公开(公告)号：US06855037B2

公开(公告)日：2005-02-15

申请号：US09910686

申请日：2001-07-20

Applicant: Jalal Ashjaee ,  Homayoun Talieh ,  Bulent Basol ,  Konstantin Volodarsky

Inventor： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent Basol ,  Konstantin Volodarsky

IPC: B24B37/30 ,  C25D7/12 ,  C25D17/06 ,  H01L21/00 ,  H01L21/683 ,  B24B1/00

CPC classification number: B24B37/30 ,  C25D17/001 ,  C25D17/06 ,  H01L21/6704 ,  H01L21/6715 ,  H01L21/6838

Abstract: The present invention provides a wafer carrier that includes an opening, which in one embodiment is a plurality of holes, disposed along the periphery of the wafer carrier. A gas emitted through the holes onto a peripheral back edge of the wafer assists in preventing the processing liquids and contaminants resulting therefrom from reaching the inner region of the base and the backside inner region of the wafer. In another embodiment, a plurality of concentric sealing members are used to prove a better seal, and the outer seal is preferably independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier.

Abstract translation: 本发明提供了一种晶片载体，其包括沿着晶片载体的周边设置的开口，其在一个实施例中是多个孔。 通过孔发射到晶片的外围后缘上的气体有助于防止由此产生的处理液体和污染物到达晶片的底部和内侧区域的内部区域。 在另一个实施例中，使用多个同心密封构件来证明更好的密封，并且外部密封件优选地是独立地可移动的，以允许当晶片仍然附接到晶片载体时清洁晶片的周边背面而发生。

公开(公告)号：US06773576B2

公开(公告)日：2004-08-10

申请号：US10251377

申请日：2002-09-20

Applicant: Rimma Volodarsky ,  Konstantin Volodarsky ,  Cyprian Uzoh ,  Homayoun Talieh ,  Douglas W. Young

Inventor： Rimma Volodarsky ,  Konstantin Volodarsky ,  Cyprian Uzoh ,  Homayoun Talieh ,  Douglas W. Young

IPC: C25F302

CPC classification number: C25D17/14 ,  C25F7/00

Abstract: A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.

Abstract translation: 可以使用特定的阳极组件来提供用于在半导体晶片上进行的电镀操作，平面化操作和电镀和平面化操作中的任何一种的解决方案。 阳极组件包括设置在其中执行操作的室内的可旋转轴，连接到轴的阳极壳体和附接到阳极壳体的多孔垫支撑板。 支撑板具有适于支撑面向晶片的焊盘的顶表面，并且与阳极壳体一起限定阳极腔。 可以在阳极腔中设置消耗性阳极以向溶液提供电镀材料。 还提供了可以将溶液输送到所述阳极腔的溶液输送结构。 溶液输送结构可以包含在进行操作的室内。 护罩还可以安装在轴和相关主轴之间，以防止溶液从腔室泄漏。

公开(公告)号：US06425812B1

公开(公告)日：2002-07-30

申请号：US09475543

申请日：1999-12-30

Applicant: Anil K. Pant ,  Douglas W. Young ,  Glenn Travis ,  Konstantin Volodarsky ,  Andrew Nagengast

Inventor： Anil K. Pant ,  Douglas W. Young ,  Glenn Travis ,  Konstantin Volodarsky ,  Andrew Nagengast

IPC: B24B722

CPC classification number: B24B37/30

Abstract: A polishing head for performing chemical-mechanical polishing on a linear polisher has a flexible diaphragm coupling between a wafer carrier and a support housing which houses the wafer carrier. The diaphragm allows the carrier to move-substantially in the vertical direction within the housing, but a center shaft assembly limits movement in the horizontal direction.

Abstract translation: 用于在线性抛光机上进行化学机械抛光的抛光头具有在晶片载体和容纳晶片载体的支撑壳体之间的柔性膜片联接。 隔膜允许载体基本上在壳体内沿垂直方向移动，但是中心轴组件限制了在水平方向上的移动。

公开(公告)号：US06227585B1

公开(公告)日：2001-05-08

申请号：US09206087

申请日：1998-12-04

Applicant: Boris Govzman ,  Konstantin Volodarsky ,  Leon Volfovski

Inventor： Boris Govzman ,  Konstantin Volodarsky ,  Leon Volfovski

IPC: B25J1506

Abstract: Substrate handling apparatus and methods are described. In one aspect, the substrate handling apparatus includes a clamping member having an extended condition wherein substrate movement relative to the transfer arm is substantially restricted and a retracted condition wherein substrate movement relative to the transfer arm is substantially free. The substrate handling apparatus further includes a sense mechanism (e.g., a vacuum sensor) constructed to determine whether a substrate is properly positioned on the support arm and to trigger the mode of operation of the clamping member between extended and retracted conditions. The sense mechanism also provides information relating to the operating condition of the clamping member.

公开(公告)号：US06884334B2

公开(公告)日：2005-04-26

申请号：US10041058

申请日：2001-12-28

Applicant: Konstantin Volodarsky ,  Boguslaw A. Nigorski ,  Rimma Volodarsky ,  Douglas W. Young ,  Cyprian Uzoh ,  Homayoun Talieh

Inventor： Konstantin Volodarsky ,  Boguslaw A. Nigorski ,  Rimma Volodarsky ,  Douglas W. Young ,  Cyprian Uzoh ,  Homayoun Talieh

IPC: C25D7/12 ,  H01L21/00 ,  H01L21/02 ,  H01L21/3063 ,  C25D5/00

CPC classification number: H01L21/6719 ,  C25D7/12 ,  C25D17/001 ,  H01L21/67028 ,  Y10S134/902

Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

Abstract translation: 本发明涉及一种用于进行多个处理步骤的容纳室，例如沉积，抛光，蚀刻，改性，漂洗，清洁和干燥工件上的表面。 在本发明的一个实例中，室用于在半导体晶片上化学机械地沉积导电材料。 然后可以使用相同的容纳室来冲洗和清洁相同的晶片。 结果，本发明消除了对用于沉积导电材料和清洁晶片的单独处理站的需要。 因此，利用本发明，降低了成本和物理空间，同时提供了使用容纳室在晶片表面上执行多个工艺的有效的装置和方法。

公开(公告)号：US20050040049A1

公开(公告)日：2005-02-24

申请号：US10914490

申请日：2004-08-10

Applicant: Rimma Volodarsky ,  Konstantin Volodarsky ,  Cyprian Uzoh ,  Homayoun Talieh ,  Douglas Young

Inventor： Rimma Volodarsky ,  Konstantin Volodarsky ,  Cyprian Uzoh ,  Homayoun Talieh ,  Douglas Young

IPC: B23H7/00 ,  C25D5/08 ,  C25D7/12 ,  C25D17/10 ,  H01L21/288 ,  H01L21/768

CPC classification number: C25D17/001 ,  C25D5/08 ,  C25D17/008 ,  C25D17/10 ,  H01L21/2885 ,  H01L21/7684 ,  H01L21/76877

Abstract: A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.

Abstract translation: 可以使用特定的阳极组件来提供用于在半导体晶片上进行的电镀操作，平面化操作和电镀和平面化操作中的任何一种的解决方案。 阳极组件包括设置在其中执行操作的室内的可旋转轴，连接到轴的阳极壳体和附接到阳极壳体的多孔垫支撑板。 支撑板具有适于支撑面向晶片的焊盘的顶表面，并且与阳极壳体一起限定阳极腔。 可以在阳极腔中设置消耗性阳极以向溶液提供电镀材料。 还提供了可以将溶液输送到所述阳极腔的溶液输送结构。 溶液输送结构可以包含在进行操作的室内。 护罩还可以安装在轴和相关主轴之间，以防止溶液从腔室泄漏。

公开(公告)号：US06352623B1

公开(公告)日：2002-03-05

申请号：US09466014

申请日：1999-12-17

Applicant: Konstantin Volodarsky ,  Boguslaw A. Nagorski ,  Rimma Volodarsky ,  Douglas W. Young ,  Cyprian Uzoh ,  Homayoun Talieh

Inventor： Konstantin Volodarsky ,  Boguslaw A. Nagorski ,  Rimma Volodarsky ,  Douglas W. Young ,  Cyprian Uzoh ,  Homayoun Talieh

IPC: C25B900

CPC classification number: H01L21/6719 ,  C25D7/12 ,  C25D17/001 ,  H01L21/67028 ,  Y10S134/902

Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

公开(公告)号：US5803799A

公开(公告)日：1998-09-08

申请号：US879862

申请日：1997-06-20

Applicant: Konstantin Volodarsky ,  David E. Weldon

Inventor： Konstantin Volodarsky ,  David E. Weldon

IPC: B24B37/30 ,  B24B5/00 ,  B24B29/00

CPC classification number: B24B37/30

Abstract: A polishing head for polishing a semiconductor wafer includes a housing, a wafer carrier movably mounted to the housing, and a wafer retainer movably mounted to the housing. The wafer carrier forms a wafer supporting surface, and the wafer retainer is shaped to retain a wafer in place on the wafer-supporting surface. A first fluid actuator is coupled to the wafer carrier to bias the wafer carrier in a selected direction with respect to the housing, and a second fluid actuator is coupled to the wafer retainer to bias the wafer retainer in a second selected direction with respect to the housing. First and second fluid conduits are coupled to the first and second actuators, respectively, such that fluid pressures in the first and second actuators are separately and independently adjustable with respect to one another. Biasing forces on the retainer can thereby be dynamically adjusted with respect to biasing forces on the carrier during the polishing operation.

Abstract translation: 用于抛光半导体晶片的抛光头包括壳体，可移动地安装到壳体的晶片载体和可移动地安装到壳体的晶片保持架。 晶片载体形成晶片支撑表面，并且晶片保持器成形为将晶片保持在晶片支撑表面上的适当位置。 第一流体致动器耦合到晶片载体，以相对于壳体在选定的方向上偏置晶片载体，并且第二流体致动器耦合到晶片保持器，以将晶片保持器相对于第二选定方向偏置 住房。 第一和第二流体管道分别联接到第一和第二致动器，使得第一和第二致动器中的流体压力彼此独立且可独立地调节。 因此，可以在抛光操作期间相对于载体上的偏压力动态地调节保持器上的偏压力。

公开(公告)号：US5800248A

公开(公告)日：1998-09-01

申请号：US638464

申请日：1996-04-26

Applicant: Anil K. Pant ,  Douglas W. Young ,  Anthony S. Meyer ,  Konstantin Volodarsky ,  David E. Weldon

Inventor： Anil K. Pant ,  Douglas W. Young ,  Anthony S. Meyer ,  Konstantin Volodarsky ,  David E. Weldon

IPC: B24B37/04 ,  B24B49/00 ,  B24B57/02 ,  B24B1/00

CPC classification number: B24B49/00 ,  B24B37/04 ,  B24B57/02

Abstract: A technique for controlling a polishing rate across a substrate surface when performing CMP, in order to obtain uniform polishing of the substrate surface. A support housing which underlies a polishing pad includes a plurality of openings for dispensing a pressurized fluid. The openings are arranged into a pre-configured pattern for dispensing the fluid to the underside of the pad opposite the substrate surface being polished. The openings are configured into a number of groupings, in which a separate channel is used for each grouping so that fluid pressure for each group of openings can be separately and independently controlled.

Abstract translation: 一种用于在进行CMP时控制衬底表面的抛光速率的技术，以便获得衬底表面的均匀抛光。 在抛光垫下面的支撑壳体包括用于分配加压流体的多个开口。 开口被布置成预先配置的图案，用于将流体分配到衬垫的与待抛光的衬底表面相对的底面。 开口被配置成多个分组，其中每个分组使用单独的通道，使得每组开口的流体压力可以单独和独立地控制。

公开(公告)号：US06988932B2

公开(公告)日：2006-01-24

申请号：US10788926

申请日：2004-02-25

Applicant: Jalal Ashjaee ,  Homayoun Talieh ,  Bulent Basol ,  Konstantin Volodarsky

Inventor： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent Basol ,  Konstantin Volodarsky

IPC: B24B1/00

CPC classification number: B24B37/30 ,  C25D17/001 ,  C25D17/06 ,  H01L21/6704 ,  H01L21/6715 ,  H01L21/6838

Abstract: The present invention provides a wafer carrier that includes an opening, which in one embodiment is a plurality of holes, disposed along the periphery of the wafer carrier. A gas emitted through the holes onto a peripheral back edge of the wafer assists in preventing the processing liquids and contaminants resulting therefrom from reaching the inner region of the base and the backside inner region of the wafer. In another embodiment, a plurality of concentric sealing members are used to prove a better seal, and the outer seal is preferably independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier.

Abstract translation: 本发明提供了一种晶片载体，其包括沿着晶片载体的周边设置的开口，其在一个实施例中是多个孔。 通过孔发射到晶片的外围后缘上的气体有助于防止由此产生的处理液体和污染物到达晶片的底部和内侧区域的内部区域。 在另一个实施例中，使用多个同心密封构件来证明更好的密封，并且外部密封件优选地是独立地可移动的，以允许当晶片仍然附接到晶片载体时清洁晶片的周边背面而发生。