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11.发明授权Waveguide structure, high frequency module including waveguide structure, and radar apparatus 有权波导结构，包括波导结构的高频模块和雷达装置公开(公告)号：US08922425B2
公开(公告)日：2014-12-30
申请号：US13259105
申请日：2010-03-31
Applicant: Kazuki Hayata
Inventor： Kazuki Hayata
Abstract: A waveguide structure according to one embodiment includes an upper waveguide and a mode conversion portion. The upper waveguide internally transmits a high frequency signal in TE10 mode along a first direction. The mode conversion portion is configured to electromagnetically couple with the upper waveguide. The mode conversion portion converts the high frequency signal propagating through the upper waveguide from TE10 mode to TM11 mode. The mode conversion portion transmits the high frequency signal converted in a second direction perpendicular to the first direction. According to the waveguide structure pursuant to the embodiment, it is possible to attain excellent transmission characteristics of high frequency signals.
Abstract translation: 根据一个实施例的波导结构包括上波导和模式转换部分。 上波导沿着第一方向以TE10模式内部传输高频信号。 模式转换部分被配置为与上波导电磁耦合。 模式转换部分将通过上波导传播的高频信号从TE10模式转换为TM11模式。 模式转换部分发送在垂直于第一方向的第二方向上转换的高频信号。 根据本实施方式的波导结构，能够得到优异的高频信号的传输特性。
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12.发明授权High-frequency module including a conductor with a slot therein and a conductive wire crossing over the slot and physically contacting the conductor 有权高频模块包括其中具有狭槽的导体，以及穿过狭槽并与导体物理接触的导线公开(公告)号：US08854152B2
公开(公告)日：2014-10-07
申请号：US13201836
申请日：2010-02-25
Applicant: Hiroshi Uchimura , Nobuki Hiramatsu , Kazuki Hayata
Inventor： Hiroshi Uchimura , Nobuki Hiramatsu , Kazuki Hayata
CPC classification number: H01P5/107 , H01L23/13 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2223/6627 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/49175 , H01L2224/49433 , H01L2924/01005 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1423 , H01L2924/16152 , H01L2924/181 , H01L2924/1903 , H01L2924/19051 , H01L2924/20752 , H01L2924/20758 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01P3/121 , H01P5/1015 , H01Q13/10 , H01Q23/00 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A high-frequency module includes a high-frequency component including a high-frequency circuit, a conductor plate including a slot, a first conductive wire, and two second conductive wires. The high-frequency component includes a signal terminal and two reference potential terminals. The signal terminal is used for at least one of input and output of a high-frequency signal. The two reference potential terminals are connected to a reference potential. The first conductive wire is connected to the signal terminal in terms of high-frequency. The first conductive wire crosses over above the slot. The two second conductive wires are connected to the two reference potential terminals in terms of high-frequency. The two second conductive wires are so disposed along the first conductive wire and do not cross over the slot. The first conductive wire and the two second conductive wires form a pair and are electromagnetically coupled to the slot.
Abstract translation: 高频模块包括包括高频电路的高频分量，包括槽的导体板，第一导电线和两个第二导电线。 高频分量包括信号端子和两个参考电位端子。 信号端子用于高频信号的输入和输出中的至少一个。 两个参考电位端子连接到参考电位。 第一根导线以高频连接到信号端子。 第一根导线穿过插槽上方。 两个第二导线在高频方面连接到两个参考电位端子。 两个第二导线沿着第一导线布置，并且不跨越槽。 第一导线和两个第二导线形成一对并且电磁耦合到该槽。
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13.发明授权High-frequency module and method of manufacturing the same, and transmitter, receiver, transceiver, and radar apparatus comprising the high-frequency module 失效高频模块及其制造方法以及包括高频模块的发射机，接收机，收发机和雷达装置公开(公告)号：US08564478B2
公开(公告)日：2013-10-22
申请号：US12935893
申请日：2009-03-31
Applicant: Djuniadi Arifin Sagala , Kazuki Hayata , Yuji Kishida
Inventor： Djuniadi Arifin Sagala , Kazuki Hayata , Yuji Kishida
IPC: G01S13/00
Abstract: A high-frequency module according to the present embodiment includes a substrate, a circuit board, and a resonator. The substrate has an input-output portion for high-frequency signals formed on one surface thereof. The circuit board includes a dielectric waveguide line with its end face exposed, and is placed on the one surface of the substrate such that a virtual plane extending beyond the end face is intersected by the one surface of the substrate. The resonator includes input-output end portions for high-frequency signals at ends thereof, in which one of the input-output end portions is connected to the end face of the dielectric waveguide line, and the other thereof is connected to the input-output portion of the substrate.
Abstract translation: 根据本实施例的高频模块包括基板，电路板和谐振器。 基板具有形成在其一个表面上的高频信号的输入输出部分。 电路板包括其端面暴露的介质波导线，并且被放置在基板的一个表面上，使得延伸超过端面的虚拟平面与基板的一个表面相交。 谐振器包括用于其端部的高频信号的输入输出端部，其中输入输出端部中的一个连接到电介质波导线的端面，另一个连接到输入 - 输出 部分基板。
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14.发明授权Direct-current blocking circuit, hybrid circuit device, transmitter, receiver, transmitter-receiver, and radar device 有权直流阻塞电路，混合电路装置，发射机，接收机，发射机和雷达装置公开(公告)号：US08179304B2
公开(公告)日：2012-05-15
申请号：US12664638
申请日：2008-04-02
Applicant: Kazuki Hayata , Kazumi Nakazuru
Inventor： Kazuki Hayata , Kazumi Nakazuru
CPC classification number: H01P5/107 , G01S7/032 , G01S7/034 , H01P1/2007 , H01P1/203
Abstract: The invention relates to a direct-current blocking circuit, and a hybrid circuit device, a transmitter, a receiver, a transmitter-receiver and a radar device that have the direct-current blocking circuit. A dielectric substrate (2) is provided with a conductor layer (3) disposed parallel with the dielectric substrate (2), first and second planar lines (4, 5) each containing a part of the conductor layer (3), and a waveguide (6) containing a part of the conductor layer (3). The first and second planar lines (4, 5) are located on one surface (2a) side of the dielectric substrate (2) with respect to the conductor layer (3), and the waveguide (6) is located on another surface (2b) side of the dielectric substrate (2). In a transmission direction (X) of electric signals, as to the waveguide (6), its one end overlaps with one end of the first planar line (4), and its another end overlaps with one end of the second planar line (5). In the overlapped regions, first and second through-holes (24, 25) are so formed as to penetrate the conductor layer (3) in its thickness direction.
Abstract translation: 本发明涉及直流阻断电路，以及具有直流阻断电路的混合电路装置，发射机，接收机，发射机 - 接收机和雷达装置。 电介质基板（2）设置有与电介质基板（2）平行设置的导体层（3），每个包含导体层（3）的一部分的第一和第二平面线（4,5）以及波导 （6），其包含导体层（3）的一部分。 第一和第二平面线（4,5）相对于导体层（3）位于电介质基板（2）的一个表面（2a）侧，并且波导（6）位于另一表面 ）侧。 在电信号的传输方向（X）上，对于波导（6），其一端与第一平面线（4）的一端重叠，并且其另一端与第二平面线（5）的一端重叠 ）。 在重叠区域中，第一和第二通孔（24,25）形成为在其厚度方向上穿透导体层（3）。
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15.发明授权公开(公告)号：US08159316B2
公开(公告)日：2012-04-17
申请号：US12681087
申请日：2008-12-27
Applicant: Kentaro Miyazato , Kazuki Hayata , Yuji Kishida
Inventor： Kentaro Miyazato , Kazuki Hayata , Yuji Kishida
IPC: H01P3/00
Abstract: The invention relates to a high-frequency transmission line connection structure, a circuit board having the connection structure, a high-frequency module having the circuit board, and a radar apparatus. A first laminated waveguide sub-line part (21) includes a pair of main conductor layers that oppose each other in a thickness direction with a dielectric layer (31) having the same thickness as a dielectric layer (31) of a microstrip line (1) interposed therebetween. A second laminated waveguide sub-line part (22) includes dielectric layers (31, 32) thicker than the dielectric layer of the first laminated waveguide sub-line part (21). A laminated waveguide main-line part (23) includes dielectric layers (31, 32, 33) thicker than the dielectric layers of the second laminated waveguide sub-line part (22). A conversion part (10) connected to the microstrip line (1) is formed by integrating with an upper main conductor layer constituting the respective line parts.
Abstract translation: 本发明涉及高频传输线连接结构，具有连接结构的电路板，具有电路板的高频模块和雷达装置。 第一层叠波导子线部分（21）包括在厚度方向上彼此相对的一对主导体层，其中电介质层（31）具有与微带线（1）的介电层（31）相同的厚度 ）。 第二层叠波导子线部分（22）包括比第一层叠波导子线部分（21）的电介质层厚的电介质层（31,32）。 叠层波导主线部分（23）包括比第二层叠波导子线部分（22）的介电层厚的电介质层（31,32,33）。 连接到微带线（1）的转换部分（10）通过与构成各个线路部分的上部主导体层集成而形成。
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Patent Agency Ranking
公开(公告)号：US20120013499A1
公开(公告)日：2012-01-19
申请号：US13259126
申请日：2010-03-31
Applicant: Kazuki Hayata
Inventor： Kazuki Hayata
CPC classification number: H01P3/121 , G01S7/032 , H01L23/13 , H01L23/49805 , H01L23/49822 , H01L23/66 , H01L24/16 , H01L24/48 , H01L2223/6627 , H01L2223/6677 , H01L2224/16225 , H01L2224/16227 , H01L2224/48227 , H01L2224/48229 , H01L2924/00014 , H01L2924/01087 , H01L2924/09701 , H01L2924/12035 , H01L2924/12041 , H01L2924/14 , H01L2924/1423 , H01L2924/19032 , H01L2924/19033 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01P5/107 , H05K1/0237 , H05K2201/037 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A circuit board is provided. The circuit board includes a substrate, a waveguide line and a laminated waveguide. The waveguide line is at least partially positioned on a first surface of the substrate. The waveguide line transmits a high frequency signal. The laminated waveguide is formed inside the substrate. The laminated waveguide is electromagnetically coupled to the waveguide line, and has a lead-out portion led out from inside the substrate to a surface other than the first surface. The laminated waveguide includes a dielectric layer, a pair of main conductive layers and a through conductor group. The pair of main conductive layers sandwiches the dielectric layer in a thickness direction thereof. In the through conductor group, a plurality of through conductors are arranged along a high frequency signal transmitting direction. The plurality of through conductors electrically connect the pair of main conductive layers.
Abstract translation: 提供电路板。 电路板包括基板，波导线和层叠波导。 波导线至少部分地位于基板的第一表面上。 波导线传输高频信号。 层叠波导形成在基板的内部。 层叠波导与波导线电磁耦合，并且具有从基板内引出到除了第一表面之外的表面的引出部分。 叠层波导包括电介质层，一对主导电层和贯通导体组。 一对主导电层在电介质层的厚度方向夹着电介质层。 在贯通导体组中，沿着高频信号发送方向配置多根贯通导体。 多个贯通导体电连接一对主导电层。
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17.发明申请High-Frequency Module and Method of Manufacturing the Same, and Transmitter, Receiver, Transceiver, and Radar Apparatus Comprising the High-Frequency Module 失效高频模块及其制造方法以及包括高频模块的发射机，接收机，收发器和雷达装置公开(公告)号：US20110025552A1
公开(公告)日：2011-02-03
申请号：US12935889
申请日：2009-03-31
Applicant: Djuniadi A. Sagala , Kazuki Hayata , Yuji Kishida
Inventor： Djuniadi A. Sagala , Kazuki Hayata , Yuji Kishida
CPC classification number: G01S7/032 , H01P3/121 , H01P5/107 , Y10T29/49128
Abstract: A high-frequency module according to the present embodiment includes a substrate, a circuit board, and a waveguide. The substrate has an input-output portion for high-frequency signals on one surface thereof. The circuit board has a dielectric waveguide line with its end face exposed, and is placed on the one surface of the substrate such that a virtual plane extending beyond the end face is intersected by the one surface of the substrate. The waveguide has openings at ends thereof, in which one of the openings is connected to the end face of the dielectric waveguide line, and the other opening is connected to the input-output portion of the substrate.
Abstract translation: 根据本实施例的高频模块包括基板，电路板和波导。 衬底在其一个表面上具有用于高频信号的输入 - 输出部分。 电路板具有其端面露出的介电波导线，并且被放置在基板的一个表面上，使得延伸超过端面的虚拟平面与基板的一个表面相交。 波导在其端部具有开口，其中一个开口连接到电介质波导线的端面，另一个开口连接到基板的输入 - 输出部分。
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18.发明申请公开(公告)号：US20100245155A1
公开(公告)日：2010-09-30
申请号：US12681087
申请日：2008-12-27
Applicant: Kentaro Miyazato , Kazuki Hayata , Yuji Kishida
Inventor： Kentaro Miyazato , Kazuki Hayata , Yuji Kishida
Abstract: The invention relates to a high-frequency transmission line connection structure, a circuit board having the connection structure, a high-frequency module having the circuit board, and a radar apparatus. A first laminated waveguide sub-line part (21) includes a pair of main conductor layers that oppose each other in a thickness direction with a dielectric layer (31) having the same thickness as a dielectric layer (31) of a microstrip line (1) interposed therebetween. A second laminated waveguide sub-line part (22) includes dielectric layers (31, 32) thicker than the dielectric layer of the first laminated waveguide sub-line part (21). A laminated waveguide main-line part (23) includes dielectric layers (31, 32, 33) thicker than the dielectric layers of the second laminated waveguide sub-line part (22). A conversion part (10) connected to the microstrip line (1) is formed by integrating with an upper main conductor layer constituting the respective line parts.
Abstract translation: 本发明涉及高频传输线连接结构，具有连接结构的电路板，具有电路板的高频模块和雷达装置。 第一层叠波导子线部分（21）包括在厚度方向上彼此相对的一对主导体层，其中电介质层（31）具有与微带线（1）的介电层（31）相同的厚度 ）。 第二层叠波导子线部分（22）包括比第一层叠波导子线部分（21）的电介质层厚的电介质层（31,32）。 叠层波导主线部分（23）包括比第二层叠波导子线部分（22）的介电层厚的电介质层（31,32,33）。 连接到微带线（1）的转换部分（10）通过与构成各个线路部分的上部主导体层集成而形成。
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公开(公告)号：US08760342B2
公开(公告)日：2014-06-24
申请号：US13259126
申请日：2010-03-31
Applicant: Kazuki Hayata
Inventor： Kazuki Hayata
IPC: G01S13/00
CPC classification number: H01P3/121 , G01S7/032 , H01L23/13 , H01L23/49805 , H01L23/49822 , H01L23/66 , H01L24/16 , H01L24/48 , H01L2223/6627 , H01L2223/6677 , H01L2224/16225 , H01L2224/16227 , H01L2224/48227 , H01L2224/48229 , H01L2924/00014 , H01L2924/01087 , H01L2924/09701 , H01L2924/12035 , H01L2924/12041 , H01L2924/14 , H01L2924/1423 , H01L2924/19032 , H01L2924/19033 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01P5/107 , H05K1/0237 , H05K2201/037 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A circuit board is provided. The circuit board includes a substrate, a waveguide line and a laminated waveguide. The waveguide line is at least partially positioned on a first surface of the substrate. The waveguide line transmits a high frequency signal. The laminated waveguide is formed inside the substrate. The laminated waveguide is electromagnetically coupled to the waveguide line, and has a lead-out portion led out from inside the substrate to a surface other than the first surface. The laminated waveguide includes a dielectric layer, a pair of main conductive layers and a through conductor group. The pair of main conductive layers sandwiches the dielectric layer in a thickness direction thereof. In the through conductor group, a plurality of through conductors are arranged along a high frequency signal transmitting direction. The plurality of through conductors electrically connect the pair of main conductive layers.
Abstract translation: 提供电路板。 电路板包括基板，波导线和层叠波导。 波导线至少部分地位于基板的第一表面上。 波导线传输高频信号。 层叠波导形成在基板的内部。 层叠波导与波导线电磁耦合，并且具有从基板内引出到除了第一表面之外的表面的引出部分。 叠层波导包括电介质层，一对主导电层和贯通导体组。 一对主导电层在电介质层的厚度方向夹着电介质层。 在贯通导体组中，沿着高频信号发送方向配置多根贯通导体。 多个贯通导体电连接一对主导电层。
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20.发明申请High-Frequency Module and Method of Manufacturing the Same, and Transmitter, Receiver, Transceiver, and Radar Apparatus Comprising the High-Frequency Module 失效高频模块及其制造方法以及包括高频模块的发射机，接收机，收发器和雷达装置公开(公告)号：US20110025550A1
公开(公告)日：2011-02-03
申请号：US12935893
申请日：2009-03-31
Applicant: Djuniadi A. Sagala , Kazuki Hayata , Yuji Kishida
Inventor： Djuniadi A. Sagala , Kazuki Hayata , Yuji Kishida
Abstract: A high-frequency module according to the present embodiment includes a substrate, a circuit board, and a resonator. The substrate has an input-output portion for high-frequency signals formed on one surface thereof. The circuit board includes a dielectric waveguide line with its end face exposed, and is placed on the one surface of the substrate such that a virtual plane extending beyond the end face is intersected by the one surface of the substrate. The resonator includes input-output end portions for high-frequency signals at ends thereof, in which one of the input-output end portions is connected to the end face of the dielectric waveguide line, and the other thereof is connected to the input-output portion of the substrate.
Abstract translation: 根据本实施例的高频模块包括基板，电路板和谐振器。 基板具有形成在其一个表面上的高频信号的输入输出部分。 电路板包括其端面暴露的介质波导线，并且被放置在基板的一个表面上，使得延伸超过端面的虚拟平面与基板的一个表面相交。 谐振器包括用于其端部的高频信号的输入输出端部，其中输入输出端部中的一个连接到电介质波导线的端面，另一个连接到输入 - 输出 部分基板。
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