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    Circuit assemblies and related methods
    1.
    发明授权
    Circuit assemblies and related methods 有权

    公开(公告)号：US10368432B2

    公开(公告)日：2019-07-30

    申请号：US16003626

    申请日：2018-06-08

    Applicant: Laird Technologies, Inc.

    Inventor： John Song ,  George William Rhyne

    IPC: H05K9/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K1/14

    Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive material is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.

    FREQUENCY SELECTIVE STRUCTURES FOR EMI MITIGATION
    5.
    发明申请
    FREQUENCY SELECTIVE STRUCTURES FOR EMI MITIGATION 有权
    用于EMI抑制的频率选择结构

    公开(公告)号：US20150342031A1

    公开(公告)日：2015-11-26

    申请号：US14814008

    申请日：2015-07-30

    Applicant: Laird Technologies, Inc.

    Inventor： John Song ,  Paul Francis Dixon

    IPC: H05K1/02

    CPC classification number: H05K1/0224 ,  H01L23/552 ,  H01L2924/0002 ,  H01Q15/0026 ,  H01Q17/00 ,  H05K1/0243 ,  H05K2201/09681 ,  Y10T29/49002 ,  Y10T29/49897 ,  H01L2924/00

    Abstract: According to various aspects, exemplary embodiments include one or more frequency selective structures (e.g., two-dimensional or three-dimensional frequency selective structure or surface, etc.), which may be used for shielding or mitigating EMI within open or closed structures. Also disclosed are methods of using one or more frequency selective structures for shielding or mitigating electromagnetic interface (EMI) within open or closed structures.

    Abstract translation: 根据各个方面，示例性实施例包括一个或多个频率选择结构（例如，二维或三维频率选择结构或表面等），其可用于屏蔽或减轻开放或闭合结构内的EMI。 还公开了使用一个或多个频率选择结构来屏蔽或减轻开放或封闭结构内的电磁接口（EMI）的方法。

    Thermal management and/or EMI mitigation materials including coated fillers
    9.
    发明授权
    Thermal management and/or EMI mitigation materials including coated fillers 有权

    公开(公告)号：US11411263B2

    公开(公告)日：2022-08-09

    申请号：US16811684

    申请日：2020-03-06

    Applicant: Laird Technologies, Inc.

    Inventor： Jason L. Strader ,  John Song

    IPC: H01M10/653 ,  C04B14/06 ,  H05K9/00 ,  H01M50/116 ,  H01M50/124 ,  H01M50/20

    Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.

    Circuit assemblies and related methods
    10.
    发明授权
    Circuit assemblies and related methods 有权

    公开(公告)号：US09999122B2

    公开(公告)日：2018-06-12

    申请号：US15783191

    申请日：2017-10-13

    Applicant: Laird Technologies, Inc.

    Inventor： John Song ,  George William Rhyne

    IPC: H05K9/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K1/14

    CPC classification number: H05K1/0216 ,  H05K1/0296 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K9/0024 ,  H05K2201/0183 ,  H05K2201/0715 ,  H05K2201/0999 ,  H05K2201/10371

    Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.

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