公开(公告)号：US20240429622A1

公开(公告)日：2024-12-26

申请号：US18660877

申请日：2024-05-10

Applicant: LG ELECTRONICS INC.

Inventor： Yusuhk SUH ,  Dongik LEE ,  Seungmin WOO

IPC: H01Q21/06 ,  H01Q1/48 ,  H01Q9/04

Abstract: An antenna module includes a substrate having a first surface, a second surface, and a periphery between the first and second surfaces, a first array antenna disposed on the first surface of the substrate and forming a beam pattern toward a front area, a second array antenna disposed on a first part of the periphery of the substrate and forming a beam pattern toward a bottom area, and third and fourth array antennas disposed on second and third parts of the periphery of the substrate and forming beam patterns toward side areas.

公开(公告)号：US20230246326A1

公开(公告)日：2023-08-03

申请号：US18002957

申请日：2020-07-22

Applicant: LG ELECTRONICS INC.

Inventor： Seungmin WOO ,  Yusuhk SUH ,  Dongik LEE

IPC: H01Q1/24 ,  H01Q1/48 ,  H01Q9/04 ,  H01Q3/36 ,  H01Q9/28

CPC classification number: H01Q1/243 ,  H01Q1/48 ,  H01Q9/0407 ,  H01Q3/36 ,  H01Q9/28

Abstract: Provided is an electronic device having a multilayer substrate according to an embodiment. The electronic device may include a multilayer substrate on which an antenna is disposed and which includes a front layer, a back layer, a plurality of middle layers, and a plurality of ground layers. The antenna may include a lower patch that is disposed on a layer different from an upper ground among the plurality of ground layers and is electrically connected to the upper ground at a plurality of offset points; and an upper patch disposed spaced apart from the lower patch by a predetermined distance.

公开(公告)号：US20230163802A1

公开(公告)日：2023-05-25

申请号：US17922969

申请日：2021-07-20

Applicant: LG ELECTRONICS INC.

Inventor： Seungmin WOO ,  Yusuhk SUH ,  Dongik LEE

IPC: H04B1/40 ,  H01Q1/22 ,  H01Q9/04 ,  H01P3/08

CPC classification number: H04B1/40 ,  H01Q1/2291 ,  H01Q9/045 ,  H01P3/081

Abstract: Provided is an electronic device having an antenna module according to one embodiment. The electronic device comprises: a transceiver circuit disposed in the antenna module composed of a multi-layer substrate; a first transmission line disposed on the first layer of the antenna module and configured to be electrically connected to the transceiver circuit; a second transmission line disposed on the second layer of the antenna module and configured to be electrically connected to the antenna; and a vertical via configured to vertically connect the first transmission line and the second transmission line, wherein at least one of the first and second transmission lines connected to the vertical via has an impedance converter.

公开(公告)号：US20180091186A1

公开(公告)日：2018-03-29

申请号：US15710757

申请日：2017-09-20

Applicant: LG ELECTRONICS INC.

Inventor： Suhwan LIM ,  Jaehyuk JANG ,  Dongik LEE ,  Sangwook LEE

IPC: H04B1/525 ,  H04L5/14 ,  H04L27/26 ,  H04L27/00

CPC classification number: H04B1/525 ,  H04B1/005 ,  H04L5/001 ,  H04L5/0037 ,  H04L5/0066 ,  H04L5/1461 ,  H04L27/0006 ,  H04L27/2646 ,  H04W72/0453

Abstract: There is provided a method for transmitting/receiving a signal in carrier aggregation. The method may comprise: transmitting an uplink signal by using two uplink carriers when three downlink carriers and two uplink carriers are configured to be aggregated. The three downlink carriers include three operating bands among evolved universal terrestrial radio access (E-UTRA) operating bands 1, 2, 3, 5, 12, 30 and 40 and the two uplink carrier includes two operating bands thereamong. The method may comprise: receiving a downlink signal through all of three downlink carriers. Here, a predetermined maximum sensitivity degradation (MSD) is applied to receiving reference sensitivity of the downlink signal, thereby successfully receiving the signal.

公开(公告)号：US20180076945A1

公开(公告)日：2018-03-15

申请号：US15812169

申请日：2017-11-14

Applicant: LG ELECTRONICS INC.

Inventor： Suhwan LIM ,  Sangwook LEE ,  Jinyup HWANG ,  Dongik LEE ,  Manyoung JUNG ,  Yoonoh YANG ,  Seungpyo NOH

IPC: H04L5/00 ,  H04W72/04 ,  H04W52/36 ,  H04J11/00 ,  H04L27/26 ,  H04W74/00 ,  H04W52/24 ,  H04L5/14 ,  H04W52/14

CPC classification number: H04L5/0066 ,  H04J11/003 ,  H04L5/0007 ,  H04L5/001 ,  H04L5/0053 ,  H04L5/14 ,  H04L27/26 ,  H04W52/146 ,  H04W52/24 ,  H04W52/367 ,  H04W72/0413 ,  H04W72/0446 ,  H04W74/004

Abstract: A method for limiting a spurious emission, the method performed by a user equipment (UE) and includes configuring a radio frequency (RF) unit to use bands 1 and 5 for a carrier aggregation; and determining at least one band to be protected, if another UE using at least one of bands 1, 3, 5, 7, 8, 38, 40, and 42 needs to be protected, controlling the RF unit to limit a maximum level of spurious emission to −50 dBm, and if another UE using a band 26 needs to be protected, controlling the RF unit of the UE to limit the maximum level of the spurious emission to −27 dBm.

公开(公告)号：US20180049207A1

公开(公告)日：2018-02-15

申请号：US15671806

申请日：2017-08-08

Applicant: LG ELECTRONICS INC.

Inventor： Suhwan LIM ,  Sangwook LEE ,  Dongik LEE ,  Jongkil SHIN ,  Yoonoh YANG ,  Manyoung JUNG ,  Jinyup HWANG

IPC: H04W72/04 ,  H04W52/36

CPC classification number: H04W72/0473 ,  H04B17/102 ,  H04W24/02 ,  H04W52/367 ,  H04W72/02 ,  H04W72/0413 ,  H04W72/0453

Abstract: There is provided a method for determining a transmission power of a vehicle to everything (V2X) signal. The method is performed by a V2X terminal and comprises determining the transmission power of the V2X signal. The transmission power is determined based on antenna gain and a conducted power. The conducted power is determined to not exceed a specific maximum power class, The antenna gain is at most 6 dBi, and the specific maximum power class specify at most 26 dBm.

公开(公告)号：US20250070450A1

公开(公告)日：2025-02-27

申请号：US18755500

申请日：2024-06-26

Applicant: LG ELECTRONICS INC.

Inventor： Yusuhk SUH ,  Dongik LEE ,  Seungmin WOO

IPC: H01Q1/22 ,  H01Q1/48 ,  H01Q1/50 ,  H01Q9/04 ,  H01Q21/24

Abstract: An antenna module implemented as a multi-layered package includes: a printed circuit board (PCB) having a plurality of layers; a radio frequency integrated circuit (RFIC) disposed on a first surface among outermost surfaces of the PCB; a first array antenna disposed on a second surface, perpendicular to the first surface, among the outermost surfaces of the PCB; a second array antenna disposed on a third surface, perpendicular to the first and second surfaces, among the outermost surfaces of the PCB; and a third array antenna disposed on a fourth surface, perpendicular to the second and third surfaces, among the outermost surfaces of the PCB. First to third signal lines connected to the first to third array antennas form first to third coplanar waveguide structures in which first to third ground regions are formed, respectively.

公开(公告)号：US20250070447A1

公开(公告)日：2025-02-27

申请号：US18737181

申请日：2024-06-07

Applicant: LG ELECTRONICS INC.

Inventor： Yusuhk SUH ,  Dongik LEE ,  Seungmin WOO

IPC: H01Q1/22 ,  H01Q1/48 ,  H01Q9/04 ,  H01Q21/06 ,  H05K1/02

Abstract: An antenna module includes: a printed circuit board (PCB) having a plurality of layers; an array antenna portion having a plurality of antenna elements disposed on the PCB; and a plurality of signal connection lines configured to electrically connect a radio frequency integrated circuit (RFIC) chip to the array antenna portion. Each of the plurality of antenna elements may have a structure with two patch antennas, and first and second groups of second patch antennas disposed inside the PCB may be located in first and second regions with respect to a center line of an inner layer where the second patch antennas are disposed.

公开(公告)号：US20250007146A1

公开(公告)日：2025-01-02

申请号：US18734976

申请日：2024-06-05

Applicant: LG ELECTRONICS INC.

Inventor： Yusuhk SUH ,  Dongik LEE ,  Seungmin WOO

IPC: H01Q1/22 ,  H01Q1/48 ,  H01Q9/04 ,  H01Q21/24

Abstract: An antenna module implemented in a multi-layered antenna package includes an RFIC; a first dielectric layer; a first coplanar waveguide layer disposed on a top of the first dielectric layer and configured to receive RF signals transmitted by an interface layer of the RFIC; a first antenna portion disposed on the first coplanar waveguide layer and configured to radiate signals transmitted from the first coplanar waveguide layer; a second coplanar waveguide layer disposed on a top of the third dielectric layer and configured to receive RF signals transmitted by the interface layer of the RFIC; and a second antenna portion disposed on the second coplanar waveguide layer to radiate signals transmitted from the second coplanar waveguide layer.

公开(公告)号：US20240291149A1

公开(公告)日：2024-08-29

申请号：US18564912

申请日：2021-05-31

Applicant: LG ELECTRONICS INC.

Inventor： Seungmin WOO ,  Yusuhk SUH ,  Dongik LEE

IPC: H01Q5/335 ,  H01Q9/40 ,  H01Q21/06 ,  H05K3/46

CPC classification number: H01Q5/335 ,  H01Q9/40 ,  H01Q21/06 ,  H05K3/4623

Abstract: Provided is an electronic device having an antenna. The electronic device comprises: a radiator configured by stacking metal patterns on different layers of a multi-layer structure; and an antenna module including a feeding unit disposed on a specific layer of the radiator and having a feeding line configured to be connected to the radiator, wherein the radiator includes a first pad connected to the feeding line and a second pad disposed on the first pad, and the first pad and the second pad are connected to each other by a first connection line and a second connection line.