公开(公告)号：US20180139872A1

公开(公告)日：2018-05-17

申请号：US15869961

申请日：2018-01-12

Applicant: Laird Technologies, Inc.

Inventor： John Song ,  Gerald R. English ,  Mohammadali Khorrami ,  Paul Francis Dixon

IPC: H05K9/00

CPC classification number: H05K9/003 ,  H05K9/0026 ,  H05K9/0043

Abstract: According to various aspects, exemplary embodiments are disclosed of soft and/or flexible electromagnetic interference (EMI) shields. In an exemplary embodiment, a shield is suitable for use in providing EMI shielding for one or more components on a substrate. The shield generally includes one or more contacts configured for installation on the substrate and an electrically-conductive cover configured for installation on the contact(s).