公开(公告)号：MY131467A

公开(公告)日：2007-08-30

申请号：MYPI20023474

申请日：2002-09-18

Applicant: LEGACY ELECTRONICS INC

Inventor： KLEDZIK KENNETH J

IPC: H05K3/30

Abstract: A METHOD AND APPARATUS FOR FABRICATING A THREE DIMENSIONAL ARRAY OF SEMICONDUCTOR CHIPS IS DISCLOSED. THE METHOD USES A MULTIPLE STEP FABRICATION PROCESS THAT AUTOMATES THE SURFACE MOUNTING OF SEMICONDUCTOR CHIPS WITH UNIQUE CHIP CARRIERS (21) TO ACHIEVE THE THREE DIMENSIONAL ARRAY OF CHIPS. THE METHOD INCLUDES A STEP OF DEPOSITING SOLDER ON A MULTITUDE OF CHIP CARRIERS AT ONE TIME, PLACING THE CHIP CARRIERS WITH CHIPS ON A PRINTED CIRCUIT BOARD (65) AND THEN RUNNING THE BOARD WITH CHIPS AND CARRIERS ARRANGED IN A THREE DIMENSIONAL ARRAY THROUGH A SINGLE REFLOW OVEN (87) TO COMPLETE A SINGLE REFLOW PROCESS TO PERMANENTLY CONNECT ALL OF THE COMPONENTS. THE APPARATUS INCLUDES A UNIQUE CHIP CARRIER PALLET (23) AND PRINT FIXTURE PEDESTAL (31) THAT WORK IN COMBINATION TO POSITION THE CHIP CARRIERS FOR THE AUTOMATIC DEPOSITION OF SOLDER ON A MULTITUDE OF CARRIERS AT ONCE AND THEN POSITION THEM FOR ADDITION TO THE CIRCUIT BOARD.(FIG 6)