Active learning for defect classifier training

    公开(公告)号:US10713769B2

    公开(公告)日:2020-07-14

    申请号:US16424431

    申请日:2019-05-28

    Abstract: Methods and systems for performing active learning for defect classifiers are provided. One system includes one or more computer subsystems configured for performing active learning for training a defect classifier. The active learning includes applying an acquisition function to data points for the specimen. The acquisition function selects one or more of the data points based on uncertainty estimations associated with the data points. The active learning also includes acquiring labels for the selected one or more data points and generating a set of labeled data that includes the selected one or more data points and the acquired labels. The computer subsystem(s) are also configured for training the defect classifier using the set of labeled data. The defect classifier is configured for classifying defects detected on the specimen using the images generated by the imaging subsystem.

    Single image detection
    13.
    发明授权

    公开(公告)号:US10186026B2

    公开(公告)日:2019-01-22

    申请号:US15353210

    申请日:2016-11-16

    Abstract: Methods and systems for detecting defects on a specimen are provided. One system includes a generative model. The generative model includes a non-linear network configured for mapping blocks of pixels of an input feature map volume into labels. The labels are indicative of one or more defect-related characteristics of the blocks. The system inputs a single test image into the generative model, which determines features of blocks of pixels in the single test image and determines labels for the blocks based on the mapping. The system detects defects on the specimen based on the determined labels.

    Detecting defects on a wafer
    15.
    发明授权
    Detecting defects on a wafer 有权
    检测晶圆上的缺陷

    公开(公告)号:US09355208B2

    公开(公告)日:2016-05-31

    申请号:US14321565

    申请日:2014-07-01

    CPC classification number: G06F17/5081 G01N21/9501 G06F17/5045 H01L22/12

    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes determining locations of all instances of a weak geometry in a design for a wafer. The locations include random, aperiodic locations. The weak geometry includes one or more features that are more prone to defects than other features in the design. The method also includes scanning the wafer with a wafer inspection system to thereby generate output for the wafer with one or more detectors of the wafer inspection system. In addition, the method includes detecting defects in at least one instance of the weak geometry based on the output generated at two or more instances of the weak geometry in a single die on the wafer.

    Abstract translation: 提供了用于检测晶片上的缺陷的系统和方法。 一种方法包括在晶片的设计中确定弱几何的所有实例的位置。 这些位置包括随机,不定期的位置。 弱几何包括与设计中的其他特征相比更容易出现缺陷的一个或多个特征。 该方法还包括用晶片检查系统扫描晶片,从而通过晶片检查系统的一个或多个检测器产生用于晶片的输出。 此外,该方法包括基于在晶片上的单个管芯中的弱几何形状的两个或多个实例处产生的输出来检测弱几何形状的至少一个实例中的缺陷。

    Virtual Inspection Systems for Process Window Characterization
    16.
    发明申请
    Virtual Inspection Systems for Process Window Characterization 审中-公开
    用于过程窗口表征的虚拟检测系统

    公开(公告)号:US20160150191A1

    公开(公告)日:2016-05-26

    申请号:US14946777

    申请日:2015-11-20

    Abstract: Methods and systems for detecting defects on a specimen are provided. One system includes a storage medium configured for storing images for a physical version of a specimen generated by an inspection system. At least two dies are formed on the specimen with different values of one or more parameters of a fabrication process performed on the specimen. The system also includes computer subsystem(s) configured for comparing portions of the stored images generated at locations on the specimen at which patterns having the same as-designed characteristics are formed with at least two of the different values. The portions of the stored images that are compared are not constrained by locations of the dies on the specimen, locations of the patterns within the dies, or locations of the patterns on the specimen. The computer subsystem(s) are also configured for detecting defects at the locations based on results of the comparing.

    Abstract translation: 提供了检测试样缺陷的方法和系统。 一个系统包括被配置为存储由检查系统生成的样本的物理版本的图像的存储介质。 在样品上形成至少两个模具,其具有在样品上进行的制造工艺的一个或多个参数的不同值。 该系统还包括计算机子系统,其被配置用于比较在样本上产生的存储图像的部分,其中形成具有相同设计特征的图案具有不同值中的至少两个。 被比较的存储的图像的部分不受标本上的模具的位置,模具内的图案的位置或样本上的图案的位置的约束。 计算机子系统还被配置为基于比较的结果来检测位置处的缺陷。

    Inspection recipe setup from reference image variation
    17.
    发明授权
    Inspection recipe setup from reference image variation 有权
    参考图像变化检查配方设置

    公开(公告)号:US09262821B2

    公开(公告)日:2016-02-16

    申请号:US14707573

    申请日:2015-05-08

    CPC classification number: G06T7/001 G06T2200/28 G06T2207/30148

    Abstract: Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.

    Abstract translation: 提供了用于生成用于晶片检查过程的信息的系统和方法。 一种方法包括获取位于晶片上的模具的检查系统的输出,基于输出的管芯位置组合用于管芯的输出,在内部管芯位置的基础上确定统计学 基于针对模具位置确定的统计特性,将组合输出的特性值的变化的属性以及将模具位置分配给不同的组。 该方法还包括在用于执行晶片检查过程的检查系统可访问的存储介质中存储用于管芯位置和内部管芯位置分配的不同组的信息,其包括应用缺陷检测参数, 基于该信息为晶片生成的检查系统的附加输出,从而检测晶片上的缺陷。

    Generalized virtual inspector
    18.
    发明授权
    Generalized virtual inspector 有权
    广义虚拟检查员

    公开(公告)号:US09222895B2

    公开(公告)日:2015-12-29

    申请号:US14184417

    申请日:2014-02-19

    Abstract: Generalized virtual inspectors are provided. One system includes two or more actual systems configured to perform one or more processes on specimen(s) while the specimen(s) are disposed within the actual systems. The system also includes one or more virtual systems coupled to the actual systems to thereby receive output generated by the actual systems and to send information to the actual systems. The virtual system(s) are configured to perform one or more functions using at least some of the output received from the actual systems. The virtual system(s) are not capable of having the specimen(s) disposed therein.

    Abstract translation: 提供广泛的虚拟检查员。 一个系统包括两个或更多个实际系统,其被配置为在样本被布置在实际系统内时对样本执行一个或多个过程。 该系统还包括耦合到实际系统的一个或多个虚拟系统,从而接收由实际系统产生的输出并向实际系统发送信息。 虚拟系统被配置为使用从实际系统接收的至少一些输出来执行一个或多个功能。 虚拟系统不能将样本置于其中。

    Acquisition of information for a construction site
    19.
    发明授权
    Acquisition of information for a construction site 有权
    获取施工现场的信息

    公开(公告)号:US09222771B2

    公开(公告)日:2015-12-29

    申请号:US13652232

    申请日:2012-10-15

    CPC classification number: G01C15/002

    Abstract: Systems and methods for acquiring information for a construction site are provided. One system includes a base unit positioned within a construction site by a user. A computer subsystem of the base unit determines a position of the base unit with respect to the construction site. The system also includes a measurement unit moved within the construction site by a user. The measurement unit includes one or more elements configured to interact with light in a known manner. An optical subsystem of the base unit directs light to the element(s) and detects the light after interacting with the element(s). The computer subsystem is configured to determine a position and pose of the measurement unit with respect to the base unit based on the detected light. The measurement unit includes a measurement device used by the measurement unit or the base unit to determine information for the construction site.

    Abstract translation: 提供了获取施工现场信息的系统和方法。 一个系统包括由用户定位在施工现场内的基座单元。 基座的计算机子系统确定基座相对于施工现场的位置。 该系统还包括由用户在施工现场内移动的测量单元。 测量单元包括被配置为以已知方式与光相互作用的一个或多个元件。 基本单元的光学子系统将光引导到元件,并在与元件相互作用之后检测光。 计算机子系统被配置为基于检测到的光来确定测量单元相对于基本单元的位置和姿态。 测量单元包括由测量单元或基座单元用于确定施工现场的信息的测量装置。

    Generating simulated images from input images for semiconductor applications

    公开(公告)号:US10395356B2

    公开(公告)日:2019-08-27

    申请号:US15603249

    申请日:2017-05-23

    Abstract: Methods and systems for generating a simulated image from an input image are provided. One system includes one or more computer subsystems and one or more components executed by the one or more computer subsystems. The one or more components include a neural network that includes two or more encoder layers configured for determining features of an image for a specimen. The neural network also includes two or more decoder layers configured for generating one or more simulated images from the determined features. The neural network does not include a fully connected layer thereby eliminating constraints on size of the image input to the two or more encoder layers.

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