-
公开(公告)号：US09847165B2
公开(公告)日：2017-12-19
申请号：US14877981
申请日：2015-10-08
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H01F27/2804 , H01F41/041 , H01F2027/2809 , H05K1/00 , H05K1/165 , H05K3/00 , H05K3/4635 , H05K2201/09063
Abstract: A winged coil structure and a method of manufacturing the same are disclosed. The winged coil structure includes an upper flexible plate, at least one upper magnetic induction coil, at least one upper connection pad, a lower flexible plate, at least one lower magnetic induction coil, at least one lower connection pad, at least one gold finger, a dielectric layer and at least one connection plug. The connection plug connects the upper connection pad and the lower connection pad through thermal pressing such that the gold finger, the upper magnetic induction coil, the upper connection pad, the lower connection pad, the connection plug, the lower connection pad and the lower magnetic induction coil are electrically connected. The upper flexible plate is provided with notched lines to be easily bent without damage to the upper and lower magnetic induction coils. Thus, a bendable feature for magnetic induction coils is provided.
-
公开(公告)号：US09570227B1
公开(公告)日：2017-02-14
申请号：US14809295
申请日：2015-07-27
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H01F27/2804
Abstract: Disclosed is a magnetic excitation coil structure including a magnetic coil sheet formed of a thin film and rolled as a cylindrical body with a hollow hole, and an insulation layer covering the outer surface of the cylindrical body formed by the magnetic coil sheet for protection. The magnetic coil sheet includes a flexible substrate, a dielectric layer attached to the flexible substrate, and a plurality of patterned circuit layers embedded in the flexible substrate and in contact with the dielectric layer. Each patterned circuit layer is separate, and the upper surfaces of the patterned circuit layers and the upper surface of the flexible substrate form a co-plane. The magnetic coil structure provides an electrical function of coil, which is enhanced by the patterned circuit layer due to its high aspect ratio of the electrical circuit, thereby greatly increasing the whole magnetic flux and electromagnetic effect.
Abstract translation: 公开了一种磁激励线圈结构，其包括由薄膜形成的作为具有中空孔的圆筒体并被卷绕的电磁线圈片，以及覆盖由用于保护的电磁线圈片形成的圆筒体的外表面的绝缘层。 磁性线圈片包括柔性衬底，附着到柔性衬底的电介质层和嵌入在柔性衬底中并与电介质层接触的多个图案化电路层。 每个图案化电路层是分离的，并且图案化电路层的上表面和柔性基板的上表面形成共面。 磁线圈结构提供线圈的电功能，由于其电路的高纵横比而由图案化电路层增强，从而大大增加了整个磁通量和电磁效应。
-
公开(公告)号：US09439290B1
公开(公告)日：2016-09-06
申请号：US14817268
申请日：2015-08-04
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H05K1/028 , H01F17/0013 , H05K1/118 , H05K1/165 , H05K2201/09036 , H05K2201/09063
Abstract: A carrier board structure includes at least one upper magnetic coil, at least one lower magnetic coil, a flexible board, a dielectric layer, at least one connection pad and at least one gold finger. The flexible board has a middle region having a middle hole, and two side regions thinner than the middle region. A groove used as a fold line is provided on the lower surface of each side region bordering on the middle region. The upper and lower magnetic coils are configured in the flexible board and separated by the dielectric layer. The gold fingers are provided on the two side regions and connected to the upper magnetic coils. The upper and lower magnetic coils are around the middle hole and connected by the connection pads. The fold lines help the two side regions to fold without damage to the upper and lower magnetic coils.
Abstract translation: 载体板结构包括至少一个上部磁线圈，至少一个下部磁线圈，柔性电路板，电介质层，至少一个连接焊盘和至少一个金手指。 柔性板具有中间区域，中间部分具有比中间区域薄的两个侧面区域。 用作折线的槽设置在与中间区域接壤的每个侧面的下表面上。 上下磁性线圈配置在柔性电路板中，由电介质层隔开。 金手指设置在两个侧面区域上并连接到上部磁性线圈。 上下磁性线圈围绕中间孔并通过连接垫连接。 折叠线帮助两个侧面区域折叠而不损坏上部和下部磁性线圈。
-
公开(公告)号：US11495390B2
公开(公告)日：2022-11-08
申请号：US16285138
申请日：2019-02-25
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
Abstract: A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first buildup unit or at least one second buildup unit. The first buildup unit includes at least one first buildup body, the second buildup unit includes at least one second buildup body. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first and/or second buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction.
-
公开(公告)号：US10405423B2
公开(公告)日：2019-09-03
申请号：US15863605
申请日：2018-01-05
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
Abstract: A multi-layer circuit board includes a first circuit board, conducting blocks, a second circuit board, and conducting recesses. The first circuit board has a first conductor layer mounted on the first circuit board. The conducting blocks are mounted on the first circuit board and electrically connected to the first conductor layer. The second circuit board has a second conductor layer mounted thereon and facing the first circuit board. The conducting recesses are formed in the second circuit board, electrically connected to the second conductor layer, and corresponding to the respective conducting blocks. The insulating layer is mounted between the first conductor layer and the second conductor layer. The second circuit board is on the first circuit board, the conducting blocks are respectively mounted in the conducting recesses to electrically connect the first conductor layer and the second conductor layer.
-
Patent Agency Ranking
16.发明授权公开(公告)号：US10371719B2
公开(公告)日：2019-08-06
申请号：US15130982
申请日：2016-04-17
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
Abstract: A printed circuit board (PCB) test fixture includes a substrate, a first insulation layer formed on the substrate, a conductor layer formed on the first insulation layer and electrically connected to the upper electrodes through at least one first connection member, a second insulation layer formed on the first insulation layer, and multiple conductive cones arranged on the second insulation layer in a matrix form. A part of the conductive cones is electrically connected to the conductor layer through at least one second connection member. The circuit layout of the conductor layer, the at least one first connection member and the at least one second connection member is employed to supply testing power to a part of the conductive cones and an adjustable arrangement of the conductive cones to enhance density of test probes upon electrical testing.
-
公开(公告)号：US20190180919A1
公开(公告)日：2019-06-13
申请号：US16280435
申请日：2019-02-20
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H01F27/2804 , H01F41/041 , H01F2027/2809 , H05K1/00 , H05K1/165 , H05K3/00 , H05K3/4635 , H05K2201/09063
Abstract: A method of manufacturing a winged coil structure is provided. The method includes preparing an upper flexible plate having a middle region and two side regions bordering the middle region; preparing a dielectric layer with a lateral size of the dielectric layer being the same as a lateral size of the middle region of the upper flexible plate; preparing a lower flexible plate having a middle region and two side regions bordering the middle region; preparing a bottom flexible plate attached to the lower surface of the lower flexible plate to form a stack body; and performing a process of thermal pressing to sequentially from bottom to top stack and combine the stack body, the dielectric layer, and the upper flexible plate as a multiple layered stack structure via a press mold.
-
公开(公告)号：US20170140857A1
公开(公告)日：2017-05-18
申请号：US14943077
申请日：2015-11-17
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
IPC: H01F5/00
Abstract: Disclosed is a modified magnetic coil structure. A substrate, at least one circuit pattern layer and a permeability enforced ring are included. The substrate is formed of an electrical insulation material, and has a through hole. The circuit pattern layer is formed of an electrically conductive material and configured in the substrate to surround but not contact the through hole. The permeability enforced ring is formed of a high permeability material and provided in the through hole so as to fully cover a sidewall of the through hole. The permeability enforced ring and the substrate form two co-planes in an upper horizontal plane and a lower horizontal plane of the modified magnetic coil structure, respectively. Therefore, the present invention employs the permeability enforced ring to greatly increase magnetic flux density to form a high permeability device, thereby improving the electromagnetic effect and properties of the magnetic coil.
-
公开(公告)号：US20170032881A1
公开(公告)日：2017-02-02
申请号：US14809295
申请日：2015-07-27
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
IPC: H01F27/28
CPC classification number: H01F27/2804
Abstract: Disclosed is a magnetic excitation coil structure including a magnetic coil sheet formed of a thin film and rolled as a cylindrical body with a hollow hole, and an insulation layer covering the outer surface of the cylindrical body formed by the magnetic coil sheet for protection. The magnetic coil sheet includes a flexible substrate, a dielectric layer attached to the flexible substrate, and a plurality of patterned circuit layers embedded in the flexible substrate and in contact with the dielectric layer. Each patterned circuit layer is separate, and the upper surfaces of the patterned circuit layers and the upper surface of the flexible substrate form a co-plane. The magnetic coil structure provides an electrical function of coil, which is enhanced by the patterned circuit layer due to its high aspect ratio of the electrical circuit, thereby greatly increasing the whole magnetic flux and electromagnetic effect.
Abstract translation: 公开了一种磁激励线圈结构，其包括由薄膜形成的作为具有中空孔的圆筒体并被卷绕的电磁线圈片，以及覆盖由用于保护的电磁线圈片形成的圆筒体的外表面的绝缘层。 磁性线圈片包括柔性衬底，附着到柔性衬底的电介质层和嵌入在柔性衬底中并与电介质层接触的多个图案化电路层。 每个图案化电路层是分离的，并且图案化电路层的上表面和柔性基板的上表面形成共面。 磁线圈结构提供线圈的电功能，由于其电路的高纵横比而由图案化电路层增强，从而大大增加了整个磁通量和电磁效应。
-
公开(公告)号：US20190387631A1
公开(公告)日：2019-12-19
申请号：US16555261
申请日：2019-08-29
Applicant: Kinsus Interconnect Technology Corp.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
Abstract: A manufacturing method of a double layer circuit board comprises forming a connecting pillar on a first circuit, wherein the connecting pillar comprises a first end, connected to the first circuit, and a second end, opposite to the first end; forming a substrate on the first circuit and the connecting pillar; drilling the substrate to expose a portion of the second end of the connecting pillar, wherein the other portion of the second end of the connecting pillar is covered by the substrate; and forming a second circuit on the substrate and the portion of the second end of the connecting pillar, wherein an area of the first end connected to the first circuit layer is greater than an area of the portion of the second end connected to the second circuit layer.
-
-
-
-
-
-
-
-
-
Search Results
29
records
(took 0.042 seconds)
