08-28
Applicant: KLA TENCOR CORP
Inventor： VEERARAGHAVAN SATHISH , SINHA JAYDEEP K , FETTIG RABI
IPC: H01L21/66
CPC classification number: H01L22/12
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